• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 한국재료학회 춘계학술발표강연 및 논문개요집
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• pp.116-116
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• 1998

• 한국주조공학회지
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• 제15권3호
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• pp.262-271
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• 1995

It is well known what is impossible to refine primary and eutectic Si simultaneously by addition of both Cu-P and Sr(or Na). Because of the formation of compound $Sr_3P_2(or Na_3P)$ in the melt, in the result, both effects disappear. In this study Al-Cu-P alloy that comprises AlP compounds inside is added in the melt with Sr simultaneously. As AlP compounds that act on nucleation sites of primary Si are not formed but added directly an the melt, it is difficult to form $Sr_3P_2$ by reaction with Sr. Therefore it is possible to refine primary and eutectic Si simultaneously in the general casting process by use of Al-Cu-P alloy and Sr.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1301-1302
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• 2006

Sintered composites of Al-8wt%Cu-10vol%SiCp were deformed by repressing or equal channel angular pressing(ECAP) at room temperature, $500^{\circ}C$ and $600^{\circ}C$. Repressing produced more densification than ECAP but resulted in much lower transverse rupture strengths. In both cases, deformation at room temperature and $500^{\circ}C$, resulted in much lower strengths than deformation at $600^{\circ}C$, and also caused the fracturing of some SiC particles. The higher bend strengths and less SiC fracturing at $600^{\circ}C$ are attributable to the presence of an Al-Cu liquid phase during deformation. The employment of copper coated SiC instead of bare SiC particles for preparing the composites was found not improving the properties.

• 대한화학회지
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• 제30권5호
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• pp.415-422
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• 1986

${\gamma}-Al_2O_3$와 $SiO_2$에 입혀진 CuO계에서 지지체와 금속과의 상호 작용을 X선 회절법과 승온 환원법으로 연구했다. CuO/${\gamma}-Al_2O_3$계의 CuO X선 회절 피크는 구리의 농도가 약 5.0wt % 이상일 때 관찰될 수 있었으며 CuO/$SiO_2$계에서는 2.5wt%의 구리 함량에서도 볼 수 있었다. CuO/${\gamma}-Al_2O_3$의 수소에 의한 승온 환원 실험에서는 145${\circ}C$, 185${\circ}C$, 210${\circ}C$, 그리고 250${\circ}C$부근에서 네개의 주 피크가 나타났으며 CuO/$SiO_2$의 경우는 425${\circ}C$에서의 작은 피크와 함께 250${\circ}C$에서 큰 피크가 나타났었다. 1000${\circ}C$에서 소성시킨 CuO/${\gamma}-Al_2O_3$의 Cu$Al_2O_4$에 대한 승온 환원 피크들과 145${\circ}C$, 200${\circ}C$ (185${\circ}C$, 210${\circ}C$), 250${\circ}C$ 부근의 피크들을 비교해 보면 그들은 각각 ${\gamma}-Al_2O_3$와 상호작용하는 CuO격자에 있는 $Cu^+$이온, ${\gamma}-Al_2O_3$의 결함 자리들에 존재하는 $Cu^+$이온, 그리고 입자가 큰 CuO층에 있는 $Cu^{2+}$이온에 대응시킬 수 있었다. 이러한 결과들로 부터 CuO/${\gamma}-Al_2O_3$계에서는 지지체와 금속간에 상당한 상호작용이 있으며 이 상호 작용이 CuO/${\gamma}-Al_2O_3$계의 $Cu^{2+}$이온을 안정화 시킴을 알 수 있었다.

• 한국재료학회지
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• 제30권1호
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• pp.31-37
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• 2020

In this study, the effects of Sm addition (0, 0.05, 0.2, 0.5 wt%) on the microstructure, hardness, and electrical and thermal conductivity of Al-11Si-1.5Cu aluminum alloy were investigated. As a result of Sm addition, increment in the amount of α-Al and refinement of primary Si from 70 to 10 ㎛ were observed due to eutectic temperature depression. On the other hand, Sm was less effective at refining eutectic Si because of insufficient addition. The phase analysis results indicated that Sm-rich intermetallic phases such as Al-Fe-Mg-Si and Al-Si-Cu formed and led to decrements in the amount of primary Si and eutectic Si. These microstructure changes affected not only the hardness but also the electrical and thermal conductivity. When 0.5 wt% Sm was added to the alloy, hardness increased from 84.4 to 91.3 Hv, and electric conductivity increased from 15.14 to 16.97 MS/m. Thermal conductivity greatly increased from 133 to 157 W/m·K.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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• pp.338-341
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• 1995

