• Title/Summary/Keyword: Anodized films

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Effects of structure and morphology of anodized Al thin film on magnetic properties (알루미늄 양극산화 피막의 구조 및 형상이 자기적 특성에 미치는 영향)

  • 권용덕;박용수
    • Journal of the Korean institute of surface engineering
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    • v.26 no.2
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    • pp.45-54
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    • 1993
  • In this study, magnetic properties of anodized Al film deposited with ferro-magnetic metals in the capacity of perpendicular magnetic recording media were measured and evaluated to find out the role of structure and morphology of the oxide films on magnetic characteristics. The object of this work was to present the conditions of magnetic thin film formation with more superior magnetic property. Anodizing was carried out under various conditions, and then the anodized film were electro-deposited with Co, Ni, Fe and their alloys. Coercive force and residual magnetization in perpendicular direction increased as the pore length of anodized film increased. It was attributed to the increase of the amount of depoisted metals and the ratio of length/diameter of pores. Morphology of anodized films in phosperic acid was not similar to that of sulfuric acid, and thin films in the former solution had perpendcular magnetic anisostropy because of large diameter, irregular length and distribution of the pores. It was found that magnetic properties of the thin films, which had doubled layer of two metals, were dominated by the metal electrodeposited on the surface of the anodized oxide films.

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Corrosion Characteristics of the Sulfuric Acid Anodized Film Formed on Al6070 Alloy in Nitric Acid Vapor Environment (질산가스분위기에서 황산 양극산화 피막처리된 Al6070 합금의 부식특성)

  • Chang, Il Ho;Jung, Do Young;Gook, Jin Seon
    • Journal of the Korean institute of surface engineering
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    • v.45 no.5
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    • pp.198-205
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    • 2012
  • The corrosion properties of anodized films on aluminium 6070 alloy in a sulfuric acid have been studied. Comparison to evaluate the anodized A6070 and pure 6070 specimen, corrosion tests in $HNO_3$ vapor environment of the 20 wt.% were performed up to 72 hours. Characteristics of film formation and surface morphology were examined by optical microscopy, FE-SEM, and EDS. The oxide film anodized in the sulfuric acid solution contained 5 to 10 wt.% of sulfur. In the initial stages of corrosion, anodized specimens exhibited corrosion resistance than the pure specimen. However, the corrosion conditions in 24 hours, corrosion was far more anodized specimen than pure specimen. Therefore, anodized films contained sulfur, nitric acid vapor in the environment is thought to stimulate corrosion.

Effect of Equal Channel Angular Pressing on the Pitting Corrosion Resistance of Hard Anodized Al5052 Alloy (경질양극산화를 실시한 Al5052합금의 내공식성에 미치는 ECAP의 영향)

  • Son, Injoon
    • Journal of the Korean institute of surface engineering
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    • v.48 no.4
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    • pp.142-148
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    • 2015
  • The effect of equal channel angular pressing (ECAP) on the pitting corrosion resistance of hard anodized Al5052 alloy was investigated. The degree of internal stress generated in anodic oxide films during hard anodization was also evaluated with a strain gauge method. The pitting corrosion resistance of hard anodized Al5052 alloy was greatly decreased by ECAP. Cracks occurred in the anodic oxide film during hard anodization and these cracks were larger and deeper in the alloy with ECAP than without. The pitting corrosion was accelerated by cracks. The internal stress present in the anodic oxide films was compressive and the stress was higher in the alloys with ECAP than without, resulting in an increased likelihood of cracks. The pitting corrosion resistance of hard anodized Al5052 alloy was improved by annealing at the range of 473-573K after ECAP processed at room temperature for four passes. The compressive internal stress gradually decreased with increasing annealing temperature. It is assumed that the improvement in the pitting corrosion resistance of hard anodized Al5052 alloy by annealing may be attributed to a decrease in the likelihood of cracks due to the decreased internal stresses in anodic oxide films.

