• Journal of the Korean Society for Precision Engineering
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• v.11 no.1
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• pp.150-156
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• 1994

To meet the process requirement of semiconductor device manufacturing, it is necessary to improve the alignment accuracy in exposure equipments. We developed the excimer laser stepper and will describe the methodology for alignment measurement and experimental results. Our wafer alignment system consists of off-axis optics, TTL(Through The Lens) optics and high precision stage. Off-axis alignment utilizes the image processing and /or diffraction from thealign marks of off-centered chip area. On the other hand, TTL alignment can be used for the die-by-die alignment using dual beam interferometry. When only off-axis alignment was used, the experimental alignment error(lml+3 .sigma. ) was 0.26-0.29 .mu. m, and will be reduced down to 0.15 .mu. m by adding TTL alignment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.1084-1087
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• 1997

In this paper, we developed the micro NCT system for punching the thin plates, which is driven is driven by the standalone type microprocessor. In order to adjust the alignment between the punch and die in-situ punching procedures, the non-contact type laser sensor for measuring the burr and micro-driving system for punching die with using the differential screw are developed. The height of burr in four directions in the punched hole of test specimen are measured, and the measured data are transferred to the personal computer by RS232C serial communication technology. In the personal computer, by using the graphic user interface type monitoring program and data handling procedures which includes the filtering algorithms, the direction and length of movement of the die position is decided and these data are transferred back to the microprocessor. The microprocessor drives the micro positioning stage based on these data. Even if this method is not a perfect solution for the in-situ alignment in micro punching, but this alignment methodology is accomplished in the same stage just after the punching that we hope to solve the alignment problem in the punching system based on this technology.

• 제어로봇시스템학회:학술대회논문집
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• 1991.10b
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• pp.1961-1965
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• 1991

This paper deals with an automatic and precision alignment technique for proximity printing in x-ray lithography, using two pairs of moire gratings, with moire signals from each pair being 180.deg. out of phase with each other. We constructed an automatic and precision alignment experimental system which could measure both transmitted moire signals and reflected moire signals at the same time. The automatic alignment was achieved using transmitted moire signals and also reflected moire signals as a control signal for a stage driver. The alignment position of the system was monitored not only by a control signal but also by a non-control signal. The effect of transmitted and reflected moire signals upon alignment accuracy was discussed. We concluded that the technique using diffracted moire signals is a viable automatic and precision alignment technique.

• The Journal of the Korea Contents Association
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• v.7 no.2
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• pp.11-20
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• 2007

AAM has been successfully applied to face alignment, but its performance is very sensitive to initial values. In this paper, we propose a face alignment method using progressive AAM. The proposed method consists of two stages; modelling and relation derivation stage and fitting stage. Modelling and relation derivation stage first builds two AAM models; the inner face AAM model and the whole face AAM model and then derive the relation matrix between the inner face AAM model parameter vector and the whole face AAM model parameter vector. The fitting stage is processed progressively in two phases. In the first phase, the proposed method finds the feature parameters for the inner facial feature points of a new face, and then in the second phase it localizes the whole facial feature points of the new face using the initial values estimated utilizing the inner feature parameters obtained in the first phase and the relation matrix obtained in the first stage. Through experiments, it is verified that the proposed progressive AAM-based face alignment method is more robust with respect to pose, and face background than the conventional basic AAM-based face alignment.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.302-302
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• 2000

This paper presents the measurement and correction of PCB alignment errors for PCB-manufacturing machines. The conventional PCB-manufacturing machine doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because of alignment errors of PCB loaded to the PCB-manufacturing machine. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors whit high-accuracy. An automatic optical inspection part measures the PCB alignment error using two cameras, and the high-accuracy 3-axis stage makes correct of these error. The operating system is run in the environment of Window 98 (or NT). Finally we implemented this system to PCB screen printer and PCB exposure system.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.4
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• pp.194-201
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• 2004

Optical fibers are indispensable fer optical communication systems that transmit large volumes of data at high speed. But the aligning technology under the sub-micron accuracy is required for the precise axis adjustment and connection. For the purpose of precise alignment of the optical arrays, in this research, we have developed the 12-axis(with 8 automated axis and 4 manual axis) automatic optical fiber alignment system including the image processing-based searching system, the automatic loading system using the robot and the suction toot and the automatic UV bonding system. In order to obtain the sub-micron alignment accuracy, two 4-axis PC-based motion controllers and the two 50nm resolution 6-aixs micro-stage actuated by micro stepping motors are adopted. The fiber aligning procedure consists of two steps. Firstly, the optical wave guide and an input optical array are aligned by the 6-axis input micro-stage with the IR camera. The image processing technique is introduced to reduce primary manual aligning time and result in achieving the 50% decrease of aligning time. Secondly, the IR camera is replaced by the output micro-stage and a wave guide and two optical arrays are aligned simultaneously before the laser power intensity delivered to the optical powermeter reached the threshold value. When the aligning procedure is finished, the wave guide and arrays are W bonded. The automatic loading/unloading system is also introduced and the entire wave guide handing time is reduced significantly compared to the former commercial aligning system.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.20 no.4
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• pp.355-360
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• 2010

In this study, a modeling process of a 3-axis planar alignment stage is suggested. Vibration tests using a laser vibro-meter is performed to find the modeling parameters of the stage. By analyzing the result of the test, the stiffness of prismatic joints and revolute joints, as well as the contact conditions of the thrust bearings, can be calculated. The modeling of the stage was validated by comparing six normal mode shapes, which are acquired from experiments and simulations.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.12 s.115
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• pp.1249-1258
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• 2006

Two-dimensional(2-D) radar images, namely, ISAR images from a maneuvering target include unwanted phase errors due to the target's motion. These phase errors make ISAR images to be blurred. The ISAR autofocus technique is required in order to remove these unwanted phase errors. Unless those unwanted phase errors produced by the target's motion are removed prior to target identification, we cannot expect a reliable target identification performance. In this paper, we use the entropy-based ISAR autofocus technique which consists of two steps: range alignment and phase adjustment. We analyze a relationship between the number of sampling point and a image quality in a range alignment algorithm and also analyze a technique for reducing computation time of the SSA(Stage-by-Stage Approachng) algorithm in a phase adjustment.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.1
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• pp.10-14
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• 1987

Considering transition gating of the input unipolar NRZ signal, the equivalent linear time-invariant model has been derived for the PLL in the timing clock recovery circuits. The magnitude of the alignment and accumulated jitter has been found along a chain of repeaters. For the timing recovery circuit of 90 Mbps optical communication system, the computer simulation shows that, for the first stage of the chain, the alignment jiter and the accumulated jitter are of -5.1766 dB and for the 7-th stage, the alignment jitter and accumulated jitter have the value of -1.0193dB, 4.9053 dB respectively.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1993.10a
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• pp.243-248
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• 1993

New methodology for fiducial alignment is proposed to improve the alignment accuracy in wafer steppers. The positioning error is detected by PSD(Position Sensitive Detector)when 2-dimensional vernier patterns on a reticle on a reticle are projected on the fiducial marks of wafer stage. The width and period of vernier patterns are deter mined to get the highest S/N ratio for the exposure wavelength 248.4nm of KrF excimer laser. This new method has an advantage of higher accuracy and faster alignment over the conventional one.