• Korean Journal of Materials Research
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• v.28 no.3
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• pp.159-165
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• 2018

In order to increase the efficiency of the sputtering method widely used in thin film fabrication, a dc sputtering apparatus which supplies both high frequency and magnetic field from the outside was fabricated, and cobalt thin film was fabricated using this apparatus. The apparatus can independently control the applied voltage, the target-substrate distance, and the target current, which are important parameters in the sputtering method, so that a stable glow discharge is obtained even at a low gas pressure of $10^{-3}$ Torr. The fabrication conditions using the sputtering method were mainly performed in $Ar+O_2$ mixed gas containing about 0.6 % oxygen gas under various Ar gas pressures of 1 to 30 mTorr. The microstructure of Co thin films deposited using this apparatus was examined by electron diffraction pattern and X-ray techniques. The magnetic properties were investigated by measuring the magnetization curves. The microstructure and magnetic properties of Co thin films depend on the discharge gas pressure. The thin film fabricated at high gas pressure showed a columnar structure containing a large amount of the third phase in the boundary region and the thin film formed at low gas pressure showed little or no columnar structure. The coercivity in the plane was slightly larger than that in the latter case.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.60-65
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• 2013

Ar, $N_2$, and He are the conventional kind of shield gas that are used for laser welding. Many researches on the impact of laser welding shield gas have been done, and it is on going until now. However, there are few studies that analyze the changes and differences of the plasma emission signal. Therefore, in this study, we evaluated the change in the penetration characteristics according to the type of shield gas during fiber laser welding impacts to the plasma signal. As a result, if was checked that the difference in molecular weight of Ar, $N_2$, and He affects to the amount of spatter, and also found that the measured plasma radiation signal changes similar to the order of the molecular weight of the gases. Especially, clear change on the signal intensity per each shield gas was measured through RMS, and found that the shield gas was nothing to do with the FFT analyzed result.

• Transactions of Materials Processing
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• v.22 no.6
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• pp.334-339
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• 2013

Direct Laser Melting is a prototyping process whereby a 3-D part is built layer wise by melting the metal powder with laser scanning. This process is strongly influenced by the shielding gas and the laser operating parameters such as laser power, scan rate, layering thickness, and rescanning. The shielding gas is especially important in affecting the microstructure and mechanical properties. In the current study, fabrication experiments were conducted in order to analyze the effect of shielding gas on the forming characteristics of direct laser melting. Cylindrical parts were produced from a Fe-Ni-Cr powder with a 200W fiber laser. Surface quality, porosity and hardness as a function of the layering thickness and shield gas were evaluated. By decreasing the layering thickness, the surface quality improved and porosity decreased. The selection of which shield gas, Ar or $N_2$, to obtain better surface quality, lower porosity, and higher hardness was examined. The formability and mechanical properties with a $N_2$ atmosphere are better than those parts formed under an Ar atmosphere.

• Transactions on Electrical and Electronic Materials
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• v.18 no.2
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• pp.74-77
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• 2017

In this work, we investigated the etching characteristics of TaNO thin films and the selectivity of TaNO to $SiO_2$ in an $O_2$/CF4/Ar inductively coupled plasma (ICP) system. The maximum etch rate of TaNO thin film was 297.1 nm/min at a gas mixing ratio of O2/CF4/Ar (6:16:4 sccm). At the same time, the etch rate was measured as a function of the etching parameters, such as the RF power, DC-bias voltage, and process pressure. X-ray photoelectron spectroscopy analysis showed the efficient destruction of the oxide bonds by the ion bombardment, as well as the accumulation of low volatile reaction products on the etched surface. Based on these data, the ion-assisted chemical reaction was proposed as the main etch mechanism for the $CF_4$-containing plasmas.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1540-1541
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• 2011

