• 제목/요약/키워드: Anisotropic Materials

검색결과 545건 처리시간 0.051초

Incorporation of anisotropic scattering into the method of characteristics

  • Rahman, Anisur;Lee, Deokjung
    • Nuclear Engineering and Technology
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    • 제54권9호
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    • pp.3478-3487
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    • 2022

  • In this study, we incorporate an anisotropic scattering scheme involving spherical harmonics into the method of characteristics (MOC). The neutron transport solution in a light water reactor can be significantly improved because of the impact of an anisotropic scattering source with the MOC flat source approximation. Several problems are selected to verify the proposed scheme and investigate its effects and accuracy. The MOC anisotropic scattering source is based on the expansion of spherical harmonics with Legendre polynomial functions. The angular flux, scattering source, and cross section are expanded in terms of the surface spherical harmonics. Later, the polynomial is expanded to achieve the odd and even parity of the source components. Ultimately, the MOC angular and scalar fluxes are calculated from a combination of two sources. This paper presents various numerical examples that represent the hot and cold conditions of a reactor core with boron concentration, burnable absorbers, and control rod materials, with and without a reflector or baffle. Moreover, a small critical core problem is considered which involves significant neutron leakage at room temperature. We demonstrate that an anisotropic scattering source significantly improves solution accuracy for the small core high-leakage problem, as well as for practical large core analyses.

  • https://doi.org/10.1016/j.net.2022.03.041 인용 PDF KSCI

이방 도전성 페이스트의 상온 보관성 향상을 위한 Imidazole 경화 촉매제의 Encapsulation (Encapsulation of an 2-methyl Imidazole Curing Accelerator for the Extended Pot Life of Anisotropic Conductive Pastes (ACPs))

  • 김주형;김준기;현창용;이종현
    • 마이크로전자및패키징학회지
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    • 제17권4호
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    • pp.41-48
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    • 2010

  • 본 연구에서는 일액형 이방 도전성 페이스트(anisotropic conductive paste, ACP) 혼합 조성의 상온 보관성을 향상시키기 위해 2-methyl imidazole 경화 촉매제를 5종의 각기 다른 물질로써 encapsulation하였다. Encapsulation용 분말 물질들은 DSC를 통해 그 융점을 관찰하였으며, 이를 통해 encapsulation용 분말 물질들을 액상으로 용융시켜 encapsulation하는 공정이 가능함을 확인할 수 있었다. Encapsulation된 2-methyl imidazole 분말을 포함한 ACP 혼합물질의 상온 보관성을 평가하기 위하여 시간에 따른 점도 변화가 관찰되었다. 그 결과, stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질에서 향상된 상온 보관성을 관찰할 수 있었으며, 이러한 formulation은 기본 혼합물질과도 유사한 경화 거동을 보임을 확인할 수 있었다. 최종적으로 stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질을 사용하여 RFID 칩을 제조된 안테나 패턴이 형성된 PET 기판에 고속 플립칩 본딩을 실시하였다. 이 경우 측정된 접합 강도는 기본 혼합물질에 비해 약 37%의 수준인 것으로 측정되었다.

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Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • 마이크로전자및패키징학회지
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    • 제12권1호
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    • pp.9-16
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    • 2005

  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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