• Title/Summary/Keyword: AlN sheet

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PREPERATION OF AMPHOTERIC STARCHS AND STUDY ON WET END CHEMISTRY IN PAPERMAKING

  • Shan, Chen-Fu;Su, Xie-Lai;Yi, Wang-Hai;Quan, Long-Yan
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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    • 1999.04b
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    • pp.386-389
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    • 1999
  • Amphoteric polymers have brought to papermakers' attention gradually. In this paper, a series of amphoteric starches with different cationic and anionic degree of substitution (DS) are prepared. Better product has been selected and used under different condition. As retention and drainage aids, amphoteric starches were used in shorter fiber length, weak strength and poor drainage bleached AQ-Soda wheat straw pulp. In neutral and alkaline papermaking system, when amphoteric starches contain 0.024-0.026 anionic degree of substitution (DS), it is shown that the higher the cationic degree of substitution (DS) in amphoteric starches, the better the filler retention. The filler retention is improved 12.5%, 30.3%, and 35.1% and 32.5% respectively by adding 1% amphoteric starch LS-L2 -1 (0.034), LS-L2-2 (0.040), LS-L2-3 (0.047) and LS-L2-4 (0.052). But the strength of handsheets if affected a little. By adding 2% Al2 (SO4)3 and 1.5% LS-L2-3 at pH 7.5, filler retention can be improved from 38% to 80%, and breaking length of sheet only decreases 3.2%. As dry strengthening aids, amphoteric starches were used in eucalyptus APMP. Amphoteric starches are used in eucalyptus APMP. The amphoteric starch LS-L2-2 is better dry strength aid. Adding 1% LS-L2-2 can improve breaking length 24.5%, burst index 42.9%, tear index 38.8%, folding endurance and density of the handsheets.

The Single-Side Textured Crystalline Silicon Solar Cell Using Dielectric Coating Layer (절연막을 이용한 단면 표면조직화 결정질 실리콘 태양전지)

  • Do, Kyeom-Seon;Park, Seok-Gi;Myoung, Jae-Min;Yu, Gwon-Jong;Song, Hee-Eun
    • 한국태양에너지학회:학술대회논문집
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    • 2011.11a
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    • pp.245-248
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    • 2011
  • Many researches have been carried out to improve light absorption in the crystalline silicon solar cell fabrication. The rear reflection is applied to increase the path length of light, resulting in the light absorption enhancement and thus the efficiency improvement mainly due to increase in short circuit current. In this paper, we manufactured the silicon solar cell using the mono crystalline silicon wafers with $156{\times}156mm^2$, 0.5~3.0 ${\Omega}{\cdot}cm$ of resistivity and p-type. After saw damage removal, the dielectric film ($SiN_x$)on the back surface was deposited, followed by surface texturing in the KOH solution. It resulted in single-side texturing wafer. Then the dielectric film was removed in the HF solution. The silicon wafers were doped with phosphorus by $POCl_3$ with the sheet resistance 50 ${\Omega}/{\Box}$ and then the silicon nitride was deposited on the front surface by the PECVD with 80nm thickness. The electrodes were formed by screen-printing with Ag and Al paste for front and back surface, respectively. The reflectance and transmittance for the single-sided and double-sided textured wafers were compared. The double-sided textured wafer showed higher reflectance and lower transmittance at the long wavelength region, compared to single-sided. The completed crystalline silicon solar cells with different back surface texture showed the conversion efficiency of 17.4% for the single sided and 17.3% for the double sided. The efficiency improvement with single-sided textured solar cell resulted from reflectance increase on back surface and light absorption enhancement.

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Selective Surface Oxidation of 590MPa TRIP Steel and Its Effect on Hot-Dip Galvanizability (590 MPa TRIP강의 선택적 표면산화 거동과 표면 산화막이 도금특성에 미치는 영향)

  • Kim, Seong-Hwan;Im, Jun-Mo;Huh, Joo-Youl;Lee, Suk-Kyu;Park, Rho-Bum;Kim, Jong-Sang
    • Korean Journal of Metals and Materials
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    • v.49 no.4
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    • pp.281-290
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    • 2011
  • In order to gain better understanding of the selective surface oxidation and its influence on the galvanizability of a transformation-induced plasticity (TRIP) assisted steel containing 1.5 wt.% Si and 1.6 wt.% Mn, a model experiment has been carried out by depositing Si and Mn (each with a nominal thickness of 10 nm) in either monolayers or bilayers on a low-alloy interstitial-free (IF) steel sheet. After intercritical annealing at $800^{\circ}C$ in a $N_2$ ambient with a dew point of $-40^{\circ}C$, the surface scale formed on 590 MPa TRIP steel exhibited a microstructure similar to that of the scale formed on the Mn/Si bilayer-coated IF steel, consisting of $Mn_{2}SiO_{4}$ particles embedded in an amorphous $SiO_{2}$ film. The present study results indicated that, during the intercritical annealing process of 590 MPa TRIP steel, surface segregation of Si occurs first to form an amorphous $SiO_{2}$ film, which in turn accelerates the out-diffusion of Mn to form more stable Mn-Si oxide particles on the steel surface. During hot-dip galvanizing, particulate $Fe_{3}O_{4}$, MnO, and Si-Mn oxides were reduced more readily by Al in a Zn bath than the amorphous $SiO_{2}$ film. Therefore, in order to improve the galvanizability of 590 TRIP steel, it is most desirable to minimize the surface segregation of Si during the intercritical annealing process.

