• Proceedings of the Materials Research Society of Korea Conference
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• 2008.11a
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• pp.5.2-5.2
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• 2008

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.280.1-280.1
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.151-151
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• 1994

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.106-106
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.101-101
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• 1997

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.05a
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• pp.26-26
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• 1997

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.81-81
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• 1998

• Nuclear Engineering and Technology
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• v.54 no.9
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• pp.3478-3487
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• 2022

In this study, we incorporate an anisotropic scattering scheme involving spherical harmonics into the method of characteristics (MOC). The neutron transport solution in a light water reactor can be significantly improved because of the impact of an anisotropic scattering source with the MOC flat source approximation. Several problems are selected to verify the proposed scheme and investigate its effects and accuracy. The MOC anisotropic scattering source is based on the expansion of spherical harmonics with Legendre polynomial functions. The angular flux, scattering source, and cross section are expanded in terms of the surface spherical harmonics. Later, the polynomial is expanded to achieve the odd and even parity of the source components. Ultimately, the MOC angular and scalar fluxes are calculated from a combination of two sources. This paper presents various numerical examples that represent the hot and cold conditions of a reactor core with boron concentration, burnable absorbers, and control rod materials, with and without a reflector or baffle. Moreover, a small critical core problem is considered which involves significant neutron leakage at room temperature. We demonstrate that an anisotropic scattering source significantly improves solution accuracy for the small core high-leakage problem, as well as for practical large core analyses.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.41-48
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• 2010

To improve the pot life of one-part in-house anisotropic conductive paste (ACP) formulations, 2-methyl imidazole curing accelerator powders were encapsulated with five agents. Through measuring the melting point of the five agents using DSC, it was confirmed that a encapsulation process with liquid-state agents is possible. Viscosity of ACP formulations containing the encapsulated imidazole powders was measured as a function of storage time from viscosity measurements. As a result, pot life of the formulations containing imidazole powders encapsulated with stearic acid and carnauba wax was improved, and these formulations indicated similar curing behaviors to a basic formulation containing rare imidazole. However, the bondlines made of these formulations exhibited low average shear strength values of about 37% level in comparison with the basic formulation.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.