• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.915-918
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• 2010

In this work, the etching characteristics of ZnO thin films were investigated using an inductively coupled plasma(ICP) of HBr/Ar/$CHF_3$ gas mixtures. The plasma characteristics were analyzed by a quadrupole mass spectrometer (QMS) and double langmuir probe (DLP). The surface reaction of the ZnO thin films was investigated using X-ray photoelectron spectroscopy (XPS). The etch rate of ZnO was measured as a function of the $CHF_3$ mixing ratio in the range of 0-15% in an HBr:Ar=5:2 plasma at a fixed gas pressure (6mTorr), input power (700 W), bias power (200 W) and total gas flow rate(50sccm). The etch rate of the ZnO films decreased with increasing $CHF_3$ fraction due to the etch-blocking polymer layer formation.

• Journal of the Korean Society of Safety
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• v.9 no.3
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• pp.53-59
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• 1994

Hydrogen(H$_2$) is used in the semiconductor industries, and some oxidizing gases such as fluoride(F$_2$) and chlorine trifluoride(CIF$_3$) are also used. As F$_2$and CIF$_3$are highly oxidizing gases, it were supposed to react vigorously with H$_2$. In this study, the flammability limit of F$_2$/$H_2$/Ar and CIF$_3$/$H_2$/Ar mixtures were investigated experimentally. As a result, it was found that the diluted F$_2$gas could be spontaneously ignited as compared to CIF$_3$mixture gas while being mixed with the diluted H$_2$gas. However, CIF$_3$diluted gas was not able to ignite spontaneously except for an electric spark. And the combustion characteristics and reaction kinetics were shown at the different diluted gases by the flammability diagram analyses between the F$_2$/$H_2$/Ar and CIF$_3$/$H_2$/Ar.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.12
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• pp.1051-1056
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• 2008

In this study, the investigations of the TiN etching characteristics were carried out with addition of $Cl_2$ gas in an inductively coupled $BCl_3$-base plasma system. Dry etching of the TiN was studied by varying the etching parameters including $Cl_2$ gas addition ratio, RF power, DC-bias voltage and pressure. The etch rate of TiN thin film was maximum when the $Cl_2$ gas addition flow was 2 sccm with fixed other conditions. As the RF power DC-bias voltage were increased, the etch rate of TiN thin film showed increasing tendency. $BCl_3/Cl_2$/Ar plasmas were characterized by optical emission spectroscopy (OES) analysis. The chemical reaction on the surface of the etched TiN films was investigated with X-ray photoelectron spectroscopy (XPS).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.5
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• pp.560-566
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• 2004

In this paper, the electrical and emission properties of electrodeless fluorescent lamp were discussed using the inductively coupled plasma (ICP) with the variation of argon gas pressure and RF power. The RF output was applied to the antenna in the range of 5∼50 W at 13.56 MHz. The internal plasma voltage of the chamber and the probe current were measured while varying the supply voltage to the Langmuir probe in the range of －100V∼＋100V. When the pressure of argon gas was increased, electric current was decreased. There was a significant electric current increase from 10 to 30 W. Also, when the RF power was increased, electron density was increased. Also, the emission spectrum, Ar- I lins, luminance were investigated. At this time, the input parameter for ICP RF plasma, Ar gas pressure and RF power were applied in the range of 10∼60 mTorr, 10∼300 W, respectively. This implies that this method can be used to find an optimal RF power for efficient light illumination in an electrodeless fluorescent lamp.

• Journal of the Korean Ceramic Society
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• v.32 no.7
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• pp.809-816
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• 1995

Ti1-xAlxN films were successfully deposited on high speed steel and silicon wafer by plasma-assisted chemical vapor deposition using a TiCl4/AlCl3/N2/Ar/H2 gas mixture. Plasma process enabled N2 gas to nitride AlCl3, which is not possible in sense of thermodynamics. XPS analyses revealed that the deposited layer contained Al-N bond as well as Ti-N bond. Ti1-xAlxN films were polycrystalline and had single phase, B1-NaCl structure of TiN. Interplanar distance, d200, of (200) crystal plane of Ti1-xAlxN was, however, decreased with Al content, x. Al incorporation into TiN caused the grain size to be finer and changed strong (200) preferred orientation of TiN to random oriented microstructure. Those microstructural changes with Al addition resulted in the increase of micro-hardness of Ti1-xAlxN film up to 2800Kg/$\textrm{mm}^2$ compared with 1400Kg/$\textrm{mm}^2$ of TiN.