WELD REPAIR OF GAS TURBINE HOT END COMPONENTS

  • Chaturvedi, M.C.;Yu, X.H.;Richards, N.L.
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.235-243
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    • 2002
  • Ni-base superalloys are used extensively in industry, both in aeroengines and land based turbines. About 60% by weight of most modern gas turbine engine structural components are made of Ni-base superalloys. To satisfy practical demands, the efficiency of gas turbine engines has been steadily and systematically increased by design modifications to handle higher turbine inlet or firing temperatures. However, the increase in operating temperatures has lead to a decrease in the life of components and increase in costs of replacement. Moreover, around 80% of the large frame size industrial/utility gas turbines operating in the world today were installed in the mid-sixties to early seventies and are now 25 to 30 years old. Consequently, there are greater opportunities now to repair and refurbish the older models. Basically, there are two major factors influencing the weldability of the cast alloys: strain-age cracking and liquation cracking. Susceptibility to strain-age cracking is due to the total Ti plus AI content of the alloy; Liquation cracking is due either to the presence of low melting constituents or constitutional liquation of constituents. Though Rene 41 superalloy has 4.5wt.% total Ti and Al content and falls just below the safe limit proposed by Prager et al., controlled grain size and special heat treatments are needed to obtain crack-free welds. Varying heat treatments and filler materials were used in a laboratory study, then the actual welding of service parts was carried out to verity the possibility of crack-tree weld of components fabricated from Rene 41 superalloy. The microstructural observations indicated that there were two kinds of carbides in the FCC matrix. MC carbides were located along the grain boundaries, while M$_{23}$C$_{6}$ carbide was located both inter and intra granularly. Two kinds of filler materials, Rene 41 and Hastelloy X were used to gas tungsten arc weld a patch into the sheet metal, along with varying pre-weld heat treatments. The microstructure, hardness and tensile tests were determined. The service distressed parts were categorized into three classes: with large cracks, with medium cracks and with small or no visible cracks. No significant difference in microstructure among the specimens was observed. Specimens were cut from the corner and the straight edge of the patch repair, away from the corner. The only cracks present were found to be associated with inadequate surface preparation to remove oxidation. Guidelines for oxide removal and the welding procedures developed in the research enabled crack-free welds to be produced.d.

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Dependence of $O_2$ Plasma Treatment of ITO Electrode on Electrical and Optical Properties of Polymer Light Emitting Diodes (ITO 투명전극의 $O_2$ 플라즈마 처리가 고분자 유기발광다이오드의 전기.광학적 특성에 미치는 영향)

  • Gong, Su-Cheol;Back, In-Jea;Yoo, Jea-Huyk;Lim, Hun-Sung;Yang, Sin-Huyk;Shin, Sang-Bea;Shin, Ik-Seup;Chang, Gee-Keun;Chang, Ho-Jung
    • Journal of the Korean institute of surface engineering
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    • v.39 no.3
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    • pp.93-97
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    • 2006
  • Polymer light emitting diodes (PLEDs) are expected to be commercialized as next generation displays by advantages of the fast response time, low driving voltage and easy manufacturing process for large sized flexible display. Generally, the electrical and optical properties of PLEDs are affected by the surface conditions of transparent electrode. The PLED devices with ITO/PEDOT:PSS/PVK/PFO-poss/LiF/Al structures were prepared by using the spin coating method. For this, PEDOT:PSS(poly(3,4-ethylenedioxythiophene):poly(styrene sulfolnate)) Al 4083 and PVK(N-vinylcabozole) were used as hole injection and transport layers. The PFO-poss(poly(9,9-dioctylfluorene)) was used as the emitting layer. The dependence of $O_2$ plasma treatment of ITO electrode on the electrical and optical properties of PLEDs were investigated. The sheet resistances increased slightly with an improved surface roughness of ITO electrode as the RF power increased during $O_2$ plasma treatment. The PLED devices prepared on the ITO/Glass substrates, which were plasma-treated at 40 watt in RF power for 30 seconds under 40 mtorr $O_2$ pressure, showed the maximum external emission efficiency of 0.86 lm/W and the maximum luminance of $250\;cd/m^2$, respectively. The CIE color coordinates are ranged $X\;=\;0.13{\sim}0.18$ and $Y\;=\;0.10{\sim}0.16$, showing blue color. emission.

Comparative Analysis of Heat Sink and Adhesion Properties of Thermal Conductive Particles for Sheet Adhesive (열전도성 입자를 활용한 시트용 점착제의 점착 특성과 방열특성 연구)

  • Kim, Yeong Su;Park, Sang Ha;Choi, Jeong Woo;Kong, Lee Seong;Yun, Gwan Han;Min, Byung Gil;Lee, Seung Han
    • Textile Coloration and Finishing
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    • v.28 no.1
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    • pp.48-56
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    • 2016
  • Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.

Electrical Properties of BaTiO3-based 0603/0.1µF/0.3mm Ceramics Decoupling Capacitor for Embedding in the PCB of 10G RF Transceiver Module

  • Park, Hwa-sun;Na, Youngil;Choi, Ho Joon;Suh, Su-jeong;Baek, Dong-Hyun;Yoon, Jung-Rag
    • Journal of Electrical Engineering and Technology
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    • v.13 no.4
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    • pp.1638-1643
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    • 2018
  • Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.