• Journal of the Korean Society of Radiology
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• v.1 no.1
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• pp.11-16
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• 2007

In this study, we have performed contrast-detail analysis for an amorphous selenium(a-Se) based digital X-ray imaging system by using a contrast-detail phantom(CDRAD 2.0) to test its low contrast performance. The X-ray imaging system utilizes an 500-mm-thick a-Se semiconductor X-ray absorber coated over an amorphous silicon(a-Si) TFT(thin-film transistor) detector matrix with a $139mm{\times}139mm$ pixel size and a $46.7cm{\times}46.7cm$ active area. In the measurement of contrast-detail curves we first acquired X-ray images of the CDRAD 2.0 phantom at given test conditions(i.e., 40, 50, 60, 70, 80 kVp, and 16 mA.s), and then evaluated the contrast-detail characteristics of the imaging system from each phantom image by using an image quality factor called the image-quality-figure-inverse(IQFinv). The IQFinv values for the imaging system gradually improved with the photon fluence, indicating the improvement of image visibility: 24.4, 35.3, 39.2, 41.5, and 43.4 at photon fluences of $1.8{\times}105$, $5.9{\times}105$, $11.3{\times}105$, $19.4{\times}105$, and $29.4{\times}105$ photons/$mm^2$, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.344-344
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• 2014

Transparent amorphous oxide semiconductors such as a In-Ga-Zn-O (a-IGZO) have advantages for large area electronic devices; e.g., uniform deposition at a large area, optical transparency, a smooth surface, and large electron mobility >10 cm2/Vs, which is more than an order of magnitude larger than that of hydrogen amorphous silicon (a-Si;H).1) Thin film transistors (TFTs) that employ amorphous oxide semiconductors such as ZnO, In-Ga-Zn-O, or Hf-In-Zn-O (HIZO) are currently subject of intensive study owing to their high potential for application in flat panel displays. The device fabrication process involves a series of thin film deposition and photolithographic patterning steps. In order to minimize contamination, the substrates usually undergo a cleaning procedure using deionized water, before and after the growth of thin films by sputtering methods. The devices structure were fabricated top-contact gate TFTs using the a-IGZO films on the plastic substrates. The channel width and length were 80 and 20 um, respectively. The source and drain electrode regions were defined by photolithography and wet etching process. The electrodes consisting of Ti(15 nm)/Al(120 nm)/Ti(15nm) trilayers were deposited by direct current sputtering. The 30 nm thickness active IGZO layer deposited by rf magnetron sputtering at room temperature. The deposition condition is as follows: a rf power 200 W, a pressure of 5 mtorr, 10% of oxygen [O2/(O2+Ar)=0.1], and room temperature. A 9-nm-thick Al2O3 layer was formed as a first, third gate insulator by ALD deposition. A 290-nm-thick SS6908 organic dielectrics formed as second gate insulator by spin-coating. The schematic structure of the IGZO TFT is top gate contact geometry device structure for typical TFTs fabricated in this study. Drain current (IDS) versus drain-source voltage (VDS) output characteristics curve of a IGZO TFTs fabricated using the 3-layer gate insulator on a plastic substrate and log(IDS)-gate voltage (VG) characteristics for typical IGZO TFTs. The TFTs device has a channel width (W) of $80{\mu}m$ and a channel length (L) of $20{\mu}m$. The IDS-VDS curves showed well-defined transistor characteristics with saturation effects at VG>-10 V and VDS>-20 V for the inkjet printing IGZO device. The carrier charge mobility was determined to be 15.18 cm^2 V-1s-1 with FET threshold voltage of -3 V and on/off current ratio 10^9.

• Korean Journal of Optics and Photonics
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• v.34 no.6
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• pp.241-247
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• 2023

We examine the spectral characteristics of laser-induced periodic surface structures (LIPSSs) formed on an amorphous silicon film irradiated by a 355-nm nanosecond laser. A Gaussian beam with a diameter of 196 ㎛ is used to perform a two-dimensional raster scan. The laser's pulse number is varied from 190 to 280, and its intensity is adjusted within 100-130 mJ/cm². LIPSSs with a periodicity of approximately 330 nm form on the surface of the Si film, aligned perpendicular to the laser's polarization. Transmission spectra of the samples show dips around 700 nm for transverse electric polarization and around 500 nm for transverse magnetic polarization. The features are investigated with a one-dimensional-grating model using a rigorous coupled-wave analysis. Simulations confirm that the observed dips are due to the resonant modes, depending on the polarization.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.311-311
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• 2016

