• 제목/요약/키워드: Aluminum particles

검색결과 385건 처리시간 0.042초

아리랑 2호의 방사능 환경 및 영향에 관한 분석(I)- TOTAL IONIZING DOSE 영향 중심으로 - (THE ANALYSIS ON SPACE RADIATION ENVIRONMENT AND EFFECT OF THE KOMPSAT-2 SPACECRAFT(I): TOTAL IONIZING DOSE EFFECT)

  • 백명진;김학정
    • Journal of Astronomy and Space Sciences
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    • 제18권2호
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    • pp.153-162
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    • 2001
  • 본 논문에서는 아리랑 2호가 운용될 궤도의 우주방사능 환경 및 total ionizing dose(TID) 영향에 대하여 분석하였다. 포획된 양자의 경우 SAA(South Atlantic Anomaly) 지역에 집중되어 있음을 알 수 있었으며, TID에 영향을 미치는 우주 방사능은 포획된 양자 및 전자와 태양양자임을 알 수 있었다. 저 에너지 입자는 알루미늄 차단 구조물을 이용하여 방사능 영향을 효과적으로 차단할 수 있음을 알 수 있었으나, 고 에너지 입자의 경우 구조물의 두께를 증가하여도 방사능 영향을 효과적으로 차단할 수 없음을 알 수 있었다. 아리랑 2호의 임무수명기간 동안 전자부품에 계속적으로 피폭되는 전체 방사량을 알루미늄 차단두께의 함수로 나타내었으며, 이 값들은 아리랑 2호의 전자부품의 선택기준 및 위성체 또는 구성품의 구조물 두께를 설정할 수 있는 기준으로 제시하였다.

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다공성 산화알루미늄의 표면코팅에 따른 트라이볼로지적 특성연구 (Study on Tribological Behavior of Porous Anodic Aluminum Oxide with respect to Surface Coating)

  • 김영진;김현준
    • Tribology and Lubricants
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    • 제33권6호
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    • pp.275-281
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    • 2017
  • In this work, we have fabricated anodic aluminum oxide (AAO) with ordered nanoscale porosity through an anodization process. We deposited gold and nano-organic thin films on the porous AAO surface to protect its structure and reduce friction. We investigated the tribological characteristics of the porous AAO with respect to the protective surface coatings using tribometers. While investigating the frictional characteristics of the samples by applying normal forces of the order of micro-Newton, we observed that AAO without a protective coating exhibits the highest friction coefficient. In the presence of protective surface coatings, the friction coefficient decreases significantly. We applied normal forces of the order of milli-Newton during the tribotests to investigate the wear characteristics of AAO, and observed that AAO without protective surface coatings experiences severe damage due to the brittle nature of the oxide layer. We observed the presence of several pieces of fractured particles in the wear track; these fractured particles lead to an increase in the friction. However, by using surface coatings such as gold thin films and nano-organic thin films, we confirmed that the thin films with nanoscale thickness protect the AAO surface without exhibiting significant wear tracks and maintain a stable friction coefficient for the duration of the tribotests.

다입자유한요소법을 이용한 Al분말 압축공정에서 입자의 거동과 변형에 관한 연구 (Particle Behavior and Deformation During Compaction of Al Powder Using MPFEM)

  • 이경훈;이정민;김병민
    • 대한기계학회논문집A
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    • 제34권4호
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    • pp.383-390
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    • 2010
  • 본 논문에서는 알루미늄 분말의 치밀화 거동을 분석하기 위하여 다입자유한요소모델을 이용한 분말압축 해석방법을 제시하였다. 다입자유한요소모델을 이용하여 압축공정 동안 압축속도와 입자크기가 입자의 변형거동과 분말의 치밀화에 미치는 영향을 조사하였다. 유한요소해석결과는 평균입도 20, $3{\mu}m$의 알루미늄 분말에 대한 일축압축시험을 통해 검증되었다. 압축시험은 만능재료시험기(MTS)를 이용하였으며 해석과 동일하게 5와 15, 30, 60mm/min 압축속도에 대해 수행되었다. 입자직경이 감소할수록 입자간 마찰이 증가하기 때문에 압출하중은 증가하였다. 압축속도가 감소할수록 증가된 입자의 회전모멘트는 입자간의 이동과 분말의 치밀화에 기여하여 최종 분말의 상대밀도를 증가시킨다.

