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Surface Modification of Polyurethane Film Using Atmospheric Pressure Plasma  

Yang In-Young (Department of Chemical Engineering, Chungnam National University)
Myung Sung-Woon (Department of Chemical Engineering, Chungnam National University)
Choi Ho-Suk (Department of Chemical Engineering, Chungnam National University)
Kim In-Ho (Department of Chemical Engineering, Chungnam National University)
Publication Information
Polymer(Korea) / v.29, no.6, 2005 , pp. 581-587 More about this Journal
Abstract
Commercial polyurethane film (PU) was modified with Ar plasma ionized in dielectric barrier discharge (DBD) plate-type reactor under atmospheric pressure. We measured the change of the contact angle and the surface fee energy with respect to the plasma treatment conditions such as treatment time, RF-power, and Ar gas flow rate. We also optimized the plasma treatment conditions to maximize the surface peroxide concentration. At the plasma treatment time of 70 sec, the power of 120 W and the Ar gas flow rate of 5 liter per minute (LPM), the best wettability and the highest surface fee energy were obtained. The 1,1 diphenyl-2-picrylhydrazyl (DPPH) method confirmed that the surface peroxide concentration was about 2.1 nmol/$\cm^{2}$ at 80 W, 30 sec, 6 LPM.
Keywords
atmospheric pressure plasma; polyurethane film; surface free energy; DPPH method; peroxide;
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