• Applied Science and Convergence Technology
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• 제27권1호
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• pp.9-13
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• 2018

Samples of anodic oxide film used in semiconductor and display manufacturing processes were prepared at different electrolyte temperatures to investigate the corrosion resistance. The anodic oxide film was grown on aluminum alloy 6061 by using a sulfuric acid ($H_2SO_4$) electrolyte of 1.5 M at $0^{\circ}C$, $5^{\circ}C$, $10^{\circ}C$, $15^{\circ}C$, and $20^{\circ}C$. The insulating properties of the samples were evaluated by measuring the breakdown voltage, which gradually increased from 0.43 kV ($0^{\circ}C$) to 0.52 kV ($5^{\circ}C$), 1.02 kV ($10^{\circ}C$), and 1.46 kV ($15^{\circ}C$) as the electrolyte temperature was increased from $0^{\circ}C$ to $15^{\circ}C$, but then decreased to 1.24 kV ($20^{\circ}C$). To evaluate the erosion of the film by fluorine plasma, the plasma erosion and the contamination particles were measured. The plasma erosion was evaluated by measuring the breakdown voltage after exposing the film to $CF_4/O_2/Ar$ and $NF_3/O_2/Ar$ plasmas. With exposure to $CF_4/O_2/Ar$ plasma, the breakdown voltage of the film slightly decreased at $0^{\circ}C$, by 0.41 kV; however, the breakdown voltage significantly decreased at $20^{\circ}C$, by 0.83 kV. With exposure to $NF_3/O_2/Ar$ plasma, the breakdown voltage of the film slightly decreased at $0^{\circ}C$, by 0.38 kV; however, the breakdown voltage significantly decreased at $20^{\circ}C$, by 0. 77 kV. In addition, for the entire temperature range, the breakdown voltage decreased more when sample was exposed to $NF_3/O_2/Ar$ plasma than to $CF_4/O_2/Ar$ plasma. The decrease of the breakdown voltage was lower in the anodic oxide film samples that were grown slowly at lower temperatures. The rate of breakdown voltage decrease after exposure to fluorine plasma was highest at $20^{\circ}C$, indicating that the anodic oxide film was most vulnerable to erosion by fluorine plasma at that temperature. Contamination particles generated by exposure to the $CF_4/O_2/Ar$ and $NF_3/O_2/Ar$ plasmas were measured on a real-time basis. The number of contamination particles generated after the exposure to the respective plasmas was lower at $5^{\circ}C$ and higher at $0^{\circ}C$. In particular, for the entire temperature range, about five times more contamination particles were generated with exposure to $NF_3/O_2/Ar$ plasma than for exposure to $CF_4/O_2/Ar$ plasma. Observation of the surface of the anodic oxide film showed that the pore size and density of the non-treated film sample increased with the increase of the temperature. The change of the surface after exposure to fluorine plasma was greatest at $0^{\circ}C$. The generation of contamination particles by fluorine plasma exposure for the anodic oxide film prepared in the present study was different from that of previous aluminum anodic oxide films.

• 한국산학기술학회논문지
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• 제15권7호
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• pp.4665-4674
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• 2014

본 연구에서는 분리막을 이용하여 혐기성소화액을 분리막으로 고/액 분리할 때 발생하는 막오염을 방지하기 위하여 전기응집을 전처리 공정으로 적용 가능한지 여부를 평가하였다. 전기응집 공정의 전극면적, 전류밀도 및 접촉시간에 따른 막오염 저감 효과를 분석하였다. 전극 침지 면적이 작은 경우 전계의 세기가 높아져 미생물 플록 및 셀의 파괴 현상으로 인한 용존 COD의 증가 현상이 관찰되었으나, 전극 침지 면적이 큰 경우에 용존 COD는 큰 변화를 보이지 않았다. 그러나 T-P는 전극에서 용출된 알루미늄 이온과 침전하여 전기응집 후 크게 감소하였다. 전류밀도가 증가함에 따라 막 투과 플럭스가 증가하여 결과적으로 막오염 저항값 (Rc+Rf)은 감소하였다. 혐기성 소화액의 입자 크기는 전기응집 후에 약간 증가하였으나 입자크기 증가가 막오염 저감의 직접적인 원인은 아닌 것으로 나타났다. 전기응집으로 발생한 $AlPO_4$와 같은 무기성 부유 물질이 분리막 표면에서 dynamic membrane으로 작용하여 막오염을 저감시킨 것으로 나타났다.

