• 대한토목학회논문집
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• 제30권3A호
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• pp.309-316
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• 2010

이 논문에서는 인장과 압축하중에 놓은 무근 콘크리트와 철근콘크리트 구조물의 거동을 모사하기 위해 비국소화 이방성 손상모델을 제안하였다. 손상변수로써 대칭형의 이차 텐서을 사용한 연속체 손상모델에 기초한다. 콘크리트와 같은 준-취성재료에 있어 손상양상은 인장부와 압축부에서 다른 양상을 나타낸다. 이러한 두 개의 손상영역은 전체 변형률 텐서의 주변형률 성분을 손상텐서 속도에 비례하는 손상진전 법칙을 이용하여 모델링하였다. 제안된 모델의 유효성을 검토하기 위해 nooru-mohamed에 의해 실시된 이중 노치가 있는 시험체와 철근콘크리트 휨 시험체를 대상으로 해석을 수행하였다. 해석결과, 비국소화 이방성 모델은 혼합모드 파괴에 대한 균열진전을 적절히 모사할 수 있었으며 철근콘크리트 휨 시험체의 구조적 파괴에 있어서도 높은 수준의 콘크리트 손상 및 철근의 항복까지를 해석할 수 있었다.

• Journal of the Optical Society of Korea
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• 제2권2호
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• pp.45-49
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• 1998

We have combined Brillouin scattering experiments and fucdamental optics theory to determine the birefringence of single crystals. Double refraction in anisotropic materials give rise to doublet peaks in Brillouin spectra. With the incident plane orthogonal to the optic axis, the birefrigence of the materials can be determined from one spectrum. We present the Brillouin spectra to confirm this fact for a single crystal $PbMoO_4$.

• 비파괴검사학회지
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• 제23권6호
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• pp.635-644
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• 2003

To ensure the reliability of ultrasonic nondestructive testing techniques for modern structural materials, the effects of anisotropy and inhomogeneity and the influence of non-planar component geometries on ultrasonic wave propagation have to be taken into account. In this article, fundamentals and applications of two analytical approaches to three-dimensional elastic beam field calculation are presented. Results for both isotropic materials including curved interfaces and for anisotropic media like composites are presented, covering field profiles for various types of transducers and the modeling of time-dependent rf-signals.

• Composites Research
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• 제28권5호
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• pp.270-276
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• 2015

Polyvinylidene fluoride (PVDF)-based nanocomposites are fabricated by incorporation of boron nitride (BN) nanosheets with anisotropic orientation for a potential high thermal conducting ferroelectric materials. The PVDF is dissolved in dimethylformamide (DMF) and homogeneously mixed with exfoliated BN nanosheets, which is then cast into a polyimide film under application of high magnetic fields (0.45~10 T), where the direction of the filler alignment was controlled. The BN nanosheets are exfoliated by a mixed way of solvothermal method and ultrasonication prior to incorporation into the PVDF-based polymer suspension. X-ray diffraction, scanning electron microscope and thermal diffusivity are measured for the characterization of the polymer nanocomposites. Analysis shows that BN nanosheets are exfoliated into the fewer layers, whose basal planes are oriented either perpendicular or parallel to the composite surfaces without necessitating the surface modification induced by high magnetic fields. Moreover, the nanocomposites show a dramatic thermal diffusivity enhancement of 1056% by BN nanosheets with perpendicular orientation in comparison with the pristine PVDF at 10 vol % of BN, which relies on the degree of filler orientation. The mechanism for the magnetic field-induced orientation of BN and enhancement of thermal property of PVDF-based composites by the BN assembly are elucidated.

• 마이크로전자및패키징학회지
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• 제6권2호
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• 한국군사과학기술학회지
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• 제22권4호
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• pp.492-500
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• 2019

Equal channel angular pressing(ECAP) is a severe plastic deformation technique capable of introducing large shear strain in bulk metal materials. However, if an ECAPed material has an inhomogeneous microstructure and anisotropic mechanical properties, this material is difficult to apply as structural components subjected to multi-axial stress during use. In this study, extruded oxygen-free copper(OFC) rods with a large diameter of 42 mm are extruded through ECAP by route Bc up to 12 passes. The variations in the microstructure, hardness, tensile properties, and microstructural and mechanical homogeneity of the ECAPed samples are systematically analyzed. High-strength OFC rods with a homogeneous and equiaxed-ultrafine grain structure are obtained by the repeated application of ECAP up to 8 and 12 passes. ECAPed samples with 4 and 8 passes exhibit much smaller differences in terms of the average grain sizes on the cross-sectional area and the tensile strengths along the axial and circumferential directions, as compared to the samples with 1 and 2 passes. Therefore, it is considered that the OFC materials, which are fabricated via the ECAP process with pass numbers of a multiple of 4, are suitable to be applied as high-strength structural parts used under multi-axial stress conditions.

