• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권8호
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• pp.438-444
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• 2000

We report the effects of etch process parameters on the ohmic contact formation in the plasma etching of GaN. Planar inductively coupled plasma system with $CH_4/H_2/Ar$gas chemistry has been used as etch reactor. The contact resistance and the specific contact resistance have been investigated using transfer length method as a function of RF bias power and %Ar gas concentration in total flow rate. AES(Auger electron spectroscopy) analysis revealed that the etched GaN has nonstoichiometric Ga rich surface and was contaminated by carbon and oxygen. Especially large amount of carbon was detected at the sample etched for high bias power (or voltage) condition, where severe degradation of contact resistance was occurred. We achieved the low ohmic contact of $2.4{\times}10^{-3} {\Omega}cm^2$ specific contact resistance at the input power 400 W, RF bias power 150 W, and working pressure 10mTorr with 10 sccm $CH_4$, 15 sccm H2, 5 sccm Ar gas composition.

• Journal of Welding and Joining
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• 제7권4호
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• pp.12-21
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• 1989

Laser beam welding parameters have experimentally investigated, using a continuous wave 3kW $CO_2$ laser with the various travel speeds, beam mode and laser beam power in low carbon steels. An optimum position of focus and the effect of shielding gas on penetration depth with varying the flow range of 0.5 to 5.1m/min have been combined to investigate the effect of laser power and travel speed on penetration depth and bead width. It is found that the optimum position of focus in 3kW class laser is 0.5 to 1.5mm below the surface of the material. The flow rate of shielding gas affects the penetration depth and He is more effective than Ar. The penetration depth in laser welds of low carbon steels is between two and four times of the bead width. Laser beam welding of butt joints in 2mm thick carbon steel has been carried out to establish a weldability lobe. The lobe indicating acceptable welding conditions is introduced.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.113.1-113.1
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• 2010

IGCC(Integrated Coal Gasification and Combined Cycle) plants can be among the most advanced and environmental systems for electric energy generation from various feed stocks and is becoming more and more popular in new power generation fields. In this work, the performance of IGCC plants employing Shell gasification technology and a GE 7FB gas turbine engine was simulated using IPSEpro open-equation modeling environment for different operating conditions. Performance analyses and comparisons of all operating cases were performed based on the design cases. Discussions were focused on gas composition, syngas production rate and overall performance. The validation of key steady-state performance values calculated from the process models were compared with values from the provided heat and material balances for Shell coal gasification technology. The key values included in the validation included the inlet coal flow rate; the mass flow rate, heating value, and composition of major gas species (CO, H2, CH4, H2O, CO2, H2S, N2, Ar) for the syngas exiting the gasifier island; and the HP and MP steam flows exiting the gasifier island.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.74-74
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• 2009

Titanium nitride has been used as hardmask for semiconductor process, capacitor of MIM type and diffusion barrier of DRAM, due to it's low resistivity, thermodynamic stability and diffusion coefficient. Characteristics of the TiN film are high intensity and chemical stability. The TiN film also has compatibility with high-k material. This study is an experimental test for better condition of TiN film etching process. The etch rate of TiN film was investigated about etching in $BCl_3/Ar/O_2$ plasma using the inductively coupled plasma (ICP) etching system. The base condition were 4 sccm $BCl_3$ /16 sccm Ar mixed gas and 500 W the RF power, -50 V the DC bias voltage, 10 mTorr the chamber pressure and $40\;^{\circ}C$ the substrate temperature. We added $O_2$ gas to give affect etch rate because $O_2$ reacts with photoresist easily. We had changed $O_2$ gas flow rate from 2 sccm to 8 sccm, the RF power from 500 W to 800 W, the DC bias voltage from -50 V to -200 V, the chamber pressure from 5 mTorr to 20 mTorr and the substrate temperature from $20\;^{\circ}C$ to $80\;^{\circ}C$.

• 폴리머
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• 제29권6호
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• pp.581-587
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• 2005

상업용 폴리우레탄(PU) 필름의 표면 개질 목적으로 대기압에서 플라스마를 발생시키기 위한 dielectric barrier discharge(DBD) 구조의 평판형 플라스마 반응기 내에서 이온화된 아르곤 플라스마를 사용하였다. 플라스마 처리 공정변수인 처리 시간, 처리 RF-power, 아르곤 가스 유속을 변화시켜가며 접촉각을 측정하여 젖음성과 표면 자유 에너지 변화를 알아보았고, 필름 표면 위에 과산화물을 최대로 도입시키기 위해 플라스마 처리 공정변수를 최적화하였다. 대기압 플라스마 처리 시간 70초, RF-power 120 W, 아르곤 가스유속 6 liter per minute(LPM)에서 가장 높은 젖음성과 표면 자유 에너지 값을 보였고, 1,1-diphenyl-2-picrylhydrazy(DPPH) 법을 사용하여 PU 필름의 표면에 생성된 과산화물의 농도를 정량한 결과, 처리 시간 30초, RF-power 80 W, 아르곤 가스유속 6 LPM의 플라스마 처리 조건에서 최대 2.1 nmol/$\cm^{2}$의 과산화물이 생성되었다.

