• 한국전기전자재료학회논문지
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• 제28권2호
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• pp.75-79
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• 2015

Ti was deposited on the Al substrate using DC magnetron sputtering with changing the $N_2$ gas for the possible application of a solar absorbing layer. $N_2$ gas ranged from 50 to 75 sccm was systematically applied in the 5 sccm interval and the variation of the absorption rate was investigated. Microstructural examination and elemental analysis indicate that Ti was reacted with $N_2$ gas and formed $TiNO_x$ compound. As compared with the film without any exposure of $N_2$ gas, absorption rate improved by more than 20%. Typically the average absorption of $TiNO_x$ fim with 65% of $N_2$ gas was about 99% in the visible range, and the average absorption was more than 90% in the infrared absorption region respectively.

• 한국분말재료학회지
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• 제22권3호
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• pp.175-180
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• 2015

In this study, ternary compound Max Phase $Ti_2AlC$ material was mixed by 3D ball milling as a function of ball milling time. More than 99.5 wt% pure $Ti_2AlC$ was synthesized by using spark plasma sintering method at 1000, 1100, 1200, and $1300^{\circ}C$ for 60 min. The material characteristics of synthesized samples were examined with relative density, hardness, and electrical conductivity as a function of sintering temperature. The phase composition of bulk was identified by X-ray diffraction. On the basis of FE-SEM result, a terraced structures which consists of several laminated layers were observed. And $Ti_2AlC$ bulk material obtained a vickers hardness of 5.1 GPa at the sintering temperature of $1100^{\circ}C$.

• 한국재료학회지
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• 제2권2호
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• pp.157-160
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• 1992

플라즈마 회전전극법으로 제조된 Ti-51at%Al 금속간화합물 분말에 함유된 불순물의 함량변화를 분석하였다. 산소와 탄소의 함량은 각각 600 및 200ppm 정도로 분말입도에 따라 변하였으며, 이는 주로 원재료에 포함된 불순물의 영향이었다. AES 분석에 의하면 분말표면 산화물은 주로 Ti 및 Al과 산소 및 탄소의 복합화합물로 구성되었으며, 그 두께는 약 100 및 $200{\mu}m$ 크기의 분말에 대하여 각각 7 및 3.4nm 정도로 측정되었다. 분말의 제조로 산소와 탄소의 함량이 오히려 감소되는것의 구체적인 기구는 아직 확인되지 않았으나 플라즈마 고열에 의한 정련현상에 기인하는 것으로 생각된다.

• 한국분말재료학회지
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• 제3권3호
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• pp.174-180
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• 1996

Microstructure and phase transformation of mechanically alloyed TiNi powders added to aluminium matrix for enhancing the damping properties were studied. Four compositions between 48.5 and 51.5 at% Ti intermetallic compounds were selected to control the fraction of martensite phase. Mechanically alloyed TiNi powders were heat-treated at vacuum of $10^{-6}$ torr for crystallization. Ball milled AI/TiNi composite powders were swaged at room temperature and rolled at 450 $^{\circ}C$. After mechanical alloying for 10 hours, Ti and Ni elements were alloyed completely and amorphous phase was formed. Amorphous phase was crystallized to martensite (Bl9') and austenite(B2) after heat treating for 1 hour at the temperature of 850 $^{\circ}C$, and TiNi$_3$, intermetallic compound was partially formed. Considerable amount of martensite phase was remained after swaging and rolling.

• 한국표면공학회지
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• 제32권3호
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• pp.265-275
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• 1999

Titanium nitride and related overlayers produced by arc ion plating (AIP) are applied as commercial coatings in world-wide scale since the middle of 80s. Due to the achievements of low temperature deposition (LTD), they begin now to be used as wear and corrosion-resistant coatings for machine parts, besides applications on cemented carbide and high speed steel cutting tools. On the other side, TiN can be now applied successfully to brass, Al-alloy, ZnAl alloy articles as decorative coating through LTD. Various nitrides, carbonitrides, borides and other refractory compounds, such as (Ti, Al)N, TiCN, CrN, are used as the coatings for special heavy-duty working conditions instead of TiN since 90s. More and more multilayer coatings are applied now substituting single layer ones. Duplex processes are under development.

• 한국재료학회지
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• 제13권7호
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• pp.465-472
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• 2003

Pd/Ge/Ti/Pt and Pd/Ge/Pd/Ti/Au ohmic contacts to n-type InGaAs were investigated for applications to AlGaAs/GaAs HBT emitter ohmic contacts. In the Pd/Ge/Ti/Pt ohmic contact minimum specific contact resistivity of $3.7${\times}$10^{-6}$ $\Omega$$\textrm{cm}^2$ was achieved by rapid thermal annealing at $^400{\circ}C$/10 sec. In the Pd/Ge/Ti/Au ohmic contact, minimum specific contact resistivity of $1.1${\times}$10^{-6}$ $\Omega$$\textrm{cm}^2$ was achieved by annealing at 40$0^{\circ}C$/10 sec but the ohmic performance was degraded with increasing annealing temperature due to the reaction between the ohmic contact materials and the InGaAs substrate. However, non-spiking planar interface and relatively good ohmic contact (high-$10^{-6}$ /$\Omega$$\textrm{cm}^2$) were maintained after annealing at $450^{\circ}C$/10 sec. Therefore, these thermally stable ohmic contact systems are promising candidates for compound semiconductor devices. RF performance of the AlGaAs/GaAs HBT was also examined by employing the Pd/Ge/Ti/Pt and Pd/Ge/Pd/Ti/Au systems as emitter ohmic contacts. Cutoff frequencies were 63.5 ㎓ and 65.0 ㎓, respectively, and maximum oscillation frequencies were 50.5 ㎓ and 51.3 ㎓, respectively, indicating very successful high frequency operations.