The surface properties after plasma etching of Al(Si, Cu) solutions using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched Al(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxized (partially chlorinated) states, copper shows Cu metallic states and Cu-Clx(x$CuCl_x$ (x$CuCl_x$ (1

• 한국재료학회지
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• 제23권4호
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• pp.227-232
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• 2013

Al-based alloys have recently attracted considerable interest as structural materials and light weight materials due to their excellent physical and mechanical properties. For the investigation of the potential of Al-based alloys, a surface porous $Al_{88}Cu_6Si_6$ eutectic alloy has been fabricated through a chemical leaching process. The formation and microstructure of the surface porous $Al_{88}Cu_6Si_6$ eutectic alloy have been investigated using X-ray diffraction and scanning electron microscopy. The $Al_{88}Cu_6Si_6$ eutectic alloy is composed of an ${\alpha}$-Al dendrite phase and a single eutectic phase of $Al_2Cu$ and ${\alpha}$-Al. We intended to remove only the ${\alpha}$-Al phase and then the $Al_2Cu$ phase would form a porous structure on the surface with open pores. Both acidic and alkaline aqueous chemical solutions were used with various concentrations to modify the influence on the microstructure and the overall chemical reaction was carried out for 24 hr. A homogeneous open porous structure on the surface was revealed via selective chemical leaching with a $H_2SO_4$ solution. Only the ${\alpha}$-Al phase was successfully leached while the morphology of the $Al_2Cu$ phase was maintained. The pore size was in a range of $1{\sim}5{\mu}m$ and the dealloying depth was nearly $3{\mu}m$. However, under an alkaline NaOH, aqueous solution, an inhomogeneous porous structure on the surface was formed with a 5 wt% NaOH solution and the morphology of the $Al_2Cu$ phase was not preserved. In addition, the sample that was leached by using a 7 wt% NaOH solution crumbled. Al extracted from the Al2Cu phase as ${\alpha}$-Al phase was dealloyed, and increasing concentration of NaOH strongly influenced the morphology of the $Al_2Cu$ phase and sample statement.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.1000-1001
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• 2006

Two atomized alloy powders were pre-compacted by cold and subsequently hot forged at temperatures ranging from 653K to 845K. The addition of Cu and Mg causes a decrease in the eutectic reaction temperature of Al-10Si-5Fe-1Zr alloy from 841K to 786K and results in a decrease of flow stress at the given forging temperature. TEM observation revealed that in addition to Al-Fe based intermetallics, $Al_2Cu$ and $Al_2CuMg$ intermetallics appeared. The volume fraction of intermetallic dispersoids increased by the addition of Cu and Mg. Compressive strength of the present alloys was closely related to the volume fraction of intermetallic dispersoids.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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• pp.237-241
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• 2000

The effects of Si addition on the precipitation processes of in Al-Cu-Si alloy films were studied by the transmission electron microscopy. Deposition of an Al-1.5Cu-1.5Si (wt. %) film at $305^{\circ}C$ resulted in formation of fine, uniformly distributed spherical $\theta$-phase particles due to the precipitation of the $\theta$ and Si phase particles during deposition. For deposition at $435^{\circ}C$, fine $\theta$-phase particles precipitated during wafer cooldown, while coarse Si nodules formed at the sublayer interface during deposition. The film susceptibility to corrosion is discussed in relation to the film microstructure and deposition temperature.

• 한국주조공학회지
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• 제30권6호
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• pp.205-209
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• 2010

This study evaluates the influence of strontium addition and holding time on mechanical properties for Al-10.5wt%Si-2wt%Cu secondary die-casting alloy and the measured electrical conductivity of modified alloys. A general improvement in the mechanical properties of the alloy was observed after adding the strontium. Ultimate tensile strength, elongation and electrical conductivity of modified alloys were improved by increasing strontium content and holding time. From these results, the optimal strontium content and holding time were identified on the mechanical properties of Al-10.5wt%Si-2wt%Cu secondary die-casting alloys.