• 반도체디스플레이기술학회지
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• 제10권2호
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• pp.39-44
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• 2011

In this study, we have investigated the structural and electrical characteristics of IZO thin films deposited on flexible substrate for the OLED (organic light emitting diodes) devices. For this purpose, PES was used for flexible substrate and IZO thin films were deposited by RF magnetron sputtering under oxygen ambient gases (Ar, $Ar+O_2$) at room temperature. In order to investigate the influences of the oxygen, the flow rate of oxygen in argon mixing gas has been changed from 0.1sccm to 0.5sccm. All the samples show amorphous structure regardless of flow rate. The electrical resistivity of IZO films increased with increasing flow rate of $O_2$ under $Ar+O_2$. All the films showed the average transmittance over 85% in the visible range. The OLED device was fabricated with different IZO electrodes made by configuration of IZO/a-NPD/DPVB/$Alq_3$/LiF/Al to elucidate the performance of IZO substrate. OLED devices with the amorphous-IZO (a-IZO) anode film show better current density-voltage-luminance characteristics than that of OLED devices with the commercial crystalline-ITO (c-ITO) anode film. It can be explained that very flat surface roughness and high work function of a-IZO anode film lead to more efficient hole injection by reduction of interface barrier height between anode and organic layers. This suggests that a-IZO film is a promising anode materials substituting conventional c-ITO anode in OLED devices.

• 반도체디스플레이기술학회지
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• 제9권3호
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• pp.53-58
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• 2010

In this study, we have investigated the effect of the ambient gases on the characteristics of IZO thin films for the OLED (organic light emitting diodes) devices. For this purpose, IZO thin films were deposited by RF magnetron sputtering under various ambient gases (Ar, $Ar+O_2$ and $Ar+H_2$) at $150^{\circ}C$. In order to investigate the influences of the oxygen and hydrogen, the flow rate of oxygen and hydrogen in argon mixing gas has been changed from 0.1sccm to 0.5sccm, respectively. All the samples show amorphous structure regardless of ambient gases. The electrical resistivity of IZO film increased with increasing flow rate of $O_2$ under $Ar+O_2$ while under $Ar+H_2$ atmosphere the electrical resistivity showed minimum value near 0.5sccm of $H_2$. All the films showed the average transmittance over 85% in the visible range. The OLED device was fabricated with different IZO substrates made by configuration of IZO/${\alpha}$-NPD/DPVB/$Alq_3$/LiF/Al to elucidate the performance of IZO substrate. OLED devices with the amorphous-IZO (a-IZO) anode film show better current densityvoltage-luminance characteristics than that of OLED devices with the commercial crystalline-ITO (c-ITO) anode film. It can be explained that very flat surface roughness and high work function of a-IZO anode film lead to more efficient hole injection by reduction of interface barrier height between anode and organic layers. This suggests that a-IZO film is a promising anode materials substituting conventional c-ITO anode in OLED devices.

• 한국진공학회지
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• 제21권4호
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• pp.212-218
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• 2012

RF 마그네트론 스퍼터에 의해 만들어진 AZO 박막을 기판의 화학적 특성에 따른 광학적 특성에 대하여 조사하였다. 기판은ICP-CVD방법으로 제작된 SiOC 박막으로 화학적 특성의 변화를 관찰하기 위해서 산소와 아르곤(DMDMOS)가스의 유량비를 다르게 하여 증착하였다. 아르곤의 유량이 증가할수록 Si-O 결합이 증가하였으며, 비정질구조가 증가되었다. 비정질도가 높은 SiOC 박막 위에 성장된 AZO 박막의 거칠기는 감소하였으며, 표면의 평탄도가 개선되었다. 더불어 비정질도가 높은 SiOC박막 위에 성장된 AZO 박막에서 자외선 영역의 방사 강도가 제일 높았다.

• 공업화학
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• 제25권2호
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• pp.204-208
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• 2014

본 연구는 1차원 반응기 모델을 이용한 수치 시뮬레이션을 통해 수소투과량, 수소선택도, 사용된 촉매의 양, 급송흐름에서의 $H_2O/CO$ 조성비 및 Ar sweep gas가 막반응기(membrane reactor)에서의 수성가스전이반응의 성능에 미치는 영향을 분석하였다. 막반응기에서 평형상태보다 향상된 수소수율을 얻기 위해선 적어도 100 이상의 수소선택도를 가져야 함이 관찰되었으며, 수소투과량이 계속 증가될 경우에는 수소수율의 증가폭이 점차 감소됨이 보였다. 낮은 수소투과량의 경우에는 촉매량이 증가할수록 초기엔 증가된 CO 전환율을 보이다가 점차 그 증가폭이 감소되었으며, 높은 수소투과량의 경우에는 촉매의 양과 무관하게 높은 CO 전환율이 관찰되었다. 급송흐름에서의 $H_2O/CO$ 조성비가 1.5 이상인 경우엔 수소투과량이 막반응기에서의 CO 전환율에 미치는 영향이 미미하였고, 막반응기에서 평형상태보다 향상된 CO 전환율을 얻기 위해선 적어도 $6.7{\times}10^{-6}mol\;s^{-1}$ 의 Ar 몰유속이 필요함이 밝혀졌다.

• 동굴
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• 제82호
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• pp.1-4
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• 2007

In this paper, the etching of Au films using photoresist masks on Si substrates was investigated using a capacitively coupled plasma etch reactor. The advantages of plasma etch techniques over current methods for Au metalization include the ability to simplify the metalization process flow with respect to resist lift-off schemes, and the ability to cleanly remove etched material without sidewall redeposition, as is seen in ion milling. The etch properties were measured for different gas mixing ratios of CF4/Ar, and chamber pressures while the other conditions were fixed. According to statistical design of experiment (DOE), etching process of Au films was characterized and also 20 samples were fabricated followed by measuring etch rate, selectivity and etch profile. There is a chemical reaction between CF4 and Au. Au- F is hard to remove from the surface because of its high melting point. The etching products can be sputtered by Ar ion bombardment.