• Journal of the Korea Fashion and Costume Design Association
• /
• 제3권2호
• /
• pp.35-50
• /
• 2001

The object of this study is to improve the adsorption of dye for gromwell. Dye was from gromwell first soaked in methylol and added the distilled water, using same amount of methylol. The fabrics used for the experiments were cotton, silk and acrylics(KS0905). These were used untreated and pretreated with chitosan, premordanted with Cu, Al and Fe. Dyeing conditions were controlled. 1. Deep color effect was shown silk. 2. Chitosan treated cotton and acrylics showed deep color effect and huge color difference before and after the experiment. 3. In chitosan treated acrylics, deep color effect were shown. It proved the good adsorption of gromwel under metal mordanting. 4. Cu showed high adsorption of gromwell and deep color effect. 5. Chitosan treated acrylics can be substitute for wool.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• 제21권4호
• /
• pp.164-168
• /
• 2011

Etch selectivities of mask materials to ZnO and $SnO_2$ films were studied in $BCl_3$/Ar and $CF_4$/Ar inductively coupled plasmas for fabrication of nanostructure-based gas sensing layer with high aspect ratios. In $25BCl_3$/10Ar ICP discharges, selectivities of 5.1~6.1 were obtained for ZnO over Ni while no practical selectivity was obtained for ZnO over Al. High selectivities of 7 ~ 17 for ZnO over Ni were produced in $25CF_4$/10Ar mixtures. $SnO_2$ showed much higher etch rates than Ni and a maximum selectivity of 67 was observed for $SnO_2$ over Ni.

• Journal of Technologic Dentistry
• /
• 제23권1호
• /
• pp.55-64
• /
• 2001

This study is focusing on the improvement of problems of Ti-6Al-4V alloy. A new Ti based alloy, Ti-15Sn-4Nb, have designed to examine any possibility of improving the mechanical properties and biocompatibility. Specimens of Ti alloys were melted in vacuum arc furnace and homogenized at $100^{\circ}C$ for 24h. All specimens were solution treated at $812^{\circ}C$ and aged at $500^{\circ}C$ for 10h. The corrosion resistance of Ti alloys was evaluated by potentiodynamic polarization test and immersion test inl%Lactic acid solutions. Ti-15Sn-4Nb system alloys showed Widmanstatten microstructure after solution treatment which is typical microstructure of ${\alpha}+{\beta}$ type Ti alloys. Analysing the corrosion resistance of Ti alloys, it was concluded that the passive films of Ti-15Sn-4Nb system alloys are more stable than that of Ti-6Al-4V alloys. Also, the corrosion resistance of Ti-15Sn-4Nb system alloys was improved with adding elements, Hf. It was analysed that the passive film of the Ti-15Sn-4Nb alloy which was formed in air atmosphere was consisted of TiO2, SnO and NbO through X-ray photoelectron spectroscopy(XPS) analysis.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
• /
• pp.55-58
• /
• 2002

The possibility of SnCuX Solder as alternative for Pb-free Solder have been investigated in this study. SnCuX Solder balls(500${\mu}{\textrm}{m}$) were placed on Si-wafer which is Al/Ni/Cu(500nm/$4{\mu}{\textrm}{m}$/$4{\mu}{\textrm}{m}$)UBM layer. After reflow soldering at $250^{\circ}C$, shear strength and microstructure were analyzed. The results showed that the shear strength(500gf) of SnCuX was higher than that of SnCuX at $230^{\circ}C$ and $Cu_6Sn_5$ intermetallic compounds were formed between Cu and SnCuX Solder layers

• Journal of Korea Foundry Society
• /
• 제34권2호
• /
• pp.49-53
• /
• 2014

In commercial Zr-Nb-Cu-Ni-Al amorphous alloys, expensive element, Zr, was substituted to Sn which was cheaper one, and then, glass forming ability, compressive strength and hardness of them were estimated. Even though the Sn was added up to 1.5%, resulting phase was not changed to the crystalline form. It was confirmed by X-ray diffraction and thermal analyses. In the X-ray profiles, there were no peaks for crystalline phases and typical halo pattern for amorphous phase was appeared at the diffraction angle of $35^{\circ}{\sim}45^{\circ}$. Thermal analyses also showed that the Sn modified alloys were corresponded to the amorphous standards where ${\delta}T$(= Tx - Tg) and Trg(= Tg/Tm) affecting to the amorphous forming ability were more than 50K and 0.60 respectively. Compressive strengths were 1.77 GPa, 1.63 GPa, 1.65 GPa and 1.77 GPa for 0%Sn, 0.5%Sn, 1.0%Sn and 1.5%Sn respectively. Hardnesses of the Sn modified alloys were decreased from 752 Hv to 702 Hv in 1.0%Sn and recovered to 746 Hv in 1.5%Sn.