Effect of the Mixed Electrolyte on the Film Growth and Corrosion Characteristics of Anodized Al 6061 Alloy (Al 6061 합금 양극산화피막의 성장과 부식특성에 미치는 혼합 전해용액의 영향)

  • Ryu, Han-Woong;Kim, Yong-Hwan;Chung, Uoo-Chang;Chung, Won-Sub
    • Korean Journal of Materials Research
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    • v.17 no.5
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    • pp.244-249
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    • 2007
  • The properties of anodized films on aluminum 6061 alloy in single electrolyte of sulfuric acid and mixed electrolyte of sulfuric-boric acid and sulfuric-boric-nitric acid have been studied. Polarization tests in NaC solution were used to investigate the corrosion performance. Characteristics of film formation and surface morphology were examined by optical microscopy, FE-SEM and EDS. The results obtained have indicated that oxide films growth have been promoted by nitric acid and anodized films in mixed electrolyte have superior corrosion resistance. In case of anodic films formed in mixed electrolyte, some grooves and numerous crazings were also observed at the surface.

The Electrochemical Properties and Mechanism of Formation of Anodic Oxide Films on Mg-Al Alloys

  • Kim, Seong-Jong;Okido, Masazumi
    • Bulletin of the Korean Chemical Society
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    • v.24 no.7
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    • pp.975-980
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    • 2003
  • The electrochemical properties and the mechanism of formation of anodic oxide films on Mg alloys containing 0-15 mass% Al, when anodized in NaOH solution, were investigated by focusing on the effects of anodizing potential, Al content, and anodizing time. The intensity ratio of Mg(OH)₂ in the XRD analysis decreased with increasing applied potential, while that of MgO increased. Mg(OH)₂ was barely detected at 80 V, while MgO was readily detected. The anti-corrosion properties of anodized specimens at each constant potential were better than those of non-anodized specimens. The specimen anodized at an applied potential of 3 V had the best anti-corrosion property. The intensity ratio of the β phase increased with aluminum content in Mg-Al alloys. During anodizing, the active dissolution reaction occurred preferentially in β phase until about 4 min, and then the current density increased gradually until 7 min. The dissolution reaction progressed in α phase, which had a lower Al content. In the anodic polarization test in 0.017 mol·$dm^{-3}$ NaCl and 0.1 mol·$dm^{-3}$ Na₂SO₄ at 298 K, the current density of Mg-15 mass% Al alloy anodized for 10 min increased, since the anodic film that forms on the α phase is a non-compacted film. The anodic film on the α phase at 30 min was a compact film as compared with that at 10 min.

Electroless Plated Copper Thin Film for Metallization on Printed Circuit Board : Neutral Process (인쇄회로기판상의 금속 배선을 위한 구리 도금막 형성 : 무전해 중성공정)

  • Cho, Yang-Rae;Lee, Youn-Seoung;Rha, Sa-Kyun
    • Korean Journal of Materials Research
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    • v.23 no.11
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    • pp.661-665
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    • 2013
  • We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

Formation of Anodic Oxide Films on As-Cast and Machined Surfaces of Al-Si-Cu Casting Alloy (주조용 Al-Si-Cu 알루미늄 합금의 기계가공 및 주조된 표면에서의 양극산화피막 형성)

  • Moon, Sung-Mo;Nam, Yoon-Kyung;Yang, Cheol-Nam;Jeong, Yong-Soo
    • Journal of the Korean institute of surface engineering
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    • v.42 no.6
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    • pp.260-266
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    • 2009
  • The anodic oxidation behaviour of a cast component of AC2A Al alloy with machined surface and ascast surface was investigated in sulfuric acid solution. The anodized specimen showed relatively uniform and thick anodic oxide films on the as-cast surface, while non-uniform and very thin oxide films were formed on the machined surface. Non-anodized as-cast surface was observed to be covered with thick oxide scales and showed a number of second-phase particles containing Si, while non-anodized machined surface showed no oxide scales and relatively very small number of Si particles. Thus, the very limited growth of anodic oxide films on the as-cast surface was attributed to the presence of thick oxide scales and Si-containing second-phase particles on its surface.

