• 제목/요약/키워드: Amorphous wire

검색결과 47건 처리시간 0.018초

Kinetic and Thermodynamic Features of Combustion of Superfine Aluminum Powders in Air

  • Kwon, Young-Soon;Park, Pyuck-Pa;Kim, Ji-Soon;Gromov, Alexander;Rhee, Chang-Kyu
    • 한국분말재료학회지
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    • 제11권4호
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    • pp.308-313
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    • 2004
  • An experimental study on the combustion of superfine aluminum powders (average particle diameter, a$_{s}$: ∼0.1 ${\mu}{\textrm}{m}$) in air is reported. The formation of aluminum nitride during the combustion of aluminum in air and the influence of the combustion scenario on the structures and compositions of the final products are in the focus of this study. The experiments were conducted in an air (pressure: 1 atm). Superfine aluminum powders were produced by the wire electrical explosion method. Such superfine aluminum powder is stable in air but once ignited it can burn in a self-sustaining way due to its low bulk: density (∼0.1 g/㎤) and a low thermal conductivity. During combustion, the temperature and radiation were measured and the actual burning process was recorded by a video camera. Scanning electron microscopy (SEM), X-ray diffraction (XRD) and chemical analysis were performed on the both initial powders and final products. It was found that the powders, ignited by local heating, burned in a two-stage self-propagating regime. The products of the first stage consisted of unreacted aluminum (-70 mass %) and amorphous oxides with traces of AlN. After the second stage the AlN content exceeded 50 mass % and the residual Al content decreased to ∼10 mass %. A qualitative discussion is given on the kinetic limitation for AlN oxidation due to rapid condensation and encapsulation of gaseous AlN.N.

Amalgam 부식산물의 정성분석에 관한 연구 (A QUANTITATIVE ANALYSIS OF THE IN VIVO AMALGAM CORROSION PRODUCTS)

  • 임병목;엄정문
    • Restorative Dentistry and Endodontics
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    • 제16권2호
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    • pp.1-17
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    • 1991
  • The purpose of this study was to analyze the in vivo amalgam corrosion products qualitatively. 30 molars with large, intact amalgam restorations were selected. All the restorations were more than 5 years old. Twenty of the removed amalgams were embedded in acrylic resin block. The exposed surfaces of fifteen embedded amalgams were polished by amalgam polishing kit, and the rest were observed without polishing. The remaining 10 amalgams were fractured centrally and perpendiculary to the occlusal surface with a wire-cutter. After all specimens were cleaned ultrasonically in distilled water, each surface was examined under S.E.M. and E.D.A.X. (Energy Dispersive Micro X-ray Analyzer) to determine the morphology and chemical nature of the corrosion products. The following results were obtained: 1. The surfaces of the unpolished amalgam restorations were covered with thin amorphous layer of Sn-Ca-P-S complex with numerous cracks. 2. In the conventional amalgams, the major corrosion products were Sn-Cl phases however, tin oxide phases were also observed. 3. Only tin oxide phase was identified in the high copper amalgam, but it was less frequently observed than in the conventional amalgam. 4. It was easier to observe the corrosion product morphology in the fractured surfaces than in the polished ones. The morphologies of the corrosion product crystals looked like a stack of slightly bended plates in the Sn-Cl phases and polyhedra or polygonal prisms in the tin oxide phases.