• Journal of the Korean institute of surface engineering
• /
• 제36권5호
• /
• pp.386-392
• /
• 2003

The electroplating process for a solder bump which can be applied for a flip chip was studied. Si-wafer was used for an experimental substrate, and the substrate were coated with UBM (Under Bump Metallization) of Al(400 nm)/Cu(300 nm)Ni(400 nm)/Au(20 nm) subsequently. The compositions of the bump were Sn-Cu and eutectic Sn-Pb, and characteristics of two bumps were compared. Experimental results showed that the electroplated thickness of the solders were increased with time, and the increasing rates were TEX>$0.45 <\mu\textrm{m}$/min for the Sn-Cu and $ 0.35\mu\textrm{m}$/min for the Sn-Pb. In the case of Sn-Cu, electroplating rate increased from 0.25 to $2.7\mu\textrm{m}$/min with increasing current density from 1 to 8.5 $A/dm^2$. In the case of Sn-Pb the rate increased until the current density became $4 A/dm^2$, and after that current density the rate maintains constant value of $0.62\mu\textrm{m}$/min. The electro plated bumps were air reflowed to form spherical bumps, and their bonded shear strengths were evaluated. The shear strength reached at the reflow time of 10 sec, and the strength was of 113 gf for Sn-Cu and 120 gf for Sn-Pb.

• Proceedings of the Korean Powder Metallurgy Institute Conference
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
• /
• pp.1030-1031
• /
• 2006

Titanium alloys and Titanium alloy-based particulate composites were synthesized using the blended elemental P/M route. First, processing conditions such as the fabrication of master alloy powder were investigated. Ti-6Al-4V, Ti-5Al-2.5Fe, Ti-6Al-2Sn-4Zr-2Mo, IMI685, IMI829, Timetal 1100 and Timetal 62S, and Ti-6Al-2Sn-4Zr-2Mo/ 10%TiB and Timetal 62S/10%TiB were then synthesized using the optimal processing conditions obtained. The microstructures and mechanical properties such as tensile strength and high cycle fatigue strength were evaluated.

• Journal of Powder Materials
• /
• 제17권6호
• /
• pp.443-448
• /
• 2010

The $\beta$ phase Ti-Nb-Sn-HA bio materials were successfully fabricated by high energy mechanical milling and pulse current activated sintering (PCAS). Ti-6Al-4V ELI alloy has been widely used as biomaterial. But the Al has been inducing Alzheimer disease and V is classified as toxic element. In this study, ultra fine sized Ti-Nb-Sn-HA powder was produced by high energy mechanical milling machine. The $\beta$ phase Ti-Nb-Sn-HA powders were obtained after 12hr milling from $\alpha$ phase. And ultra fine grain sized Ti-Nb-Sn-HA composites could be fabricated using PCAS without grain growth. After sintering, the microstructures and phase-transformation of Ti-Nb-Sn-HA biomaterials were analyzed by scanning electron microscope (SEM) and X-ray diffraction (XRD). The relative density was obtained by Archimedes principle and the hardness was measured by Vickers hardness tester. The $\beta$-Ti phase was obtained after 12h milling. As result of hardness and relative density, 12h milled Ti-Nb-Sn-HA composite has the highest values.

• Bulletin of the Korean Chemical Society
• /
• 제19권11호
• /
• pp.1161-1164
• /
• 1998

The catalytic transformation of sterically bulky tertiary stannane n-Bu3SnH by the Cp2MCl2/Red-Al (M=Ti, Zr, Hf) and M(CO)6 (M=Cr, Mo, W) catalysts yielded two kinds of catenated products: one is a cross-linked polystannane as minor product, and the other is hexabutyldistannane (n-Bu3Sn)2 as major product. The distannane was produced by simple dehydrocoupling of n-Bu3SnH, whereas the cross-linked polystannane could be obtained via redistribution/dehydrocoupling combination process of n-Bu3SnH. The redistribution/dehydrocoupling combination process may initially produce a low-molecular-weight oligostannane with partial backbone Sn-H bonds which could then undergo an extensive cross-linking reaction of backbone Sn-H bonds, resulting in the formation of an insoluble polystannane.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• 제35권11호
• /
• pp.1139-1145
• /
• 2011

An automated anastomotic ring-pin system consisting of both the anastomotic ring-pin system and the coupler device has eliminated the drawbacks of the suture method. High density polyethylene (HDPE), a material with outstanding biocompatibility and injection molding capability, was used in the ring. SUS316 stainless steel, Ti-6Al-4Nb, Ti-6Al-4V, and unalloyed titanium were used in FEM simulations of the micropin. The authors categorized the microvascular anastomotic ring micropins into short neck (SN) and long neck (LN) groups in order to evaluate the effect of the micropin's fillet radius and neck length on the von Mises stress. The micropins were further divided into those with and without fillet. On the basis of the fillet radius rate (FRR), which represents the rate of change in the von Mises stress with respect to the availability and shape of the fillet, and the neck length rate (NLR), which represents the rate of change in the von Mises stress with respect to changes in the length of the neck within the fillet shape, it can be concluded that the SN-3 neck design is the most stable.