• 제목/요약/키워드: Anisotropic Sheet Metal

검색결과 34건 처리시간 0.016초

2차원적으로 무질서화된 텅스텐 칼코겐화물의 열적특성에 관한 연구 (Thermal Property of 2D-Disordered Tungsten Chalcogenides)

  • 김종영;장경주;피재환;조광연;최순목;서원선;김경자
    • 한국세라믹학회지
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    • 제47권2호
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    • pp.132-135
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    • 2010
  • Thermal properties of layered metal chalcogenides such as $WT_2$ (T=S,Se) with two-dimensionally disordered structure were evaluated. Thermal conductivity shows a marked decrease after exfoliation and subsequent restacking because of random stacking of two-dimensional crystalline sheet, which circumvents thermal conduction pathways along longitudinal direction in anisotropic materials.

알루미늄 합금 판재 성형성 예측을 위한 유한요소해석 프로그램 개발 (Development of finite element analysis program for aluminum alloy sheets)

  • 김성태;문명수;정완진;윤정환;김윤근
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 추계학술대회 논문집
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    • pp.291-294
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    • 2005
  • Recently, the usage of aluminum alloy is rapidly increasing in automobile industry to achieve weight reduction for fuel efficiency. However, design of forming process of aluminum is more difficult than steel because of poor formability and severe springback. Since applications of finite element analysis for the design of sheet metal forming process are actively performed, it is required to conduct proper consideration of aluminum material behavior. In this study, a plane stress yield function Yld2000(Yoon et al., 2000), proven to describe well the anisotropic behavior of aluminum alloy, is implemented for FE analysis. One element test is considered to verify the validity of implementation of Yld2000 model. In addition, cylindrical cup drawing test is performed to verify earing shape of a drawn cup.

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$\gamma$-plane 사파이어 기판 위에 성장한 무분극 ${alpha}$-plane GaN 층의 전기적 비등방성 연구 (A Study of Electrical Anisotropy of n-type a-plane GaN films grown on $\gamma$-plane Sapphire Substrates)

  • 김재범;김동호;황성민;김태근
    • 대한전자공학회논문지SD
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    • 제47권8호
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    • pp.1-6
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    • 2010
  • 본 논문에서는 무분극 GaN층에서 관찰되는 성장축의 방향성에 따른 전기적 비등방성에 대한 연구를 수행하였다. 본 연구를 위해 $\gamma$-plane 사파이어 기판 상에 유기화학기상증착법 (Metal-organic chemical vapor deposition)을 이용하여 600 nm 두께의 ${\alpha}$-plane n-type GaN층을 성장시킨 후, Ti/Al/Ni/Au (20 nm/ 150 nm/ 30 nm/ 100 nm) 오믹 전극을 증착하여 transfer length method (TLM)로 접촉저항을 측정하였다. 그 결과, ${\alpha}$-plane GaN층이 갖는 축의 방향성에 의한 접촉저항이 차이는 없는 것을 확인하였고, 면저항 측정 시에는 m-축 방향에 비해 c-축 방향에서 발생하는 면저항 값이 약 25%~75% 정도 크게 발생하는 것을 확인할 수 있었다. 이러한 전기적 특성의 비등방성은 c-축 성장방향에 대해 수직방향을 갖는 기저적층결함 (basal stacking faults)의 생성으로 인한 전자들의 거동 저하에 의한 것으로 사료된다.

고강도 강판을 적용한 프런트 사이드 멤버의 스프링백 해석 (Springback Analysis of the Front Side Member with Advanced High Strength Steel)

  • 송정한;김세호;박성호;허훈
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 춘계학술대회 논문집
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    • pp.106-109
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    • 2005
  • Springback is a common phenomenon in sheet metal forming, caused by the elastic recovery of the internal stresses after removal of the tooling. Recently, advanced high strength steels (AHSS) such as TRIP and DP are finding acceptance in the automotive industry because their superior strength to weight ratio can lead to improved fuel efficiency and assessed crashworthiness of vehicles. The major troubles of the automotive structural members stamped with high strength steel sheets are the tendency of the large amount of springback due to the high yield strength and the tensile strength. The amount of springback is mainly influenced by the type of the yield function and anisotropic model induced by rolling. The discrepancy of the deep drawn product comparing the data of from the product design induced by springback must be compensated at the tool design stage in order to guarantee its function and assembly with other parts. The methodology of compensation of the low shape accuracy induced by large amount of springback is developed by the expert engineer in the industry. Recently, the numerical analysis is introduced in order to predict the amount of springback and to improve the shape accuracy prior to tryout stage of press working. In this paper, the tendency of springback is evaluated with respect to the blank material. The stamping process is analyzed fur the front side member formed with AHSS sheets such as TRIP60 and DP60. The analysis procedure fully covers the binderwrap, stamping, trimming and springback process with the commercial elasto-plastic finite element code LS-DYNA3D.

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