• 전기화학회지
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• 제15권2호
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• pp.109-114
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• 2012

고분자전해질 연료전지 (PEMFC)의 공기극을 양극산화 알루미늄 (AAO) 템플레이트를 이용하여 제조하고 촉매층의 구조적 특성을 주사현미경 (SEM) 측정과 BET (Brunauer-Emmett-Teller) 분석을 통해 알아보았다. SEM 측정을 통해 일정한 크기와 모양의 Pt nanowire 가 규칙적으로 형성된 것을 확인할 수 있었다. BET 분석을 통해 AAO 템플레이트로 인하여 20-100 nm 크기의 기공 분포가 증가한 것을 확인하였다. 단위전지 성능평가와 임피던스 측정을 통하여 막-전극접합체 (MEA)의 전기화학적 특성을 분석하였다. 그 결과, AAO 템플레이트를 이용하여 제조한 MEA는 촉매층의 구조 개선으로 인하여 물질 전달 저항을 감소시킬 수 있었으며, 25%의 단위전지 성능이 향상되었다.

• 한국진공학회지
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• 제18권3호
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• pp.203-207
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• 2009

반도체 공정에서 기존 금속배선으로 사용되던 Al을 대체하여 사용되는 금속배선으로는 Cu가 그 대안으로 인식되고 있다. 이는 비저항값이 Al ($2.66{\mu}{\Omega}$-cm)보다 Cu ($1.67{\mu}{\Omega}$-cm)가 더 작아 RC 지연 시간 (RC delay time)을 극복하기 때문이다. 그러나 Cu의 녹는점은 $1085^{\circ}C$로 높지만 저온에서 쉽게 Si기판과 반응하는 특성을 가지고 있고, 또한 Si과의 접착력이 좋이 않는 것으로 알려져 있다. 이러한 이유로 Cu와 Si과의 반응을 방지하고 접착력을 높이기 위하여 확산방지막의 연구가 꾸준히 진행되고 있다. 본 연구그룹에서는 Cu의 확산을 방지하기 위하여 W-C-N의 확산방지막에 대하여 연구하여 왔다. 지금까지 보고된 연구 결과에 의하면 W-C-N (tungsten-carbon-nitrogen) 확산방지막은 고온에서도 Cu와 Si과의 확산을 효과적으로 방지하는 것으로 보고되었다. 이 논문에서는 W-C-N 확산방지막에 질소(N) 비율을 다르게 증착하여 지금까지 진행한 연구 결과를 기반으로 새로이 Cu의 전자거동현상(Electromigration)에 대하여 연구하였고, 고온 열처리 과정에서 박막의 표면강도 (Surface hardness)를 Nano-Indenter system을 이용하여 연구하였다. 이러한 연구를 통하여 박막내 질소가 포함된 W-C-N 확산방지막이 Cu의 전자거동에 더 안정적이며, 고온 열처리 과정에서도 표면 강도가 더 안정한 연구 결과를 획득하였다.

• 한국산학기술학회논문지
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• 제21권10호
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• pp.574-580
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• 2020

무기바인더는 저온에서 경화가 가능하며, 유해가스를 배출하지 않는 친환경성과 중자 조형 시 성형된 제품의 결함이 작다는 장점으로 인해 주조 산업에 적용하고자 관련 연구가 급속도로 진행되고 있다. 그러나 실리케이트(SiO₂-Na₂O)를 주성분으로 하는 무기바인더는 실리케이트 특유의 흡습성으로 인해 공기 중 수분을 흡습하여 결합력이 약해져 주형의 강도가 급격히 감소하는 문제가 있다. 특히 주강 주조에 사용되는 사형 주형의 경우 알루미늄 주조보다 높은 주입 온도로 인해 고강도의 주물 특성을 요구한다. 이에 본 연구에서는 무기바인더의 강도와 흡습성을 개선하기 위해 에스테르기를 함유하는 왁스를 이용하여 이를 효율적으로 합성하는 방법을 연구하였다. 또한 합성된 무기바인더의 특성을 XRF와 TGA를 통해 확인하고, 일반강도와 내수강도 평가를 진행하여 주형의 강도 개선 여부를 확인하였다. 그 결과 에스테르기를 함유하는 왁스를 포함한 무기바인더의 경우 일반 강도가 증가하였으며, 특히 내수강도가 118 N/㎠에서 216 N/㎠까지 증가하여 약 55 %의 내수강도 개선 효과를 확인하였다. 또한 실제 주강 제품을 제작한 뒤 주조를 통해 우수한 주조 특성을 확인하였다.