• Journal of the Korean institute of surface engineering
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• v.50 no.2
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• pp.85-90
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• 2017

The carbon steel formed the thick, somewhat porous, loosely adherent iron oxide scale when oxidized at $500-800^{\circ}C$ for 15 h in air. It formed the thicker, more porous, nonadherent scale consisting of FeS plus iron oxides in $Ar/1%SO_2$-mixed gas. It formed the much thicker, more porous, nonadherent scale consisting of FeS plus iron oxides in Ar/0.1% $H_2S$-mixed gas. However, the aluminized carbon steel formed the thin, protective $Al_2O_3$ surface scale even in $Ar/1%SO_2$-, and $Ar/0.1%H_2S$-mixed gas. Aluminizing drastically improved the corrosion resistance in (O, S, H)-containing gas.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.187-190
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• 2004

In this work, we investigated etching characteristics and mechanism of BST thin films using $Cl_2$/Ar, $CF_4/Cl_2$/Ar and $BCl_3/Cl_2$/Ar gas mixtures using inductively coupled plasma (ICP) system. A chemically assisted physical etch of BST was experimentally confirmed by ICP under various gas mixtures. The etch rate of the BST thin films had a maximum value at 20 $BCl_3$ and 10% $CF_4$ gas concentration, and decreased with further addition of $BCl_3$ or $CF_4$ gas, because $BaCl_x$, $SrCl_x$, $BaF_x$ and $SrF_x$ compounds have higher melting and boiling points. The maximum etch rate of the BST thin films was 57nm/min at the 30% $Cl_2(Cl_2+Ar)$. The characteristics of the plasma were analyzed by using OES and Langmuir probe.

• Journal of the Korean institute of surface engineering
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• v.54 no.2
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• pp.43-52
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• 2021

The Ni-based superalloy, Inconel 740, was corroded between 800 and 1100℃ for up to 100 hr in air and Ar-0.2%SO₂ gas in order to study its corrosion behavior in air and sulfur/oxygen environment. It displayed relatively good corrosion resistance in both environment, because its corrosion was primarily dominated by not sulfidation but oxidation especially in Ar-0.2%SO₂ gas. Such was attributed to the thermodynamic stability of oxides of alloying elements when compared to corresponding sulfides. The scales consisted primarily of Cr₂O₃, together with some NiAl₂O₄, MnCr₂O₄, NiCrMnO₄, and rutile-TiO₂. Sulfur from SO₂ gas made scales prone to spallation, and thicker. It also widened the internal corrosion zone when compared to air. The corrosion resistance of IN740 was mainly indebted to the formation of protective Cr₂O₃-rich oxides, and suppression of the sulfide formation.

• Journal of the Korean Ceramic Society
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• v.34 no.3
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• pp.249-256
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• 1997

The effect of process parameter of plasma assisted chemical vapor deposition (PACVD) on the variation of the ratio between cubic boron nitride (c-BN) and hexagonal boron nitride (h-BN) in the film was in-vestigated. The plasma was generated by electric power with the frequency between 100 and 500 KHz. BCl3 and NH3 were used as a boron and nitrogen source respectively and Ar and hydrogen were added as a car-rier gas. Films were composed of h-BN and c-BN and its ratio varied with the magnitude of process parameters, voltage of the electric power, substrate bias voltage, reaction pressure, gas composition, sub-strate temperature. TEM observation showed that h-BN phase was amorphous while crystalline c-BN par-ticle was imbedded in h-BN matrix in the case of c-BN and h-BN mixed film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.1123-1126
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• 2003

In this paper, the emission properties of electrodeless fluorescent lamp were discussed using the inductively coupled plasma. To transmit the electromagnetic energy into the chamber, a RF power of 13.56MHz was applied to the antenna and considering the Ar gas pressure and the RF electric power change, the emission spectrum, Ar- I line, luminance were investigated. At this time the input parameter for ICP RF plama, Ar gas pressure and RF power were applied in the range of $10{\sim}60m$ Torr, $10{\sim}300W$ respectively.