고체 추진기관에서 산화알루미늄 입자가 노즐 내열재의 삭마에 미치는 영향 (Effects of Aluminum Oxide Particles on the Erosion of Nozzle Liner for Solid Rocket Motors)

  • 황기영;임유진;함희철
    • 한국항공우주학회지
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    • 제34권8호
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    • pp.95-103
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    • 2006
  • 알루미늄 분말이 약 20% 포함된 2종류의 고체 추진제에 대해 원료성분, 연소실에서의 연소가스 물성치 및 산화알루미늄의 입자 크기를 비교 분석하였다. 산화제(AP/HNIW) 분말이 200과 5 ${\mu}m$로 이분양상이고 47% 부피분율을 지닌 알루미늄을 함유한 PCP계 추진제는 산화제(AP) 분말이 400, 200 및 6 ${\mu}m$로 삼분양상이고 64% 부피분율을 지닌 알루미늄을 함유한 HTPB계 추진제 보다 알루미늄들이 응집될 가능성이 크다는 것을 축소부 내열재에서 채취한 산화알루미늄 입자의 SEM 사진을 통해 확인할 수 있었다. PCP계 추진제를 적용한 고체 추진기관의 노즐 축소부 내열재에서는 큰 산화알루미늄 입자의 충돌로 인해 그레인 슬랏과 일치하는 4개 원주방향 부위에서 삭마가 크게 되었지만 HTPB계 추진제를 적용한 경우에는 원주방향으로 균일하게 삭마되었다.

알루미늄 B390합금의 조직미세화에 미치는 Ca의 영향 (Effects of Ca on the Refinement of Microstructure in Aluminum B390 Alloy)

  • 김헌주
    • 한국주조공학회지
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    • 제22권5호
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    • pp.257-264
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    • 2002
  • Effects of Ca content on the refinement of primary Si of Aluminum B390 alloy have been examined. Ca was found to have an effect on the refinement of primary Si particle. Primary Si particle size has been refined as Ca content of the melts decreased and cooling rate increased. A control of Ca content by the addition of $CuCl_2$ to the melt was the most efficient in the refinement of primary Si particles. The minimum size of primary Si particles in this study was $15.0\;{\mu}m$ when a residual content of Ca element in the alloy was 5ppm, Primary Si particle size was refined as primary Si crystallization temperature increased, which was attributed to the decrease of Ca content in the melts.

DETERMINATION OF TRANSIENT WEAR DISTANCE IN THE ADHESIVE WEAR OF A6061 ALUMINIUM ALLOY REINFORCED WITH ALUMINA PARTICLES

  • Yang, L.J.
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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    • pp.217-218
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    • 2002
  • An integrated adhesive wear model was proposed to determine the transient wear and steady-state wear of aluminium alloy matrix composites. The transient wear volume was described by an exponential equation, while the steady-state wear was governed by a revised Archard equation, in which both the transient wear volume and transient sliding distance were excluded. A mathematical method was developed to determine both the transient distance and the net steady-state wear coefficient. Experimental wear tests were carried out on three types of commercial A6061 aluminum alloy matrix composites reinforced with 10%, 15% and 20% alumina particles. More accurate wear coefficient values were obtained with the proposed model. The average standard wear coefficient, as determined by the original Archard equation, was found to be about 51% higher.