We calculated the electron transport coefficients in $H_2$+Ar gas calculated E/N values 0.01 ~ 1 Td by the Boltzmann equation method. This study gained the values of the electron swarm parameters such as the electron drift velocity and the transverse diffusion coefficients for $H_2$+Ar gas at a range of E/N. The transport coefficient W and Dt/u have been calculated in mixtures of 0.5% and 4% hydrogen in argon. All values were made at 293 K.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.3
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• pp.133-136
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• 2004

Low-Pressure inductively coupled RF discharge sources have important industrial applications mainly because they can provide a high-density electrodeless plasma source with low ion energy and low power loss. In an inductive discharge, the RF power is coupled to the plasma by an electromagnetic interaction with the current flowing in a coil. In this paper, the experiments have been focussed on the electric characteristic and carried out using a single Langmuir probe. The internal electric characteristics of inductively coupled Ar RF discharge at 13.56(MHz) have been measured over a wide range of power at gas pressure ranging from 1∼70(mTorr).

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.1001-1003
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• 1998

In this paper, $Ar^+$ ion laser etching process of single/poly crystalline silicon with $CCl_{2}F_{2}$ gas is studied for MEMS applications. To investigate the effects of process parameters, laser power, gas pressure, scanning speed were varied and multiple scanning was carried out to obtain high aspect ratio. In addition, scanning width was varied to observe the trench profile etched in repeating scanning cycle. From the etching of $2.6{\mu}m$ thick polycrystalline Si deposited on insulator, trench with flat bottom and vertical side wall was obtained and it is possible to apply this results for MEMS applications.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.21-23
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• 2005

The electron transport coefficients, the electron drift velocity W, the longitudinal diffusion coefficient $ND_L$ in $C_{3}F_{8}-Ar$ mixture gases were measured by Double shutter drift tube and calculated by multi-term approximation of the Boltzmann equation over the wide E/N range from 0.03 to 100 Td. And an inelastic collision cross sections for $C_{3}F_{8}$ molecular gas were redetermined for quantitative characteristic analysis.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.107-107
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• 2009

본 연구에서는 중성빔을 이용한 Atomic Layer Etching(ALET) system을 이용하여 $ZrO_2$의 atomic layer etching mechanism에 대하여 연구하였다. Ar neutral beam irradiation dose와 $BCl_3$ gas pressure의 변화에 따라 $ZrO_2$ etch rate와 RMS roughness를 관찰했을 때, Ar neutral beam irradiation dose이 $1.485{\times}10^{16}atoms/cm^2{\bullet}cycle$ 이상이고 $BCl_3$ gas pressure가 0.15mTorr 이상 일 때 $ZrO_2$ etch rate은 $1.07\;{\AA}/cycle$의 일정한 값에서 유지됨을 확인하였다. 그리고 ALET와 ICP Etcher을 통해 $ZnO_2$를 각각 식각하여 physically or chemically damage를 비교한 결과, ALET가 기존의 ICP Etcher system보다 $ZrO_2$ 식각공정에 대해 적은 damage를 받는 것을 ARXPS를 통해 관찰 하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.131-135
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• 2003

Zinc Oxide(ZnO) thin films on Si (100) substrate were deposited by RF magnetron sputter with changing sputtering conditions such as argon/oxygen gas ratios, RF power, and substrate temperature, chamber pressure and target-substrate distance. To analyze a crystallographic properties of the films, $\theta/2\theta$ mode X-ray diffraction, SEM, and AFM analyses. C-axis preferred orientation, resistivity, and surface roughness highly depended on $Ar/O_2$ gas ratios. The resistivity of ZnO thin films rapidly increased with increasing oxygen ratio and the resistivity value of $9{\times}10^7{\Omega}cm$ was obtained at a working pressure of 10 mTorr with $Ar/O_2$=50/50. The surface roughness was also improved with increasing oxygen ratio and the ZnO films deposited with $Ar/O_2$=50/50 showed the excellent roughness value of $28.7{\AA}$.