• 열처리공학회지
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• 제17권1호
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• pp.17-22
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• 2004

In the present study, newly developed spark plasma sintering(SPS) technique was introduced to refine the grain size of ${\gamma}$-based TiAl intermetallic compounds. Ti-46Al-1.5Mo and Ti-46Al-1.5Mo-0.2C(at%) prealloyed powders were produced by mechanical milling(MM) in high-energy attritor. The mechanically milled powders were characterized by XRD and SEM for the microstructural evolution as a function of milling time. And then, the MMed powders were sintered by both spark plasma sintering and hot pressing in vacuum (HP). After the sintering process, MM-SPSed specimens were heat-treated in a vacuum furnace (SPS-VHT) and in the SPS equipment(MM-SPS) for microstructural control. It was found from microstrutural observation that the microstructure consisting of equiaxed ${\gamma}$-TiAl with a few hundred nanometer in average size and ${\alpha}_2-Ti_3Al$ particles were formed after both sintering processes. It was also revealed from hardness test and three-point bending test that the effect of grain refinement on the hardness and bending strength is much higher than that of carbon addition. The fully lamellar microstructures, which is less than $80{\mu}m$ in average grain size was obtained by SPS-VHT process, and the fully lamellar microstructure which is less than $100{\mu}m$ in average grain size was obtained by MM-SPS for a relatively shorter heat-treatment time.

• 열처리공학회지
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• 제36권2호
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• pp.61-68
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• 2023

Ti and Ti alloys are used in the automobile and aerospace industries due to their high specific strength and excellent corrosion resistance. However their application is limited due to poor formability at room temperature and high unit cost. In order to overcome these issues, dissimilarly jointed materials, such as cladding materials, are widely investigated to utilize them in each industrial field because of an enhanced plasticity and relatively low cost. Among various dissimilar bonding processes, the rolled cladding process is widely used in Ti alloys, but has a disadvantage of low bonding strength. Although this problem can be solved through post-heat treatment, the mechanical properties at the bonded interface are deteriorated due to residual stress generated during post-heat treatment. Therefore, in this study, the microstructure change and residual stress trends at the interfaces of Ti/Al cladding materials were studied with increasing post-heat treatment temperature. As a result, compared to the as-rolled specimens, no difference in microstructure was observed in the specimens after postheat treatment at 300, 400, and 500℃. However, a new intermetallic compound layer was formed between Ti and Al when post-heat treatment was performed at a temperature of 600℃ or higher. Then, it was also confirmed that compressive residual stress with a large deviation was formed in Ti due to the difference in thermal expansion coefficient and modulus of elasticity between Ti Grade II and Al 1050.

• 한국주조공학회지
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• 제18권6호
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• pp.550-554
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• 1998

The microstructures of rapidly solidified binary Ti-Al alloys containing $45{\sim}58\;at%Al$ have been studied using C/S (carbon/sulfur), N/O (nitrogen/oxygen) analyser, X-ray fluorescence spectrometer (XRF), X-ray diffractometer (XRD), optical microscope (OM) and scanning electron microscope (SEM). The phases present in the alloys and their distribution were found to be a sensitive function of Al content. Essentially single-phase (${\gamma}$) microstructures were observed to alloys with 45 at%Al, 55 at%Al and 58 at%Al. In other content alloys, two phase (${\alpha}_2$, ${\gamma}$) microstructures were observed. The 48 at%Al, 52 at%Al alloys contain (${\gamma}+{\alpha}_2$) phase and ${\alpha}_2$ phase. These results indicate that rapid solidification affect the solidification path, then metastable phase forming during solidification.

• 열처리공학회지
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• 제22권1호
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• pp.8-15
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• 2009

Structural studies have been performed on precipitation hardening found in $Ni_{3}Al$ based ordered alloys using transmission electron microscopy (TEM). Tilt experiments by the weak-beam method were made to obtain some information concerning the cross slip mechanism of the superlattice dislocation. The strength of ${\gamma}'-Ni_3$(Al,Ti) increases over the temperature range of experiment by the precipitation of fine $\gamma$ particles. The peak temperature where a maximum strength was obtained shifted to higher temperature. Over the whole temperature range, the interaction between dislocation and $\gamma$ precipitates is attractive. On the temperature range of 773 K to 973 K, the dislocations in ${\gamma}'$ matrix move on (111) primary slip plane. When the applied stress is removed, the dislocations make cross slip into (010) plane, while those in $\gamma$ precipitates remain on the (111) primary slip plane. The increase of high temperature strength in ${\gamma}'-Ni_3$(Al,Ti) containing $\gamma$ precipitates is due to the restraint of cross slip of dislocations from (111) to (010) by the dispersion of disordered $\gamma$ particles.