• Mass Spectrometry Letters
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• 제10권1호
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• pp.27-31
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• 2019

In this article, the properties of ${CO_2}^+(CO_2)_n$ clusters in a Paul ion trap have been investigated using mass-selective instability mode which conducted by chosen precursor ions, mainly $Ar^+$ and ${CO_2}^+$ produced by a mixture of Ar and $CO_2$. Exposure of ${CO_2}^+$ ions to $CO_2$ molecules, lead to the formation of ${CO_2}^+(CO_2)_n$ clusters. Here, Ar gas react as a buffer gas and lead to form ${CO_2}^+(CO_2)_n$ cluster by collisional effect.

• 한국결정성장학회지
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• 제12권6호
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• pp.283-287
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• 2002

초고집적 반도체 회로에서 Cu를 배선으로 쓰이기 위한 Cu 금속과 Si 기판사이의 확산방지막으로써 Zr(Si)N 박막을 연구하였다. Zr(Si)N 박막증착은 DC magnetron sputter으로 $Ar/N_2$의 혼합 gas를 사용한 reactive sputtering 방법을 이용하였다. 상온에서 ZrN 박막 증착시 Ar gas와 NE gas 비율이 48 : 2일 때 가장 낮은 비저항값을 가졌으며, 증착시 기판의 온도의 증가에 따라서 비저항값이 낮아졌다. 비저항값이 감소된 ZrN 박막일수록 (002)면의 방향성을 갖는 결정이 성장되었다. ZrN 박막의 Cu 확산방지 특성은 ZrN 박막에 Si을 첨가함으로써 개선될 수 있으며 지나치게 첨가될 경우에는 오히려 확산방지 특성이 감소되었다. 접착력 특성에서는 ZrN에 Si의 함유량이 증가함에 파라 개선되었다. 증착막의 특성은 XRD, 광학 현미경, scretch tester 그리고 $\alpha$-step 등을 사용하여 분석하였다.

• 한국진공학회지
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• 제19권5호
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• pp.341-346
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• 2010

본 논문에서는 반응성 스퍼터링(Reactive Sputtering) 공정으로 $Si_xO_y$ 박막과 $Si_xN_y$ 박막을 4층 구조로 적층하고 400~700 [nm]의 가시광 영역에서 빛의 반사를 줄이기 위한 반사방지 코팅(Anti-Reflection Coating)으로의 응용 가능성을 조사하였다. 스퍼터링 타겟으로 6 [inch] 직경의 Si 단결정을 사용하였고, 반응성 스퍼터링 가스는 $Si_xO_y$ 박막 증착에서 Ar과 $O_2$를, $Si_xN_y$ 박막 증착에서는 Ar과 $N_2$를 사용하였으며, 스퍼터링 파워로는 DC pulse를 사용하였다. 1,900 [W] DC pulse power에서 Ar:$O_2$=70:13 [sccm]의 반응성 스퍼터링으로 2.3 [nm/sec]의 증착률과 1.50의 굴절률을 보이는 $Si_xO_y$ 박막을 제작하였고, Ar:$N_2$=70:15 [sccm]의 반응성 스퍼터링으로 1.8 [nm/sec]의 증착률과 1.94의 굴절률을 보이는 $Si_xN_y$ 박막을 제작하였다. 이 두 종류의 박막을 이용해서 시뮬레이션을 통해 4층 구조의 반사방지 코팅 구조를 설계한 후, 설계결과에 따라 각 박막의 두께를 순차적으로 변화시켜 증착하였다. 4층 구조 $Si_xO_y-Si_xN_y$의 반사도 측정 결과 550 [nm] 대역에서 1.7 [%]의 반사와 400 [nm]와 650 [nm] 영역에서 1 [%]의 반사를 보였으며, 가시광 영역에서 성공적인 "W" 형태의 반사방지 코팅 특성을 보였다.

• 한국재료학회지
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• 제9권5호
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• pp.503-508
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• 1999

We have investigated the physical and diffusion barrier property of Ti-Si-N film for Cu metallization. The ternary compound was deposited by using reactive rf magnetron sputtering of a TiSi$_2$target in an Ar/$N_2$gas mixture. Resistivities of the films were in range of 358$\mu$$\Omega$-cm, to 307941$\mu$$\Omega$-cm, and tended to increase with increasing the $N_2$/Ar flow rate ratio. The crystallization of the Ti-Si-N compound started to occur at 100$0^{\circ}C$ with the phases of TiN and Si$_3$N$_4$identified by using XRD(X-ray Diffractometer). The degree of the crystallization was influenced by the $N_2$/Ar flow ratio. The diffusion barrier property of Ti-Si-N film for Cu metallization was determined by AES, XRD and etch pit by secco etching, revealing the failure temperature of 90$0^{\circ}C$ in 43~45at% of nitrogen content. In addition, the very thin compound (10nm) with 43~45at% nitrogen content remained stable up to $700^{\circ}C$. Furthermore, thermal treatment in vacuum at $600^{\circ}C$ improved the barrier property of the Ti-Si-N film deposited at the $N_2$(Ar+$N_2$) ratio of 0.05. The addition of Ti interlayer between Ti-Si-N films caused the drastic decrease of the resistivity with slight degradation of diffusion barrier properties of the compound.

