• Tunnel and Underground Space
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• v.8 no.3
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• pp.226-233
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• 1998

Microcracks in rock materials, whether natural or induced, provide useful information on the engineering performance of in situ rockmasses. A population of preferentially oriented microcracks has observable effects on the physical properties of a rockmass, but their effects may not be evident if the rock material is highly anisotropic due to other causes. An experimental program was undertaken to investigate the effect of rock fabrics on the physical properties of rock materials. In this study, anisotropy in the circumferential wave velocity and the direction of induced fractures under axial point loading were measured. Rock specimens (NX-size) of the leucocractic Pocheon granite were cored from rock blocks, retaining the relative directions of each specimen. Another set of specimens was prepared from the rock cores of the same meterial, obtained in the field. The master orientation line (MOL) was set to be the representative direction of the microcracks in the specimen. Variation of the circumferential wave velocity of each specimen was then measured along the core, keeping the MOL as reference. The direction of the minimum wave velocity was nearly perpendicular to the direction of the MOL. Coring of smaller-sized (EX-size), concentric specimens from the NX specimens were then followed, and axial point loading was applied. The direction of induced fractures due to axial point loading was closely related to the MOL direction, confirming the prior test result.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.1
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• pp.65-71
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• 2016

In recent years, 3D printing has received increasing attention due to releases of low-cost 3D printers based on open-source platform. 3D printing is expected to reduce the barrier to entry in the traditional manufacturing processes by increasing flexibility and creating an advantage to manufacture customized products at low costs. In this study, a unique eyeglass frame was designed to have a snake shape, which has an asymmetric geometry unlike traditional frames. The eyeglass frame was designed in a customized manner by reflecting dimensional characteristics of a customer's face. Finite element analysis was performed to investigate the structural safety of the 3D printed frames during the assembly process. The analysis also considered the effect of anisotropic material properties as determined by tensile tests. The eyeglass frame was then printed using the customized sizes and the best building process. The eyeglass frame was successfully assembled with lenses and without structural failure during its assembly procedure.

• Smart Structures and Systems
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• v.21 no.4
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• pp.421-433
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• 2018

Carbon fiber reinforced polymer (CFRP) cable has good mechanical properties and corrosion resistance. However, the anchorage of CFRP cable is a big issue due to the anisotropic property of CFRP material. In this article, a high-efficient bonding anchorage with novel configuration is developed for CFRP cables. The acoustic emission (AE) technique is employed to evaluate the performance of anchorage in the fatigue test and post-fatigue ultimate bearing capacity test. The obtained AE signals are analyzed by using a combination of unsupervised K-means clustering and supervised K-nearest neighbor classification (K-NN) for quantifying the performance of the anchorage and damage evolutions. An AE feature vector (including both frequency and energy characteristics of AE signal) for clustering analysis is proposed and the under-sampling approaches are employed to regress the influence of the imbalanced classes distribution in AE dataset for improving clustering quality. The results indicate that four classes exist in AE dataset, which correspond to the shear deformation of potting compound, matrix cracking, fiber-matrix debonding and fiber fracture in CFRP bars. The AE intensity released by the deformation of potting compound is very slight during the whole loading process and no obvious premature damage observed in CFRP bars aroused by anchorage effect at relative low stress level, indicating the anchorage configuration in this study is reliable.

• Journal of the Korean Electrochemical Society
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• v.5 no.1
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• pp.1-6
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• 2002

Silver doped vanadium pentoxides with a doping ratio Ag/V ranging from 0.03 to 0.11 were synthesized by sol-gel process, and $Li/Ag_xV_2O_5$ cell was investigated by the electrochemical methods. It appears to be amorphous layered material and entangled fibrous textures has been grown to form anisotropic corrugated fibrils. NMR measurements revealed that several different kinds of $Li^+$ ions exist in the lithium intercalated xerogel electrodes and the average cell potential was about 3.0V vs. $Li/Li^+$. The cell capacity of the silver doped $Ag_xV_2O_5$ xerogel cathodes was more than 359 mAh/g at discharge current 10mA/g and cycle efficiency $94\%$ was achieved.

• Composites Research
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• v.15 no.6
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• pp.38-43
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• 2002

Rapid Prototyping(RP) technologies provide the ability to fabricate initial prototypes from various model materials. Stratasys' Fused Deposition Modeling(FDM) is a typical RP process that can fabricate prototypes out of plastic materials, and the parts made from FDM were often used as load-carrying elements. Because FDM deposits materials in about 300$\mu$m thin filament with designated orientation, parts made from FDM show anisotropic material properties. In this paper an analytic model was proposed to predict the tensile strength of FDM parts. Applying the Classical Lamination Theory, which was developed for laminated composite materials, a computer code was implemented. Tsai-Wu failure criterion was added to the code to predict the failure of the FDM parts. The tensile strengths predicted by the analytic model were compared with experimental data. The data and prediction agreed reasonably well to prove the validity of the model. In addition, a web-based advisory service(FDMAS) was developed to provide strength prediction and design rules for FDM parts.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

• Journal of the Korean Magnetics Society
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• v.26 no.3
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• pp.76-80
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• 2016

CoSiB is the amorphous ferromagnetic material and multilayer consisting of CoSiB and Pd has perpendicular magnetic anisotropic property. PMA has strong advantages for STT-MRAM. Moreover, amorphous materials have two advantages more than crystalline materials: no grain boundary and good thermal stability. Therefore, we studied the magnetic properties of multilayers consisting of the $Co_{75}Si_{15}B_{10}$ with PMA. In this study, we investigated the magnetic property of the [CoSiB (3, 4, 5, and 6) ${\AA}$/Pd(11, 13, 15, 17, 19,and $24{\AA})]_5$ multilayers and found the annealing temperature dependence of the magnetic property. The annealing temperature range is from room temperature to $500^{\circ}C$. The coercivity and the saturation magnetization of the CoSiB/Pd multilayer system have a close association with the annealing temperature. Moreover, the coercivity especially shows a sudden increasing at the specific annealing temperature.