최근 고성능 디스플레이 개발이 요구되면서 기존 비정질 실리콘(a-Si)을 대체할 산화물 반도체에 대한 연구 관심이 급증하고 있다. 여러 종류의 산화물 반도체 중 a-IGZO (amorphous indium-gallium-zinc oxide)가 높은 전계효과 이동도, 저온 공정, 넓은 밴드갭으로 인한 투명성 등의 장점을 가지며 가장 연구가 활발하게 보고되고 있다. 기존에는 SG(단일 게이트) TFT가 주로 제작 되었지만 본 연구에서는 DG(이중 게이트) 구조를 적용하여 고성능의 a-IGZO 기반 박막 트랜지스터(TFT)를 구현하였다. SG mode에서는 하나의 게이트가 채널 전체 영역을 제어하지만, double gate mode에서는 상, 하부 두 개의 게이트가 동시에 채널 영역을 제어하기 때문에 채널층의 형성이 빠르게 이루어지고, 이는 TFT 스위칭 속도를 향상시킨다. 또한, 상호 모듈레이션 효과로 인해 S.S(subthreshold swing)값이 낮아질 뿐만 아니라, 상(TG), 하부 게이트(BG) 절연막의 계면 산란 현상이 줄어들기 때문에 이동도가 향상되고 누설전류 감소 및 안정성이 향상되는 효과를 얻을 수 있다. Dual gate mode로 동작을 시키면, TG(BG)에는 일정한 positive(or negative)전압을 인가하면서 BG(TG)에 전압을 가해주게 된다. 이 때, 소자의 채널층은 depletion(or enhancement) mode로 동작하여 다른 전기적인 특성에는 영향을 미치지 않으면서 문턱 전압을 쉽게 조절 할 수 있는 장점도 있다. 제작된 소자는 p-type bulk silicon 위에 thermal SiO2 산화막이 100 nm 형성된 기판을 사용하였다. 표준 RCA 클리닝을 진행한 후 BG 형성을 위해 150 nm 두께의 ITO를 증착하고, BG 절연막으로 두께의 SiO2를 300 nm 증착하였다. 이 후, 채널층 형성을 위하여 50 nm 두께의 a-IGZO를 증착하였고, 소스/드레인(S/D) 전극은 BG와 동일한 조건으로 ITO 100 nm를 증착하였다. TG 절연막은 BG 절연막과 동일한 조건에서 SiO2를 50 nm 증착하였다. TG는 S/D 증착 조건과 동일한 조건에서, 150 nm 두께로 증착 하였다. 전극 물질과, 절연막 물질은 모두 RF magnetron sputter를 이용하여 증착되었고, 또한 모든 patterning 과정은 표준 photolithography, wet etching, lift-off 공정을 통하여 이루어졌다. 후속 열처리 공정으로 퍼니스에서 질소 가스 분위기, $300^{\circ}C$ 온도에서 30 분 동안 진행하였다. 결과적으로 $9.06cm2/V{\cdot}s$, 255.7 mV/dec, $1.8{\times}106$의 전계효과 이동도, S.S, on-off ratio값을 갖는 SG와 비교하여 double gate mode에서는 $51.3cm2/V{\cdot}s$, 110.7 mV/dec, $3.2{\times}108$의 값을 나타내며 훌륭한 전기적 특성을 보였고, dual gate mode에서는 약 5.22의 coupling ratio를 나타내었다. 따라서 산화물 반도체 a-IGZO TFT의 이중게이트 구조는 우수한 전기적 특성을 나타내며 차세대 디스플레이 시장에서 훌륭한 역할을 할 것으로 기대된다.

