• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• v.3B no.1
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• pp.32-36
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• 2003

The three-phase canned induction motor, which consists of a stator and rotor with a seal can, is used for the main coolant pump (MCP) of the System-integrated Modular Advanced Reactor (SMART). The thermal characteristics of the can must be estimated exactly, since the eddy current loss of the can is a dominant parameter in design. Besides the insulation of the motor winding is compared of Teflon, glass fiber, and air, so it is not an easy task to analyze. A FEM thermal analysis was per-formed by using the thermal properties of complex insulation which were obtained by comparing the results of finite element thermal analysis and those of the experiment. As a result, it is shown that the characteristics of prototype canned induction motor have a good agreement with the results of FEM.

• Korean Journal of Computational Design and Engineering
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• v.9 no.4
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.221-226
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• 2002

This paper presents the thermal characteristics analysis of a high-speed HMC(horizontal machining center) with spindle speed of 30,000rpm and fried rate of 40m/min. The spindle speed is achieved by introducing angular contact ball bearings, oil-jet lubrication method, oil jacket cooling method, and so on. The spindle system is a motor-separated type composed of the main spindle and sub-spindle which are mechanically connected by the flexible coupling. The spindles are supported by two front and rear bearings, and the built-in motor is located between the front to and rear bearings of the sub-spindle. The thermal analysis model of HMC is constructed by the finite element method, and the thermal characteristics in the design stage are estimated based on temperature distribution and heat flow under the various testing conditions related to spindle speed and feed rate.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.441-446
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• 2001

This paper presents the thermal characteristics analysis of a high-speed HMC spindle system with angular contact ball bearings, built-in motor, oil-jet lubrication method, oil jacket cooling method, and so on. The spindle system is composed of the main spindle and sub-spindle which are mechanically connected by a flexible coupling. The spindles are supported by two front and rear bearings, and the built-in motor is located between the front and rear bearings of the sub-spindle. The thermal analysis model of spindle system is constructed by the finite element method, and the thermal characteristics in the design stage are estimated based on temperature distribution and heat flow under the various testing conditions related to material of bearing ball, spindle speed and coolant temperature.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.1
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• pp.32-37
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• 2007

The outer diameter finishing grinding process required for ferrules, which are widely used as fiber optic connectors, is carried out by high-precision centerless grinding machines. In this study, the thermal characteristics of such a machine, for example, the temperature distribution, temperature rise, and thermal deformation, were estimated based on a virtual prototype and the heat generation rates of heat sources related to normal operating conditions. The prototype consisted of a concrete-filled bed. hydrostatic grinding wheel (GW) and regulating wheel (RW) spindle systems, a hydrostatic RW feed mechanism, a RW swivel mechanism, and on-machine GW and RW dressers. The reliability of the predicted results was demonstrated using temperature characteristics measured from a physical prototype. The predicted and measured results indicated that this particular high-precision centerless grinding machine had very stable thermal characteristics.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.57-58
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• 2006

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, Ansys and thermal distributions form experiments.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.416-423
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• 2004

This paper presents the thermal characteristic analysis of a high-speed horizontal machining center with spindle speed of 50,000rpm and feedrate of 120m/fin. The spindle system is designed based on the built-in motor, angular contact ceramic ball bearings, oil-air lubrication and oil-jacket cooling method. The X-axis and Y-axis feeding systems are composed of the linear motors and linear motion guides, and the Z-axis feeding system is composed of the servo-motor, ball screw and linear motion guides. The thermal characteristics such as the temperature distribution, temperature rise, thermal deformation and step response, are estimated based on the finite element model of machining center and the heat generation rates of heat sources related to the machine operation conditions. Especially, the thermal time constant assessed from the step response function is introduced as an index of thermal response characteristics.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.5
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• pp.30-37
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• 2004

This paper presents the thermal characteristic analysis of a high-speed horizontal machining center with spindle speed of 50,000rpm and feedrate of 120m／min. The spindle system is designed based on the built-in motor, angular contact ceramic ball bearings, oil-air lubrication and oil-jacket cooling method. The X-axis and Y-axis feeding systems are composed of the linear motors and linear motion guides, and the Z-axis feeding system is composed of the servo-motor, ball screw and linear motion guides. The thermal characteristics such as the temperature distribution, temperature rise, thermal deformation and step response, are estimated based on the finite element model of machining center and the heat generation rates of heat sources related to the machine operation conditions. Especially, the thermal time constant assessed from the step response function is introduced as an index of thermal response characteristics.

• KIEAE Journal
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• v.15 no.6
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• pp.11-18
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• 2015

Purpose: The current study analyzed trends in thermal insulation performance with aging, and condensation characteristics caused by the former. Method: Thermal insulation and condensation prevention performance of an architecture were assessed using Temperature Difference Ration Inside, or TDRi. Subjects of this quantitative analysis in thermal insulation performance change due to aging included recently constructed apartments and aged apartments older than 40 years. Time series comparison and analysis were conducted to observed changes in the thermal insulation performance and condensation characteristics. Result: Analysis showed that wall insulation performance degraded with aging regardless of fortified insulating material usage or insulating material type, which caused increased danger of condensation. In addition, when fortified insulating material was installed on the connection between the walls, insulation performance degradation was lower compared to cases in which fortified materials were not used. In all cases from 1 to 10, the rate of thermal insulation performance degradation increased after 20 years of aging.