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알루미나를 충전재로 첨가한 붕규산염 유리의 소결 및 결정화 방지기구에 대한 연구 (A Study on the Sintering and Mechanism of Crystallization Prevention of Alumina Filled Borosilicate Glass)

  • 박정현;이상진;성재석
    • 한국세라믹학회지
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    • 제29권12호
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    • pp.956-962
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    • 1992
  • The predominant sintering mechanisms of low firing temperature ceramic substrate which consists of borosilicate glass containing alumina as a filler are the rearrangement of alumina particles and the viscous flow of glass powders. In this system, sintering condition depends on the volume ratio of alumina to glass and on the particle size. When the substrate contains about 35 vol% alumina filler and the average alumina particle size is 4 $\mu\textrm{m}$, the best firing condition is obtained at the temperature range of 900∼1000$^{\circ}C$. The extensive rearrangement behavior occurs at these conditions, and the optimum sintering condition is attained by smaller size of glass particles, too. The formation of cristobalite during sintering causes the difference of thermal expansion coefficient between the substrate and Si chip. This phenomenon degradates the capacity of Si chip. Therefore, the crystallization should be prevented. In the alumina filled borosilicate glass system, the crystallization does not occur. This effect may have some relation with aluminum ions in alumina. For aluminum ions diffuse into glass matrix during sintering, functiong as network former.

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Rheo-Compocasting에 의한 $SiC_p$/6063 Al합금의 복합조직 (Composite Structures of $SiC_p$/6063 Aluminum Alloy by Rheo-Compocasting.)

  • 최정철
    • 한국주조공학회지
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    • 제10권4호
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    • pp.309-315
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    • 1990
  • Aluminum alloy matrix composites reinforced by SiC particles were prepared by rheocompocasting, a process which consists of the incoporation and distribution of reinforcement by stirring within a semi-solid alloy. When the volume fraction of SiCp and stirring speed were fixed, the dispersion of SiCp in Al-matrix alloy depended on stirring time and solid volume fraction in slurry. The results were as follows : 1) As a dispersed SiCp during stirring at $647^{\circ}C$ in 6063-Al alloy, SiC was better dispersed than that other temperature, where solid volume fraction was 43% in slurry. 2) When increased solid fraction in slurry, rate of dispersing SiC increased during stirring and porosities decreased in matrix alloy after casting. 3) Inspite of stirring with 800rpm, since solid particles of matrix alloy in slurry joined each other and occured joining growth, so that SiC was not dispersed into solid particle.

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Recovery of ultrafine particles from Chemical-Mechanical Polishing wastewater discharged by the semiconductor industry

  • Tu, Chia-Wei;Wen, Shaw-Bing;Dahtong Ray;Shen, Yun-Hwei
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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    • pp.715-718
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    • 2001
  • This study uses traditional alum coagulation and sedimentation process to treat CMP wastewater from cleaning after polishing. The primary goal is to successfully recycle both solid fines and water for semiconductor manufacturing. Results indicated that CMP wastewater may be successfully treated to recover clean water and fine particles by alum coagulation. The optimum operating conditions for coagulation are as fellowing: alum dosage of 10 ppm, pH at 5, rapid mixing speed at 800 rpm, 5 min rapid mixing time, and long slow mixing time. The treated water with low turbidity and an average residual aluminum ion concentration of 0.23 ppm may be considered for reuse. The settled sludge after alum coagulation contains mainly SiO$_2$particle with a minor content of aluminum (1.7 wt%) may be considered as raw materials for glass and ceramic industry.

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Effect of Annealing and Co contents on the Structural and Physical Properties in AlN Thin Films

  • Han, Chang-Suk;Han, Seung-Oh
    • 열처리공학회지
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    • 제23권6호
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    • pp.331-337
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    • 2010
  • Aluminum nitride (AlN) thin films containing various amounts of Co content have been deposited by using a two-facing targets type sputtering (TFTS) system. The deposited films were also annealed successively and isothermally at different temperatures. Annealing treatment can control the physical properties as well as the microstructure of AlN films with Co particles. High magnetization and high resistivity are obtainable in AlN films containing dispersed Co particles. The coercivity of the films does not depend on annealing time, but it increases with increasing annealing temperature due to the increase of the grain size. A high saturation magnetization of 46 kG and resistivity of 2200 ${\mu}{\Omega}$-cm was obtained for AlN films containing 25 at% Co.