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폐기물공정시험방법을 이용한 PCBs 함유 고상폐기물의 적용성 평가 (Assessment of PCBs-containing solid wastes using official wastes test method)

  • 김교근
    • 분석과학
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    • 제23권3호
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    • pp.261-268
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    • 2010
  • 본 연구에서는 최근 제안된 PCBs 함유 고상폐기물 공정시험방법을 토대로 PCBs 함유 변압기에서 90건의 시료를 채취 분석하였으며, 제시한 분석방법의 폐기물 시료에 적정성 여부를 검토하였다. 채취한 변압기 절연유에서의 PCBs 농도범위는 7.6~23.8 mg/L로 나타났으며, 규소강판은 $0.02\sim0.54\;{\mu}g/100cm^2$의 농도범위로 검출되었다. 또한, 구리선 등의 비정형 폐기물은 0.01~0.071 mg/kg의 농도범위로 검출 되었다. 본 연구 결과, 폐기물공정시험방법의 새로운 분석방법과 규제기준은 기존의 용출시험방법으로 고상폐기물을 관리하는 경우에 비해 PCBs 함유 폐기물의 관리가 보다 강화된 것으로 판단된다.

Epitaxial Growth of Boron-doped Si Film using a Thin Large-grained Si Seed Layer for Thin-film Si Solar Cells

  • Kang, Seung Mo;Ahn, Kyung Min;Moon, Sun Hong;Ahn, Byung Tae
    • Current Photovoltaic Research
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    • 제2권1호
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    • pp.1-7
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    • 2014
  • We developed a method of growing thin Si film at $600^{\circ}C$ by hot wire CVD using a very thin large-grained poly-Si seed layer for thin-film Si solar cells. The seed layer was prepared by crystallizing an amorphous Si film by vapor-induced crystallization using $AlCl_3$ vapor. The average grain size of the p-type epitaxial Si layer was about $20{\mu}m$ and crystallographic defects in the epitaxial layer were mainly low-angle grain boundaries and coincident-site lattice boundaries, which are special boundaries with less electrical activity. Moreover, with a decreasing in-situ boron doping time, the mis-orientation angle between grain boundaries and in-grain defects in epitaxial Si decreased. Due to fewer defects, the epitaxial Si film was high quality evidenced from Raman and TEM analysis. The highest mobility of $360cm^2/V{\cdot}s$ was achieved by decreasing the in-situ boron doping time. The performance of our preliminary thin-film solar cells with a single-side HIT structure and $CoSi_2$ back contact was poor. However, the result showed that the epitaxial Si film has considerable potential for improved performance with a reduced boron doping concentration.

Solenoid 형태의 초소형 SMD RF 칩 인덕터에 대한 주파수 특성 (Frequency Characteristics for Micro-scale SMD RE Chip Inductors of Solenoid-Type)

  • 김재욱
    • 한국산학기술학회논문지
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    • 제8권3호
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    • pp.454-459
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    • 2007
  • 본 논문에서는 비정질 $Al_2O_3$ 코아 재료를 응용한 단순 solenoid 형태의 소형 고성능 RF 칩 인덕터를 연구하였다. 인덕터 크기는 $0.86{\times}0.46{\times}0.45mm^3$이고, $27{\mu}m$ 직경의 Cu를 코일로 사용하였다. RF 칩 인덕터의 인덕턴스(L), 양호 인자(Q), 임피던스(Z), 커패시턴스(C)와 등가회로 파라미터 등의 주파수 특성은 RF impedance/Material Analyzer (HP16193A test fixture가 장착된 HP4291B)로 측정되었다. $9{\sim}12$회의 권선수를 가진 RF 칩 인덕터들의 인덕턴스 값은 $21{\sim}34nH$ 범위를 가진다. 이들의 자기공진주파수(SRF)는 $5.7{\sim}3.7GHz$ 영역을 나타낸다. 또한 자기공진주파수가 증가함에 따라 인덕턴스 값이 감소하는 경향을 보이고 있다. 인덕터의 SRF는 인덕턴스가 증가함에 따라 감소하며, Q의 값은 $900MHz{\sim}1.7GHz$ 주파수 범위에서 최대 $38{\sim}49$까지 얻어졌다.

