• 제목/요약/키워드: Anodic Dissolution

검색결과 96건 처리시간 0.024초

Al-Cu-Mn 주조합금의 SCC 특성에 미치는 Sn 첨가의 영향 (Effect of Sn Addition on the SCC Properties of Al-Cu-Mn Cast Alloy)

  • 김광년;김경현;김인배
    • 한국재료학회지
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    • 제12권6호
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    • pp.436-441
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    • 2002
  • Effect of Sn addition on the stress corrosion cracking(SCC) resistance of the Al-Cu-Mn cast alley was investigated by C-ring teat and electrical conductivity measurement, The electrical conductivity and SCC resistance increased by Sn addition. The alley containing 0,10%Sn showed maximum electrical conductivity and the best SCC resistance. At the same composition, the electrical conductivity and SCC resistance increased from peak aged condition to ever aged condition. The PFZ and coarse precipitates along the grain boundary were observed from TEM micrographs. The fracture mode of the alloy was confirmed as intergranular type and showed brittle fracture surface. The SCC mechanism of the alloy was concluded as the anodic dissolution model, The maximum hardness was increased from 130Hv in the Sn-free alloy to 156Hv in the 0.10%Sn added alloy.

금속 코발트의 부식과 부동화에 관한 연구 (A Study on Corrosion and Passivation of Cobalt)

  • 천정균;백운기
    • 대한화학회지
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    • 제18권6호
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    • pp.391-399
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    • 1974
  • 금속 코발트의 부식과 부동화현상들을 전기화학적 실험방법들을 써서 연구하였다. Tafel slope, Flade potential의 pH의존도, 부식속도의 반응역학적 데이타등으로 부터 코발트와 붕산염완충용액 사이 계면에서 일어나는 부식과 부동화 과정들의 메카니즘을 도출하였다. 금속표면에 흡착된 히드록실기가 표면산화와 부동화막의 형성에 참여하는 것으로 나타났다. 표면막의 성장속도에 관한 데이타로 보아 부동화피막은 "전기장에 의한-이온-이동" 과정에 의하여 성장하는 것으로 보인다. 측정된 표면막의 두께는 약 10${\AA}$에서 20${\AA}$에 이르렀다.

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Borate 완충용액에서 니켈 회전원판전극의 부식과 부동화 (Corrosion and Passivation of Nickel Rotating Disk Electrode in Borate Buffer Solution)

  • 김연규
    • 대한화학회지
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    • 제57권5호
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    • pp.533-539
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    • 2013
  • 변전위법과 전기화학 임피던스 측정법을 이용하여 borate 완충용액에서 니켈 회전원판전극의 전기화학적 부식과 부동화를 연구하였다. Tafel 기울기, 임피던스, 회전원판전극의 회전속도, 그리고 부식전위와 부식전류의 pH 의존성으로부터 니켈의 부식과 부동화 반응 메커니즘과 환원반응에서의 수소 발생 반응구조를 제안하였다. EIS data로부터 등가회로를 제안하였으며 산화반응의 영역별로 전기화학적 변수들을 측정하였다. 부동화 반응에 의하여 생성된 $Ni(OH)_2$ 산화피막은 전기장의 영향을 받는 탈수반응에 의해 NiO로 전환되는 것으로 보인다.

알칼리형 연료전지의 수소극용 Co-Mo 및 Ni-Mo 금속간화합물 전극의 전기화학적 안정성 (Electrochemical Stability of Co-Mo and Ni-Mo Intermetallic Compound Electrodes for Hydrogen Electrode of Alkaline Fuel Cell)

  • 이창래;강성군
    • 전기화학회지
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    • 제2권3호
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    • pp.150-155
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    • 1999
  • [ $H_2-O_2$ ] 알칼리형 연료전지용 수소극으로서 아크융해법으로 제조된 Brewer-Engel type의 Co-Mo$(35\;wt\%)$ 및 Ni-Mo$(35\;wt\%)$ 금속간화합물 전극의 전기화학적 안정성이 조사되었다. $N_2$가스로 용존산소를 제거한 $80^{\circ}C$ 6N KOH 전해질 내에서 금속간화합물 전극의 전기화학적 안정성에 미치는 전해질의 농도 및 온도의 영향이 조사되었다. 또한, AFC의 정상 작동조건하에서는 Co-Mo및 Ni-Mo전극의 전기화학적 안정성에 대한 분극전압(과전압)의 영향이 논의되었다. Co-Mo전극은 Ni-Mo전극에 비하여 낮은 전기화학적 안정성을 보였다. 수소가스 평형전위로부터 낮은 양분극 과전압 하에서 Co-Mo전극에서는 Co와 Mo의 용해가 동시에 일어났다. 그러나, Co는 Mo에 비하여 급격히 용해되었다 높은 양분극 과전압에서는 전극표면에 $Co(OH)_2$ 부동태 피막이 형성되었다. Ni-Mo전극의 경우에는 Mo의 용해반응이 치밀한 $Ni(OH)_2$, 부동태 피막형성에 의하여 억제되어 우수한 전기화학적 안정성을 보였다.