• Resources Recycling
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• v.25 no.6
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• pp.73-81
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• 2016

Geopolymers produced from aluminosilicate materials such as metakaolin and coal ash react with alkali activators and show higher fire resistance than portland cement, due to amorphous inorganic polymer. The percentage of thermal shrinkage of geopolymers ranges from less than 0.5 % to about 3 % until $600^{\circ}C$, and reaches about 5 ~ 7 % before melting. In this study, geopolymers paste having Si/Al = 1.5 and being mixed with carbon nanofibers, silicon carbide, pyrex glass, and vermiculite, and ISO sand were studied in order to understand the compressive strength and the effects of thermal shrinkage of geopolymers. The compressive strength of geopolymers mixed by carbon nanofibers, silicon carbide, pyrex glass, or vermiculite was similar in the range from 35 to 40 MPa. The average compressive strength of a geopolymers mixed with 30 wt.% of ISO sand was lowest of 28 MPa. Thermal shrinkage of geopolymers mixed with ISO sand decreased to about 25 % of paste. This is because the aggregate particles expanded on firing and to compensate the shrinkage of paste. The densification of the geopolymer matrix and the increase of porosity by sintering at $900^{\circ}C$ were observed regardless of fillers.

• Advances in Energy Research
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• v.1 no.2
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• pp.97-106
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• 2013

This study designs and tests a photovoltaic system with distributed maximum power point tracking (DMPPT) methodology using a field programmable gate array (FPGA) controller. Each solar panel in the distributed PV system is equipped with a newly designed DC/DC converter and the panel's voltage output is regulated by a FPGA controller using PI control. Power from each solar panel on the system is optimized by another controller where the quadratic maximization MPPT algorithm is used to ensure the panel's output power is always maximized. Experiments are carried out at atmospheric insolation with partial shading conditions using 4 amorphous silicon thin film solar panels of 2 different grades fabricated by Chi-Mei Energy. It is found that distributed MPPT requires only 100ms to find the maximum power point of the system. Compared with the traditional centralized PV (CPV) system, the distributed PV (DPV) system harvests more than 4% of solar energy in atmospheric weather condition, and 22% in average under 19% partial shading of one solar panel in the system. Test results for a 1.84 kW rated system composed by 8 poly-Si PV panels using another DC/DC converter design also confirm that the proposed system can be easily implemented into a larger PV power system. Additionally, the use of NI sbRIO-9642 FPGA-based controller is capable of controlling over 16 sets of PV modules, and a number of controllers can cooperate via the network if needed.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.7
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• pp.17-25
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• 1999

Tungsten nitride($WN_x$) films were deposited by PECVD method on silicon nitride($WSi_3N_4$) substrate. The characteristics of $WN_x$ film were investigated with changing various processing parameters ; substrate temperature, gas flow rate, rf power, and different nitrogen sources. The nitrogen composition in $WN_x$ film varied from 0 to 45% according to the $NH_3$ and $N_2$ flow rate. The highest deposition rate of 160 nm/min was obtained for the $NH_3$ gas and relatively low deposition rate of $WN_x$ films were formed by $N_2$ gas. $WN_x$ films deposited on $WSi_3N_4$ substrate had higher deposition rate than that of TiN and Si substrates. The purity of $WN_x$ film were analyzed by AES and higher purity $WN_x$ films were deposited using $NH_3$ gas. The XRD analysis indicates a phase transition from polycrystalline tungsten(W) to amorphous tungsten nitride($WN_x$), showing improved etching profile of $WN_x$ films Thick $WN_x$ films were deposited on various substrates such as Tin, NiCr and Al and maximum thickness of $1.6 {\mu}m$ was obtained on the Al adhesion layer.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.2
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• pp.114-121
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• 2001

A circuit model for active-controlled field emitter array(ACFEA) as an electron source of active-controlled field emission display(ACFED) has been proposed. The ACFEA with hydrogenated amorphous silicon thin-film transistor(a-Si:H TFT) and Spindt-type molibdenum tips (Spindt-Mo FEA) has been fabricated monolithically on the same glass. A-Si:H TFT is used as a control device of field emitters, resulting in stabilizing emission current and lowering driving voltage. The basic model parameters extracted from the electrical characteristics of the fabricated a-Si:H TFT and Spindt-Mo FEA were implemented into the ACFEA model with a circuit simulator SPICE. The accuracy of the equivalent circuit model was verified by comparing the simulated results with the measured one through DC analysis of the ACFEA. The transient analysis of the ACFEA showed that the gate capacitance of FEA along with the drivability of TFT strongly affected the response time. With the fabricated ACFEA, we obtained a response time of 15$mutextrm{s}$, which was enough to make 4bit/color gray scale with the pulse width modulation (PWM).