• 치과방사선
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• 제27권2호
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• pp.105-116
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• 1997

The purpose of this study is to evaluate the cephalometric reproducibility in digitized cephalometric radiography by comparing the measurement errors between the remeasured and retaken conventional and digitized lateral cephalometric radiography. The mean of the differences and error percentage of each cephalometric measurement were obtained using 96 lateral cephalometric radiography from 48 patients between the age of 11 and 13. The results were as follows; 1. The repeated measurement group of conventional radiography showed least amount of mean differences while those of the retaken measurement group of digitized image showed largest amount of mean differences in every measurement. 2. The measurements which showed statistically significant difference between the conventional radiography and digitized image were S-Go, Ar-Go, S-Ar-Go and S-sN-sNT in repeated measurement group. 3. The measurements which showed statistically significant difference between the repeated and retaken measurement groups were N-S-Ar, MP-Ll and S-sN-sPog in conventional radiography and S-N, Go-Me and N-A in digitized Image. 4. Large amount of error percentage was shown at A-N-B and N-A in retaken measurement group of conventional radiography and N-S-Ba and A-N-B in retaken measurement group of digitized image. 5. The amount of error percentage at Ar-Go and N-S- Ar in retaken measurement group of conventional radiography and S-N, N-A, S-N-B and N-S-Ba in retaken measurement group of digitized image was more than double than those from remeasured groups.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2006년도 추계학술발표회 초록집
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• pp.73-73
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• 2006

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 추계학술대회 논문집 전기물성,응용부문
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• pp.72-74
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• 2004

In this study, we used a inductively coupled plasma (ICP) source for etching $Al_2O_3$ thin films because of its high plasma density, low process pressure and easy control bias power. $Al_2O_3$ thin films were etched using $Cl_2/BCl_3$, $N_2/Cl_2/BCl_3$, and Ar/$Cl_2/BCl_3$ plasma. The experiments were carried out measuring the etch rates and the selectivities of $Al_2O_3$ to $SiO_2$ as a function of gas mixing ratio, rf power, and chamber pressure. When $Cl_2$ 50% was added to $Cl_2/BCl_3$ plasma, the etch rate of the $Al_2O_3$ films was 118 nm/min. We also investigated the effect of gas addition. In case of $N_2$ addition, the etch rate of the $Al_2O_3$ films decreased while $N_2$ was added into $Cl_2/BCl_3$ plasma. However, the etch rate increased slightly as Ar added into $Cl_2/BCl_3$ plasma, and then further increase of Ar decreased the etch rate. The maximum etch rate was 130 nm/min at Ar 20% in $Cl_2/BCl_3$ plasma, and the highest etch selectivity was 0.81 in $N_2$ 20% in $Cl_2/BCl_3$ plasma. And, we obtained the results that the etch rate increases as rf power increases and chamber pressure decreases. The characteristics of the plasmas were estimated using optical emission spectroscopy (OES).

• The Journal of Korean Physical Therapy
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• 제31권3호
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• pp.141-146
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• 2019

Purpose: To investigate the effect of an augmented reality (AR) system on muscle strength and function level of the paretic lower limb and the balance ability in the early rehabilitation program of acute stroke patients. Methods: The participants (30 or fewer days after stroke) were randomly assigned to receive intervention with an early rehabilitation program using an AR system (n=1) or an early rehabilitation program consisting of functional electrical stimulation and tilt table use (n=1). Patients in both subjects received interventions 4-5 times a week for 3 weeks. Results: In the paretic limb muscle strength, AR subject was increased from 15 to 39.6 Nm and Control subject was increased from 5 to 30.2 Nm. The paretic limb function of AR subject motor function was increased from 8 to 28 score and Control subject motor function was increased from 6 to 14 score. But sensory function was very little difference between the two subjects (AR subject: from 4 to 10 score, Control subject: from 3 to 10 score). In the balance ability, AR subject had more difference after intervention than control subject (AR subject: 33 score, Control subject: 22 score). Conclusion: The early rehabilitation program using the AR system showed a slightly higher improvement in the motor function of the paretic lower limb and balance ability measurement than the general early rehabilitation program. The AR system, which can provide more active, task-oriented, and motivational environment, may provide a meaningful environment for the initial rehabilitation process after stroke.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.1049-1052
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• 2003

This study shows the change of the structural characteristic of AIN thin film deposition with the change of the deposition conditions such as Ar/$N_2$ gas ratio, operating pressure in chamber, and the distance between substrate and target in RF Magnetron Sputtering. The orientation and surface roughness of AIN thin film are studied by using XRD and AFM and the thickness is measured by using STYLUS PROFILER. While we can not identify the orientation of the thin film deposited in Ar only, we can obtain the (100) orientation of the thin film with the addition of $N_2$ to Ar. Especially the thin film deposited at 10% of Ar/$N_2$ gas ratio appears to be the most (100) oriented. The (100) orientation of thin film becomes weaker as the operating pressure becomes higher. The further distance between substrate and target is stronger the (100) orientation of the thin film is. The (100) orientation becomes weaker and (002) orientation starts to appear as the distance is shorter.

• 한국화재소방학회논문지
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• 제17권2호
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• pp.43-49
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• 2003

대체 소화제로 사용되는 불활성 기체 중 Ar, $N_2$, $CO_2$에 대한 혼합물에서의 물성(포화압력, 밀도, 점도)에 관한 실험식을 구하였다. Mixing rule에 의해 계산한 값을 이용하여 다항식 등의 회귀분석에 의해서 실험식을 얻었다. 포화압력은 온도에 대하여 1차 실험식으로 표시하였다. 압축인자와 포화압력을 이용하여 온도에 대한 밀도에 관한 실험식을 제시하였다. 점도는 온도에 대한 지수함수로 표시하였다. Ar, $N_2$, $CO_2$혼합물의 조성이 40/50/10(mol. %)에서 열역학적 실험식을 구하였다.