• Journal of Welding and Joining
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• v.29 no.2
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• pp.88-93
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• 2011

This study produced hypereutectic Al-Si clad layer on 1050 Al alloy by a novel laser cladding method. Pure Si powder was mixed with organic binder to make fluid paste which could be screen-printed on the 1050 Al alloy plate. Pulsed Nd:YAG laser was irradiated on the Si paste layer to melt and alloy with Al substrate. Different laser power of 99 W, 179 W and 261 W, was used to see the difference of the microstructure, composition and hardness of the clad layers. When laser power of 179 W was used, the clad layer had overall Si content of 38wt% and composed of fine primary Si particles and fine eutectic phase. At laser power of 261 W, the clad layer had overall Si content of 24wt% and composed of mainly fine eutectic phase. Vickers hardness of HV176.7 and HV150.3 on the clad layer was obtained at laser power of 179 W and 261 W, respectively.

• Journal of the Korean Recycled Construction Resources Institute
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• v.7 no.4
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• pp.333-340
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• 2019

Red mud is an industrial by-product produced during the manufacturing aluminum hydroxide (Al(OH)3) and aluminum oxide(Al2O3) from Bauxite ores. In Korea, aproximately 2 tons of red mud in a sludge form with 50% moisture content is produced when 1ton of Al2O3 is produced through the Bayer process. Neutralization of red mud will help to reduce the environmental impact caused due to its storage and also lessen significantly the ongoing management of the deposits after closure. It will also open opportunities for re-use of the residue which to date have been prevented because of the high pH. Moreover, attention to liquefied red mud(LRM) that does not require heating and grinding process for recycling is needed. In this paper, characteristics of compressive strength for cement paste with content of LRM neutralized by nitric acid and sulfuric acid. The results showed that compressive strength of cement paste with neutralized LRM is higher than that of cement paste with LRM.

• Korean Journal of Materials Research
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• v.25 no.7
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• pp.336-340
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• 2015

For rear metallization with Al paste, Al back contacts require good passivation, high reflectance, and a processing temperature window compatible with the front metal. In this paper, the effect of the firing ambient during the metallization process on the formation of Al rear metal was investigated. We chose three different gases as ambient gases during the firing process. Using SEM, we observed the formation of a back surface field in $N_2$, $O_2$, and Air ambients. To determine the effect of the ambient on Voc, the suns-Voc tool was used. In this study, we described the mechanism of burn-out of organic materials in Al paste during the firing process. The oxygen ambient plays an important role in the burn-out process. We calculated the efficiency with obtained the back surface recombination velocities using PC1D simulation. It was found that the presence of oxygen during the firing process influenced the uniform back surface field because the organic materials in the Al paste were efficiently burned out during heating. The optimized temperature with oxygen flow shows an absolute efficiency of 19.1% at PC1D simulation.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.77.2-77.2
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• 2010

스크린 프린팅을 이용한 태양전지에서 전극소성 시 알루미늄 후면 전극이 실리콘으로 확산되어 후면전계(Back Surface Field)를 형성한다. 후면전계 형성시 알루미늄과 후면전계 사이에 알루미늄-실리콘 합금이 형성된다. 이 알루미늄-실리콘 합금은 알루미늄 후면전극의 전기전도도 및 휨현상, bead 형성 등에 영향을 끼친다. 본 논문은 알루미늄 페이스트에 첨가된 Glass frit이 알루미늄-실리콘 합금 형성에 끼치는 영향을 관찰하였다. 분산제, 유기바인더, 알루미늄을 섞어 1개의 페이스트를 만들었고, Glass frit을 1%, 2%, 3%, 4%, 5% 씩 첨가하여 총 6개의 알루미늄 페이스트를 만들었다. 절삭손상이 제거된 실리콘 기판의 후면에 알루미늄 페이스트를 스크린 프린팅하여 전극을 소성하였다. 주사전자 현미경(SEM)을 사용하여 시편의 단면사진으로부터 Glass frit 함량에 따른 알루미늄-실리콘 합금층의 변화를 관찰하였다. Glass frit이 첨가되지 않은 페이스트는 소성 후 알루미늄-실리콘 합금이 두껍게 형성되었으나, Glass frit이 첨가된 페이스트는 소성 후 알루미늄-실리콘 합금이 얇게 형성되는 결과를 얻었다. 또한 Glass frit을 첨가함에 따라 표면의 원형 모양의 무늬가 작아지면서 3%부터는 사라지는 것을 확인할 수 있었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.302-302
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• 2008