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.105.2-105.2
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• 2011

화비정질 실리콘의 빛에 의한 노화현상 (light-induced degradation; LID)은 이미 1977년 보고된 Staebler-Wronski 효과에 의해서 확인된 바 있다. 이는 비정질 실리콘이 빛에 노출될 때, 이미 포함되어 있는 수소원자가 빛 에너지에 의해서 이동하게 되고, 이로 인해서 생성 또는 소멸되는 댕글링 본드 때문에 일어난다. 특히, 일상적인 태양광의 노출 하에서 태양전지의 장시간 성능을 예측하는데 물리적인 이해의 부족 및 기술 환경적인 어려움이 있고, 이러한 요인들은 안정된 태양전지를 개발하는데 장해요인으로 나타난다. 그러므로 비정질 실리콘 태양전지가 장시간 태양광에 노출되어 시간이 지남에 따라서 "성능이 어떻게 변하는지?" 그리고 "이에 대한 원인은 무엇인지?" 등은 여전히 과학적으로 풀어야할 숙제로 남아있다. 본 논문에서는 비정질 실리콘으로 구성된 태양전지가 태양광에 노출될 때 시간이 지남에 따라서 (1) 성능이 어떻게 변하는지, (2) LID의 변화는 언제 안정화되는지, 그리고 (3) 성능변화에 대한 원인은 무엇인지에 대해서 논의한다. 본 논문은 장시간 빛에 노출되는 비정질 실리콘 태양전지의 성능예측에 관해서 연구하였다. 결함밀도의 운동학적 모형을 통해서 태양광 노출에 대한 태양전지 성능변화를 예측하는데 초점을 맞추었고, 이를 위해서 태양전지에 조사되는 태양광 세기, 주변온도, 등이 고려되었다. 특히, 전하운반자의 수명이 결함밀도에 의해서 결정되기 때문에 비정질 실리콘 태양전지의 빛에 대한 노화현상 (LID)이 확장지수함수 (stretched-exponential) 완화법칙을 따르는 결함밀도에 의해서 물리적으로 설명된다. 한편 이와 같은 물리적 계산의 유용성을 확인하기 위해서 동일한 태양전지에 대해서 AMPS-1D 컴퓨터 프로그램을 사용하였고, 이를 통해서 비정질 실리콘 태양전지의 빛에 대한 노화현상을 물리적 및 정량적으로 이해하였다. 본 연구에 적용되는 태양전지는 비정질 실리콘으로 구성된 pin 구조 (glass/$SnO_2$/a-SiC:H:B/a-Si:H/a-Si:H:P/ITO)로서 다음과 같은 특성을 갖는다: 에너지 띠간격~1.72 eV, 두께~400 nm, 내부전위~1.05 V, 초기 fill factor~0.71, 초기 단락전류~16.4 mA/$cm^2$, 초기 개방전압 0.90 V, 초기 변환효율 10.6 %. 우리는 이와 같은 연구를 통해서 과학적으로 비정질 실리콘의 빛에 의한 노화현상을 이해하고, 기술적으로 효율 및 경제성이 높은 태양전지의 개발에 도전한다.

• Proceedings of the KIEE Conference
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• 1991.07a
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• pp.174-177
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• 1991

Fluorine-doped $SnO_2\;(SnO_2:F)$ films were prepared in ordinary atmosphere on borosilicate glass substrates using pyrosol deposition method starting from the solutions composed of $SnCl_4-5H_2O-NH_4F-CH_3OH-H_2O-HCl$ in an attempt to develop transparent conductors for use in amorphous silicon (a-Si) solar cello. The deposition rate of films increased with the increase in the content of $H_2O$, whereas it decreased with increasing the content of $CH_3OH$. When air was used as the carrier gas, the lowest electrical resistivity was obtained from a solution having $CH_3OH/H_2O$ mol ratio of about $2{\sim}3$ in the solution. The use of $N_2$ of the same flow rate as the carrier gab resulted always in the high resistive films, but the resistivity of the films decreased continuously with the increase in the content of $H_2O$. The surface morphology and preferred orientation of films were also affected by the solvent composition and the content of HCl in the solution. The room-temperature resistance of the films were fairly stable after heat-treatments up to $600^{\circ}C$.