Characterization of Anodized Al 1050 with Electrochemically Deposited Cu, Ni and Cu/Ni and Their Behavior in a Model Corrosive Medium

  • Girginov, Christian;Kozhukharov, Stephan;Tsanev, Alexander;Dishliev, Angel
    • Journal of Electrochemical Science and Technology
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    • v.12 no.2
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    • pp.188-203
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    • 2021
  • The specific benefits of the modified films formed on preliminary anodized aluminum, including the versatility of their potential applications impose the need for evaluation of the exploitation reliability of these films. In this aspect, the durability of Cu and Ni modified anodized aluminum oxide (AAO) films on the low-doped AA1050 alloy was assessed through extended exposure to a 3.5% NaCl model corrosive medium. The electrochemical measurements by means of electrochemical impedance spectroscopy (EIS) and potentiodynamic scanning (PDS) after 24 and 720 hours of exposure have revealed that the obtained films do not change their obvious barrier properties. In addition, supplemental analyses of the coatings were performed, in order to elucidate the impact of the AC-deposition of Cu and Ni inside the pores. The scanning electron microscopy (SEM) images have shown that the surface topology is not affected and resembles the typical surface of an etched metal. The subsequent energy dispersive X-ray spectroscopy (EDX) tests have revealed a predominance of Cu in the combined AAO-Cu/Ni layers, whereas additional X-ray photoelectron (XPS) analyses showed that both metals form oxides with different oxidation states due to alterations in the deposition conditions, promoted by the application of AC-polarization of the samples.

Characteristics Comparison of Anodic Films Formed on Mg-Al Alloys by Non-chromate Surface Treatment

  • Kim, Seong-Jong;Jang, Seok-Ki;Kim, Jeong-Il
    • Journal of Advanced Marine Engineering and Technology
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    • v.28 no.2
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    • pp.300-308
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    • 2004
  • The formation mechanism of anodic oxide films on Mg alloys when anodized in NaOH solution. was investigated by focusing on the effects of anodizing potential. Al content. and anodizing time. Pure Mg and Mg-Al alloys were anodized for 10 min at various potentials in NaOH solutions. $Mg(OH)_2$ was generated by an active dissolution reaction at the surface. and the product was affected by temperature. The intensity ratio of $Mg(OH)_2$ in the XRD analysis decreased with increasing applied potential. while that of MgO increased. The anti-corrosion properties of anodized specimens at each constant potential were better than those of non-anodized specimens. The specimen anodized at an applied potential of 3 V had the best anti-corrosion property. And the intensity ratio of $Mg_{17}Al_{12}$/Mg increased with aluminum content in Mg-Al alloys. During anodizing. the active dissolution reaction occurred preferentially in ${\beta}\;phase(Mg_{17}Al_{12})$ until about 4 mins. and then the current density increased radually until 7 mins. The dissolution reaction progressed in a phase(Mg) which not formed the intermetallic compound. which had a lower Al content. In the anodic polarization test of $0.017\;mol{\cdot}dm^-3$ NaCl and $0.1\;mol{\cdot}dm^-3\;Na_2SO_4$ at 298 K. the current density of Mg-15 mass% Al alloy anodized for 10 mins increased. since the anodic film that forms on the a phase is a non-compacted film. The anodic film on the phase for 30 mins was a compact film as compared with that for 10 mins.

The Biocompatibility of HA Film Deposition on Anodized Titanium Alloy

  • Lee, Kang;Choe, Han-Choel;Kim, Byung-Hoon;Ko, Yeong-Mu
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2009.10a
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    • pp.213-214
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    • 2009
  • A thin film hydroxyapatite (HA) films was deposited on anodized titanium by RF sputtering method. The anodized titanium enhanced the biocompatibility of the Ti and the bioactivity was improved further by the HA deposited on the anodized Ti. $TiO_2$ layer with $0.2{\sim}0.5{\mu}$ diameter pore size was formed on the Ti surface by anodization. Anodized $TiO_2$ layer analysis HA film deposited, oxide pore size and number decreased compared with non-HA deposited surface. The corrosion resistance of HA deposited/anodized Ti was higher than that of the non-treatment Ti alloy in Hank's solution, indicating better protective effect. From the results of cell culture using MTT assays, the best cell proliferation showed in HA deposited surface after anodization of Ti surfaces compared with another surface treatment.

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