다층 세라믹 기판은 내열성, 내마모성 및 우수한 전기적 특성으로 인하여 기존의 PCB의 대체품으로 많이 이용되며 그 수요가 점점 늘어가고 있는 추세이다. 이에 고집적 다층 세라믹 기판을 보다 다기능화, 고밀도화, 고성능화하기 위해서는 세라믹 층간 정밀도가 아주 중요한 요소로 부각되고 있으며, 무수촉 기판 소성기술을 이용한 층간 정밀도를 높이는 연구가 진행되어지고 있다. 그러나 무수축 기판에서 이러한 정밀도를 유지하기 위해서는 전극의 수축률을 기판의 수축율과 같은 0%에 가깝게 제어하여야 하며 이를 위해서 여러 가지 Frit을 이용하여 수축율을 제어를 시도되고 있다. Ag 전극은 낮은 비저항 우수한 접착성 등의 장점을 가지고 있을 뿐 아니라 가격이 저렴하여 전극재료로서 많은 연구가 이루어졌다. 특히 Infiltration법에 의한 무수축소성의 경우 Glass가 Ag paste로 Infiltration되어 Ag paste와 세라믹의 matching성 확보에 많은 문제가 발생하였다. 이에 본 실험에서는 제조된 Ag conductor paste 에 첨가되는 frit이 무수축 기판과의 매칭성에 어떠한 영향이 있는지에 대하여 고찰하였다. 시편의 준비는 frit이 첨가된 Ag paste를 기판에 screen printing 한 후 $900^{\circ}C$에서 소결한 것을 사용하였으며 Ag 전극의 미세구조를 관찰하고 전기적 특성과 미세구조와의 연관성에 관해 고찰하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.272-272
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• 2009

Screen-printing metal contact is typically applied to the solar cells for mass production. And metal paste is used widely for rear contact formation of silicon solar cells. However, Screen-printing solar cell metal paste contact has low aspect ratio, low accuracy, high resistivity, hard control of unclean process. In this paper is to develop resistivity of rear contact for silicon solar cells applications. 4-point prove result, This resistivity of rear contact by Al evaporation was measured about $3.56{\times}10^6{\Omega}{\cdot}cm$ less than screen printed solar cell about $52.6{\times}10^6{\Omega}{\cdot}cm$.

• Korean Journal of Materials Research
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• v.20 no.7
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• pp.370-373
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• 2010

In fabricating plasma display panels, the photolithographic process is used to form patterns of barrier ribs with high accuracy and high aspect ratio. It is important in the photolithographic process to control the refractive index of the photosensitive paste. The composition of this paste for photolithography is based on the $B_2O_3-SiO_2-Al_2O_3$ glass system, including additives of alkali oxides and rare earth oxides. In this work, we investigated the density, structure and refractive index of glasses based on the $B_2O_3-SiO_2-Al_2O_3$ system with the addition of $Li_2O$, $K_2O$, $Na_2O$, CaO, SrO, and MgO. The refractive index of the glasses containing K2O, Na2O and CaO was similar to that of the [BO3] fraction while that of the SrO, MgO and Li2O containing glasses were not correlated with the coordination fraction. The coordination number of the boron atoms was measured by MAS NMR. The refractive index increased with a decrease of molar volume due to the increase in the number of non-bridging oxygen atoms and the polarizability. The lowest refractive index (1.485) in this study was that of the $B_2O_3-SiO_2-Al_2O_3-K_2O$ glass system due to the larger ionic radius of $K^+$. Based on our results, it has been determined that the refractive index of the $B_2O_3-SiO_2-Al_2O_3$ system should be controlled by the addition of alkali oxides and alkali earth oxides for proper formation of the photosensitive paste.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.97-97
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• 2009