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Silicide-Enhanced Rapid Thermal Annealing을 이용한 다결정 Si 박막의 제조 및 다결정 Si 박막 트랜지스터에의 응용 (Fabrication of Polycrystalline Si Films by Silicide-Enhanced Rapid Thermal Annealing and Their Application to Thin Film Transistors)

  • 김존수;문선홍;양용호;강승모;안병태
    • 한국재료학회지
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    • 제24권9호
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    • pp.443-450
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    • 2014
  • Amorphous (a-Si) films were epitaxially crystallized on a very thin large-grained poly-Si seed layer by a silicide-enhanced rapid thermal annealing (SERTA) process. The poly-Si seed layer contained a small amount of nickel silicide which can enhance crystallization of the upper layer of the a-Si film at lower temperature. A 5-nm thick poly-Si seed layer was then prepared by the crystallization of an a-Si film using the vapor-induced crystallization process in a $NiCl_2$ environment. After removing surface oxide on the seed layer, a 45-nm thick a-Si film was deposited on the poly-Si seed layer by hot-wire chemical vapor deposition at $200^{\circ}C$. The epitaxial crystallization of the top a-Si layer was performed by the rapid thermal annealing (RTA) process at $730^{\circ}C$ for 5 min in Ar as an ambient atmosphere. Considering the needle-like grains as well as the crystallization temperature of the top layer as produced by the SERTA process, it was thought that the top a-Si layer was epitaxially crystallized with the help of $NiSi_2$ precipitates that originated from the poly-Si seed layer. The crystallinity of the SERTA processed poly-Si thin films was better than the other crystallization process, due to the high-temperature RTA process. The Ni concentration in the poly-Si film fabricated by the SERTA process was reduced to $1{\times}10^{18}cm^{-3}$. The maximum field-effect mobility and substrate swing of the p-channel poly-Si thin-film transistors (TFTs) using the poly-Si film prepared by the SERTA process were $85cm^2/V{\cdot}s$ and 1.23 V/decade at $V_{ds}=-3V$, respectively. The off current was little increased under reverse bias from $1.0{\times}10^{-11}$ A. Our results showed that the SERTA process is a promising technology for high quality poly-Si film, which enables the fabrication of high mobility TFTs. In addition, it is expected that poly-Si TFTs with low leakage current can be fabricated with more precise experiments.

화학적인 용액 코팅방법에 의한 박막형 고온초전도체에 사용되는 SUS310 금속모재의 평탄화 연구 (Planarization of SUS310 Metal Substrate Used for Coated Conductor Substrate by Chemical Solution Coating Method)

  • 이종범;이현준;김병주;권병국;김선진;이종수;이철영;문승현;이희균;홍계원
    • Progress in Superconductivity
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    • 제12권2호
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    • pp.118-123
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    • 2011
  • The properties of $2^{nd}$ generation high temperature superconducting wire, coated conductor strongly depend on the quality of superconducting oxide layer and property of metal substrate is one of the most important factors affecting the quality of coated conductor. Good mechanical and chemical stability at high temperature are required to maintain the initial integrity during the various process steps required to deposit several layers consisting coated conductor. And substrate need to be nonmagnetic to reduce magnetization loss for ac application. Hastelloy and stainless steel are the most suitable alloys for metal substrate. One of the obstacles in using stainless steel as substrate for coated conductor is its difficulties in making smooth surface inevitable for depositing good IBAD layer. Conventional method involves several steps such as electro polishing, deposition of $Al_2O_3$ and $Y_2O_3$ before IBAD process. Chemical solution deposition method can simplify those steps into one step process having uniformity in large area. In this research, we tried to improve the surface roughness of stainless steel(SUS310). The precursor coating solution was synthesized by using yttrium complex. The viscosity of coating solution and heat treatment condition were optimized for smooth surface. A smooth amorphous $Y_2O_3$ thin film suitable for IBAD process was coated on SUS310 tape. The surface roughness was improved from 40nm to 1.8 nm by 4 coatings. The IBAD-MgO layer deposited on prepared substrate showed good in plane alignment(${\Delta}{\phi}$) of $6.2^{\circ}$.