• Restorative Dentistry and Endodontics
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• 제22권1호
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• pp.35-60
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• 1997

Physical properties of composite resins such as strength, resistance to wear, discoloration, etc, depend on the degree of conversion of the resin components. The clinical behavior of restorative resins varies brand to brand. Part of this variation is associated with the filler and differences in the polymer matrix. The polymer matrix of resins may differ because the involved monomers are dissimilar and because of variation in the catalyst system. The purpose of this study was to evaluate the degree of conversion of the composite resins according to the depth of cure and light curing time. 7mm diameter cylindrical aluminum molds were filled with each of five different hybrid light curing composite resins(Z-100, Charisma, Herculite XRV, Prisma TPH, Veridonfil) on the thin resin films. The molds were 1mm, 2mm, 3mm, 4mm, and 5mm in depth to produce resin films of various heights. Each sample was given 20sec, 40sec, and 60sec illumination with a light source. The degree of conversion of carbon double bonds to single bonds in the resin films was examined by means of Fourier Transform Infrared Spectrometer. The results were obtained as follows; 1. There was difference in the degree of conversion among five light curing composite resins according to the depth of cure for 20sec, 40sec, and 60sec illumination with light source with statistical significance(P<0.05). 2. Five light curing composite resins show lower degree of conversion at surface of the resin than depth of 1mm. 3. The degree of conversion of five light curing composite resins was siginificantly reduced from the maximum for the resin film when the light passed through as little as 1mm of each composite. 4. The degree of conversion of five light curing composite resins decrease significantly at the depth of 4mm, and polymerization was not occured at the depth of 5mm except for Prisma TPH. 5. The degree of conversion of five light curing composite resins was increased with increased light curing time, and there was no significant differences in the degree of conversion above 4mm in Z-100, 3mm in Charisma, and at depth of 5mm in Herculite XRV and Veridonfil(P>0.05).

• 대한치과보존학회:학술대회논문집
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• 대한치과보존학회 2001년도 춘계학술대회
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• pp.235-237
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• 2001

;Dentistry has benefited from tremendous advances in technology with the introduction of new techniques and materials, and patients are aware that esthetic approaches in dentistry can change one's appearance. Increasingly. tooth-colored restorative materials have been used for restoration of posterior teeth. Tooth-colored restoration for posterior teeth can be divided into three categories: 1) the direct techniques that can be made in a single appointment and are an intraoral procedure utilizing composites: 2) the semidirect techniques that require both an intraoral and an extraoral procedure and are luted chairside utilizing composites: and 3) the indirect techniques that require several appointments and the expertise of a dental technician working with either composites or ceramics. But, resin restoration has inherent drawbacks of microleakage. polymerization shrinkage, thermal cycling problems. and wear in stress-bearing areas. On the other hand, Ceramic restorations have many advantages over resin restorations. Ceramic inlays are reported to have less leakage than resin restoration and to fit better. although marginal fidelity depends on technique and is laboratory dependent. Adhesion of luting resin is more reliable and durable to etched ceramic material than to treated resin composite. In view of color matching, periodontal health. resistance to abrasion, ceramic restoration is superior to resin restorationl. Materials which have been used for the fabrication of ceramic restorations are various. Conventional powder slurry ceramics are also available. Castable ceramics are produced by centrifugal casting of heat-treated glass ceramics. and machinable ceramics are feldspathic porcelains or cast glass ceramics which are milled using a CAD/CAM apparatus to produce inlays (for example, Cered. They may also be copy milled using the Celay apparatus. Pressable ceramics are produced from feldspathic porcelain which is supplied in ingot form and heated and moulded under pressure to produce a restoration. Infiltrated ceramics are another class of material which are available for use as ceramic inlays. An example is $In-Ceram^{\circledR}$(Vident. California, USA) which consists of a porous aluminum oxide or spinell core infiltrated with glass and subsequently veneered with feldspathic porcelain. In the 1980s. the development of compatible refractory materials made fabrication easier. and the development of adhesive resin cements greatly improved clinical success rates. This case report presents esthetic ceramic inlays for posterior teeth.teeth.

• 대한치과보철학회지
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• 제38권4호
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• pp.427-437
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• 2000