산업용 온수관련용 자동차용 등의 다양한 용도로 응용이 가능한 고기능성 세라믹 히터 제작을 위해 후막공정 기술을 적용한 적층형 세라믹 히터의 수요가 증가하고 있으며, 고열로 인한 변형의 우려가 있는 내열성 기판 제작에도 적층형 HTCC 세라믹 기판 적용이 확대되고 있다. 이러한 고내열성 세라믹 기판 제작을 위해서는 paste의 균일성, Low TCR 특성 및 세라믹과 paste 매칭성 확보가 중요한 요소이다. 본 연구에서는 W/Mo 함량비를 변화시켜가며 paste를 제조하여 비저항과 TCR 특성을 비교한 후 가장 낮은 값을 나타내는 조성을 선정하였다. 이 조성에 $Al_2O_3$, $Ta_2O_5$ 등의 첨가제를 사용하여 비저항 특성 개선을 위한 실험을 통해 우수한 고내열성 기판용 paste 조성을 확보하고자 하였다. 그리고 이 Paste를 적용하여 HTCC 그린시트와 매칭성 조건을 확인하고자 하였다.

• Advances in concrete construction
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• v.8 no.3
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• pp.217-223
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• 2019

This paper presents the mechanical and microstructural properties of the geopolymer paste which was developed by utilizing the industrial by-products, rice husk ash (RHA) and ultra-fine slag. Ultra-fine slag particles with average particle size in the range of 4 to 5 microns. RHA is partially replaced with ultra-fine slag at different levels of 0 to 50%. Sodium silicate to sodium hydroxide ratio of 1.0 and alkaline liquid to binder (AL/B) ratio of 0.60 is taken. Setting time, compressive, flexural strengths were studied up to the age of 90 days with different concentrations of NaOH. The microstructure of the hybrid geopolymer paste was studied by performing the SEM, EDS, and XRD on the broken samples. RHA based geopolymer paste blended with ultrafine slag resulted in high compressive and flexural strengths and increased setting times of the paste. Strength increased with the increase in NaOH concentration at all ages. The ultra-small particles of the slag acted as a micro-filler into the paste and enhanced the properties by improving the CASH, NASH, and CSH. The maximum compressive strength of 70MPa was achieved at 30% slag content with 16M NaOH. The results of XRD, SEM, and EDS at 30% replacement of RHA with ultra-fine slag densified the paste microstructure.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.55-64
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• 1995

Metallizing method on ceramic surface is one of the compositing technology of ceramics and metal. The purpose of this study is to make HIC (Hybrid Intergrated Circuit) with copper metallizing method of which copper layer is formed on ceramic substrate by firing in atmosphere in lieu of conventional hybrid microcircuit systems based on noble metal. Metallizing pastes were made from various copper compounds such as Cu$_{2}$O, CuO, Cu, CuS and kaolin. And the screen printing method was used. The characteristics of metallized copper layers were analyzed through the measurement of sheet resistance, SEM, and EDZX. The results obtainted are summarized as follows; 1. The copper metallizing layers on ceramic surface can be formed by firing in air. 2. The metallized layer using Cu$_{2}$O paste showed the smallest sheet resistance among a group of copper chemical compounds. And optimum metallizing conditions are 15 minutes of firing time, 1000.deg.C of firig temperature, and 3 minutes of deoxidation time. 3. The results of EDAX analysis showed mutual diffusion of Cu and Al. 4. The kaolin plays a important role of deepening the penetration of Cu to $Al_{2}$O$_{3}$ ceramics. But if the kaolin content is too much, sheet resistance increases and copper metallizing layer becomes brittle.