Surface Protection Obtained by Anodic Oxidation of New Ti-Ta-Zr Alloy

  • Vasilescu, C.;Drob, S.I.;Calderon Moreno, J.M.;Drob, P.;Popa, M.;Vasilescu, E.
    • Corrosion Science and Technology
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    • 제17권2호
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    • pp.45-53
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    • 2018
  • A new 80Ti-15Ta-5Zr wt% alloy surface was protected by anodic oxidation in phosphoric acid solution. The protective oxide layer (TiO2, ZrO2 and Ta suboxides and thickness of 15.5 nm) incorporated $PO{_4}^{3-}$ ions from the solution, according to high resolution XPS spectra. The AFM analysis determined a high roughness with SEM detected pores (20 - 50 nm). The electrochemical studies of bare and anodically oxidized Ti-15Ta-5Zr alloy in Carter-Brugirard saliva of different pH values and saliva with 0.05M NaF, pointed to a nobler surface for the protected alloy, with a thicker electrodeposited oxide layer acting as a barrier against aggressive ions. The oxidized alloy significantly decreased corrosion current densities and total quantity of ions released into the oral environment in comparison with the bare one, at higher polarisation resistance and protective capacity of the electrodeposited layer. The impedance data revealed a bi-layered oxidation film formed by: a dense, compact, barrier layer in contact with the metallic substrate, decreasing the potential gradient across the metal/oxide layer/solution interface, reducing the anodic dissolution and a more permissive, porous layer in contact with the electrolyte. The open circuit potential for protected alloy shifted to nobler values, with thickening of the oxidation film signifying long-term protection.

304 및 430 스테인레스 강판의 산화 및 중성염 전해산세 거동 (Oxidation and Neutral Electrolytic Pickling Behavior of 304 and 430 Stainless Steels)

  • 김태수;박용택
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 제5회 압연심포지엄 신 시장 개척을 위한 압연기술
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    • pp.285-293
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    • 2004
  • Oxidation behavior of 304 and 430 stainless steel were studied using thin film X-ray analysis and glow discharge spectrum analysis (here-after GDS). The oxidation layer of 304 stainless steel was composed of $Cr_2O_3\;and\;FeCrO_4$ and its thickness was about $1.5{\mu}m$ after $1\~5$ minutes of annealing at $1120^{\circ}C$ open air. However, the oxidation layer of 430 stainless steels was mainly composed of $Cr_2O_3$ and its typical thickness was 0.5um after $1\~5$ minutes of annealing at $1000^{\circ}C$ open air. Electro-chemical analysis revealed that the descaling of oxidation layer could be activated by Fe, Cr dissolution from the matrix behind the oxidation layer at the current density of $5\~10ASD$ and by Fe, Cr-oxide dissolution from the oxidation layer at the current density over than 10ASD. Electrolytic stripping of 430 and 304 revealed the intial incubation period of descaling by oxygen evolving at low current density range such as $5\~10ASD$. However the dissolution of oxide layer was occurred when applying the anodic current of $10\~20ASD$ on 430 and 304 stainless steels. It was suggested that the electrolytic pickling of high Cr bearing stainless steel such as 430 and 304 seemed to be the more effective in the high current density range such as $10\~20ASD$ than the low current density range such as $5\~10ASD$.

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Effects of Ag and Cu Additions on the Electrochemical Migration Susceptibility of Pb-free Solders in Na2SO4 Solution

  • Yoo, Y.R.;Nam, H.S.;Jung, J.Y.;Lee, S.B.;Park, Y.B.;Joo, Y.C.;Kim, Y.S.
    • Corrosion Science and Technology
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    • 제6권2호
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    • pp.50-55
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    • 2007
  • The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

Review of the Usefulness of Inhibitors for Reducing the Corrosion of Iron in $H_2S$ Environments

  • Kim, Han-Sang;Yoon, Eun-Sub
    • Corrosion Science and Technology
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    • 제8권1호
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    • pp.21-26
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    • 2009
  • The influence of $H_2S$ on the corrosion of iron and the corrosion prevention mechanism of an inhibitor was investigated with a differential capacitance measurement and a weight loss measurement method. The results show that $H_2S$ accelerates both the anodic iron dissolution and the cathodic hydrogen evolution in most cases. However, $H_2S$ acts as an inhibitor of the corrosion of iron under certain special conditions. An EIS method is proposed to explain the ability of inhibitors.

Electrochemical Synthesis of Octahedral Nanostructured PbF2

  • Lee, Joon-Ho;Choi, Jin-Sub
    • Bulletin of the Korean Chemical Society
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    • 제32권2호
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    • pp.463-466
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    • 2011
  • In this work, we investigate anodization of Pb in ethylene glycol containing small amount of $NH_4F$, demonstrating that ${\beta}-PbF_2$ particles with octahedral morphology can be prepared by adjusting the applied potential and anodizing time. FE-SEM images and XRD measurements of anodic nanostructures as a function of anodizing time clearly show that PbO is first formed on Pb. Subsequently, a local dissolution of PbO leads to formation of skeleton structure of PbO, releasing $Pb^{2+}$ ions in the electrolyte. The lead ions can be precipitated on the walls or intersection of the skeleton walls when the concentration of lead ions is saturated. The method described in this article shows the feasibility of formation of metal fluoride crystal by anodization of metal in a fluoride containing solution.

A Comparison of Corrosion Performance of Zirconium Grain Refined MEZ and AZ91 Alloys

  • Song, Guangling;StJohn, David
    • Corrosion Science and Technology
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    • 제2권1호
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    • pp.30-35
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    • 2003
  • In this study, sand cast AZ91E and zirconium grain refined MEZ are representative of two typical groups of magnesium alloys: those containing aluminium and those containing no aluminium but with zirconium as a grain refiner. The corrosion performance of these two alloys was evaluated and compared in 5%wt NaCI solution through measurements of weight loss and polarisation curves and examination of microstructure. Corrosion damage of AZ91E was deeper and more localised than that of MEZ, while MEZ had a lower rate of cathodic hydrogen evolution and a higher rate of anodic dissolution than AZ91E. These differences in behaviour can be related to the differences in microstructure and chemical composition between the two alloys.