Recently the 2nd generation laboratory composite resins were introduced. Although the mechanical properties of these composite resins have been improved, there were some disadvantages such as discoloration, low abrasion resistance and debonding between metal and resin. The purpose of this study was to evaluate the tensile bond strength between non-pecious dental alloy(verabond) and four veneering reinforced composite resins ; Targis(Ivoclar Co., U.S.A.), Artglass(Kulzer CO., Germany), Sculpture(Jeneric Pentron Co., U.S.A.), and Estonia(Kurary Co., Japan). All test metal specimens were polished with #1,000 SiC paper, and sandblasted with $250{\mu}m$ aluminum oxide. After then. according to manufacturer's instructions metal adhesive primer and veneering resins were applied. All test specimens were divided into two groups. One group was dried in a desiccator at $25^{\circ}C$ for 3 days, the other group was subjected to thermal cycling($2,000{\times}$) in water($5/55^{\circ}C$). Tensile bond strength was measured using Instron Universal Testing machine and the fractured surface was examined under the naked eyes and scanning electron microscope. Within the limitations imposed in this study, the following conclusions can be drawn: 1. In no-thermal cycling groups, there were no significant differences between Estenia and VMK68 but there were significant differences between Targis, Artglass, Sculpture and VMK68(p<0.05). 2. In no-thermal cycling resin groups, the highest tensile bond strength was observed in Estenia and there were significant differences between Estenia and the other resins(p<0.05). 3. Before and after thermal cycling, there were significant differences in tensile bond strength of Targis and Artglass(p<0.05). The tensile bond strength of Artglass was decreased and that of Targis was increased. 4. In no-thermal cycling groups, Artglass showed mixed fracture modes(95%), but after thermal cycling, Artglass showed adhesive fracture modes(75%).

• Corrosion Science and Technology
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• 제9권6호
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• pp.276-280
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• 2010

Copper(Cu) as an interconnecting metal layer can replace aluminum (Al) in IC fabrication since Cu has low electrical resistivity, showing high immunity to electromigration compared to Al. However, it is very difficult for copper to be patterned by the dry etching processes. The chemical mechanical polishing (CMP) process has been introduced and widely used as the mainstream patterning technique for Cu in the fabrication of deep submicron integrated circuits in light of its capability to reduce surface roughness. But this process leaves a large amount of residues on the wafer surface, which must be removed by the post-CMP cleaning processes. Copper corrosion is one of the critical issues for the copper metallization process. Thus, in order to understand the copper corrosion problems in post-CMP cleaning solutions and study the effects of DC biases and post-CMP cleaning solution concentrations on the Cu film, a constant voltage was supplied at various concentrations, and then the output currents were measured and recorded with time. Most of the cases, the current was steadily decreased (i.e. resistance was increased by the oxidation). In the lowest concentration case only, the current was steadily increased with the scarce fluctuations. The higher the constant supplied DC voltage values, the higher the initial output current and the saturated current values. However the time to be taken for it to be saturated was almost the same for all the DC supplied voltage values. It was indicated that the oxide formation was not dependent on the supplied voltage values and 1 V was more than enough to form the oxide. With applied voltages lower than 3 V combined with any concentration, the perforation through the oxide film rarely took place due to the insufficient driving force (voltage) and the copper oxidation ceased. However, with the voltage higher than 3 V, the copper ions were started to diffuse out through the oxide film and thus made pores to be formed on the oxide surface, causing the current to increase and a part of the exposed copper film inside the pores gets back to be oxidized and the rest of it was remained without any further oxidation, causing the current back to decrease a little bit. With increasing the applied DC bias value, the shorter time to be taken for copper ions to be diffused out through the copper oxide film. From the discussions above, it could be concluded that the oxide film was formed and grown by the copper ion diffusion first and then the reaction with any oxidant in the post-CMP cleaning solution.

• 한국표면공학회지
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• 제53권6호
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• pp.271-279
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• 2020

Non-ferrous metals, widely used in the mechanical industry, are difficult to machine, particularly by drilling and tapping. Since non-ferrous metals have a strong tendency to adhere to the cutting tool, the tool life is greatly deteriorated. Diamond-like carbon (DLC) is one of the promising candidates to improve the performance and life of cutting tool due to their low frictional property. In this study, a sacrificial DLC layer is applied on the hard nitride coated drill tool to improve the durability. The DLC coatings are fabricated by controlling the acceleration voltage of the linear ion source in the range of 0.6~1.8 kV. As a result, the optimized hardness(20 GPa) and wear resistance(1.4 x 10-8 ㎣/N·m) were obtained at the 1.4 kV. Then, the optimized DLC coating is applied as an sacrificial layer on the hard nitride coating to evaluate the performance and life of cutting tool. The Vickers hardness of the composite coatings were similar to those of the nitride coatings (AlCrN, AlTiSiN), but the friction coefficients were significantly reduced to 0.13 compared to 0.63 of nitride coatings. The drilling test were performed on S55C plate using a drilling machine at rotation speed of 2,500 rpm and penetration rate of 0.25 m/rev. The result showed that the wear width of the composite coated drills were 200 % lower than those of the AlCrN, AlTiSiN coated drills. In addition, the cutting forces of the composite coated drills were 13 and 15 % lower than that of AlCrN, AlTiSiN coated drills, respectively, as it reduced the aluminum clogging. Finally, the application of the DLC sacrificial layer prevents initial chipping through its low friction property and improves drilling quality with efficient chip removal.