• 한국재료학회지
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• 제5권2호
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• pp.215-222
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• 1995

C형 및 중공형 탄소섬유는 방직(spinning)시 홀의 전단응력을 원형의 그것에 비해서 더 광범위하게 걸쳐받게 됨으로 분자배향을 고도로 유도할 수가 있다. 핏치계 이방성 중공 및 C형 탄소섬유 강화재의 축 횡방향 열전도도를 에폭시 모재 하에서 실험하였다. 열이방성 정도에 있어 원형 탄소섬유 보강재인 경우 50 정도 였으나, C형과 중공형 보강재는 최고치로 대략 130과 118 정도를 보임으로써 원형 강화재 보다 200%이상 우수한 열이방성을 보였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.349-352
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• 2006

The plastic deformation of polycrystalline materials is induced by changes of the microstructure when the loading is beyond the critical state of stress. Constitutive models for the crystal plasticity have the common objective which relates microscopic single crystals in the crystallographic texture to the macroscopic continuum point. In this paper, a new consistent tangent stiffness for the anisotropic elasto-viscoplastic analysis of polycrystalline deformation is developed, which can be used in the finite element analysis for the slip-dominated large deformation of polycrystalline materials. In order to calculate the consistent tangent stiffness, the state function is defined based on the consistency condition between the elastic and plastic stress. The rate of shearing increment($\Delta{\gamma}^{\alpha}$) is calculated with satisfying the consistency condition. The consistency condition becomes zero when the trial resolved shear stress($\tau^{{\alpha}^*}$) becomes resolved shear stress($\tau^{\alpha}$) at every step. Iterative method is utilized to calculate the rate of shearing increment based on the implicit backward Euler method. The consistent tangent stiffness can be formulated by differentiating the rate of shearing increment with total strain increment after the instant rate of shearing increment converges. The proposed tangent stiffness is applied to the ABAQUS/Standard by implementing in the ABAQUS/UMAT.

• 소성∙가공
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• 제22권3호
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• pp.133-142
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• 2013

Recently, electric vehicles and hybrid cars are being promoted as alternatives to reduce automobile emissions. Generally, thin sheet materials such as aluminum alloy AA300X and cold-rolled steel sheet such as JIS-G-3141 are used for the container for the lithium-ion secondary batteries. In this study, a multi-stage deep drawing process is used to produce a rectangular cup from thin stainless steel sheet material, SUS409L, with an initial blank thickness of 0.4mm for the battery container application. Numerical simulations of the first through the fifth stages for the multi-stage deep drawing with thin SUS409L sheet were conducted using LS-Dyna3D Implicit/Explicit. Special consideration was given to the deformation characteristics due to the normal anisotropy of the sheet material. The numerical simulations were conducted with both isotropic properties and the anisotropic properties of the initial blank material. An unexpected forming failure, barreling in the bottom region of the deep drawn rectangular cup, was observed. This failure mode can be avoided by additional ironing thickness control during the process.

• Journal of Magnetics
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• 제20권4호
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• pp.336-341
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• 2015

MnBi alloys were fabricated by arc melting and annealing at 573 K. The heat treatment enhanced the content of the low-temperature phase (LTP) of MnBi up to 83 wt%. The Bi-excess assisted LTP MnBi alloys were used in the hybridization with the Nd-Fe-B commercial Magnequench ribbons to form the hybrid magnets (100-x)NdFeB/xMnBi, x = 20, 30, 40, 50, and 80 wt%. The as-milled powder mixtures of Nd-Fe-B and MnBi were aligned in a magnetic field of 18 kOe and warm-compacted to anisotropic and dense bulk magnets at 573 K by 2,000 psi for 10 min. The magnetic ordering of two hard phase components strengthened by the exchange coupling enhanced the Curie temperature ($T_c$) of the magnet in comparison to that of the powder mixture sample. The prepared hybrid magnets were highly anisotropic with the ratio $M_r/M_s$ > 0.8. The exchange coupling was high, and the coercivity $_iH_c$ of the magnets was ~11-13 kOe. The maximum value of the energy product $(BH)_{max}$ was 8.4 MGOe for the magnet with x = 30%. The preparation of MnBi alloys and hybrid magnets are discussed in details.