• Korean Journal of Materials Research
• /
• v.22 no.10
• /
• pp.539-544
• /
• 2012

We have grown AlN nanorods and AlN films using plasma-assisted molecular beam epitaxy by changing the Al source flux. Plasma-assisted molecular beam epitaxy of AlN was performed on c-plane $Al_2O_3$ substrates with different levels of aluminum (Al) flux but with the same nitrogen flux. Growth behavior of AlN was strongly affected by Al flux, as determined by in-situ reflection high energy electron diffraction. Prior to the growth, nitridation of the $Al_2O_3$ substrate was performed and a two-dimensionally grown AlN layer was formed by the nitridation process, in which the epitaxial relationship was determined to be [11-20]AlN//[10-10]$Al_2O_3$, and [10-10]AlN//[11-20]$Al_2O_3$. In the growth of AlN films after nitridation, vertically aligned nanorod-structured AlN was grown with a growth rate of $1.6{\mu}m/h$, in which the growth direction was <0001>, for low Al flux. However, with high Al flux, Al droplets with diameters of about $8{\mu}m$ were found, which implies an Al-rich growth environment. With moderate Al flux conditions, epitaxial AlN films were grown. Growth was maintained in two-dimensional or three-dimensional growth mode depending on the Al flux during the growth; however, final growth occurred in three-dimensional growth mode. A lowest root mean square roughness of 0.6 nm (for $2{\mu}m{\times}2{\mu}m$ area) was obtained, which indicates a very flat surface.

• Journal of the Korean Ceramic Society
• /
• v.33 no.10
• /
• pp.1089-1094
• /
• 1996

In this study the formation mechanism of AlN synthesized by SHS(Self-propagating high-temperature Syn-thesis) was studied in order to obtain uniform AlN powder size and morphology. Based on the morphology of AlN synthesized and the calculation of the temperature of Al powder as a function AlN layer thickness the formation mechanism of AlN was proposed.

• Korean Journal of Materials Research
• /
• v.25 no.8
• /
• pp.398-402
• /
• 2015

Fundamental studies of microstructural changes and high temperature deformation of titanium aluminide (TiAl) were conducted from the view point of the effect of Al content in order to develop the manufacturing process of TiAl. Microstructures in an as cast state consisted mainly of lamellar structure irrespective of Al content. By homogenization at 1473 K, the microstructures of Ti-49Al and Ti-51Al were transformed into an equiaxial structure which was composed of ${\gamma}$-TiAl, while the lamellar structure that was observed in Ti-46Al and Ti-47Al was much more stable. We found that the reduction of Al content suppressed the formation of equiaxial grains and resulted in a microstructure of only a lamellar structure. On Ti-49Al and Ti-51Al, dynamic recrystallization occurred during high temperature deformation, and the microstructure was transformed into a fine equiaxial one, while the microstructures of Ti-46Al and Ti-47Al contained few recrystallized grains and consisted mainly of a deformed lamellar structure. We observed that on the low-Al alloys the lamellar structure under hard mode deformation conditions deformed as kink observed B2-NiAl. High temperature deformation characteristics of TiAl were strongly affected by Al content. An increase of Al content resulted in a decrease of peak stress and activation energy for plastic deformation and an increase of the recrystallization ratio in TiAl.

• Journal of the Korean Ceramic Society
• /
• v.27 no.6
• /
• pp.799-807
• /
• 1990

In this study, effects of oxide additives on mechanical properties and microstructure of A1N and A1N polytype ceramics were investigated. Fine A1N powder was synthesized by nitriding alumiuim hydroxide prepared from Al-isopropoxide, at 1350$^{\circ}C$ for 10h in N2 atmosphere. By adding 3w/o Y2O3, 0.56w/o CaO, and 10w/o SiO2 to AlN powder, AlN and AlN polytype ceramics were prepared by hot-pressing under the pressure of 30 MPa at 1800$^{\circ}C$ for 1h. AlN ceramics with no additives formed considerable amount of AlON phase, while AlN ceramics doped with Y2O3 or CaO decreased AlON phase and formed Y-Al or Ca-Al oxide compound. AlN＋10w/o SiO2(＋3w/o Y2O3) composition produced AlON and AlN polytype compound having 21R as a major phase. Room temperature flexural strength of AlN ceramics with no additive was 246MPa, and room temperature flexural strength and critical temperature difference by thermal shock(ΔTc) of AlN ceramics dooped with Y2O3 or CaO were 532MPa/340$^{\circ}C$ and 423MPa/300$^{\circ}C$, respectively. Y2O3 and CaO used as sintering agent played roles of densification and oxygen removal of AlN ceramics, and affected grain growth/grain morphologies of AlN ceramics.

• Journal of the Korean Ceramic Society
• /
• v.51 no.5
• /
• pp.498-504
• /
• 2014

Particulate nitride composites have been fabricated by sintering the compacted powder of AlN and 5 - 64.3 mol% $Al_2O_3$, with a small addition of $Y_2O_3$ ($Y_2O_3$/AlN, 1 wt%), in 1-atm nitrogen gas at $1650-1900^{\circ}C$. The composites were characterized in terms of sintering behavior, phase relations, microstructure and thermal shock resistance. AlN, 27R AlN pseudopolytype, and alminium oxynitride (AlON, $5AlN{\cdot}9Al_2O_3$) were found to existin the sintered material. Regardless of batch composition, the AlN-$Al_2O_3$ powder compacts exhibited similar sintering behavior; however, the degree of shrinkage commonly increased with increasing $Al_2O_3$ content, consequently giving high sintered bulk density. By increasing the $Al_2O_3$ addition up to ${\geq}50 mol%$, the matrix phase in the sintered material was converted from AlN or 27R to AlON. Above $1850^{\circ}C$, a liquid phase was formed by the reaction of $Al_2O_3$ with AlN, aided by $Y_2O_3$ and mainly existed at the grain boundaries of AlON. Thermal shock resistance was superior in the sintered composite consisting of AlON with dispersed AlN or AlN matrix phase.

• Composites Research
• /
• v.12 no.3
• /
• pp.36-44
• /
• 1999

The fabrication process of $Al_2O_{3p}/Al$ composite by in-situ process was investigated. The effects of processing variables such as addition type and content of Mg, processing temperature and time on the infiltration behavior of molten Al, microstructure and hardness were investigated. When the pure Al was infiltrated into mixtures of Mg and $Al_2O_3l$ powder, processing temperature required to spontaneous infiltration was decreased, and the content of Mg was the most powerful variable for infiltration of molten Al. But when the Al-Mg alloy was infiltrated into $Al_2O_3l$ particles, infiltration ratio indicated nearly same value regardless of Mg content in alloy and processing temperature, and critical processing temperature required to spontaneous infiltration was $800^{\circ}C$. The $Al_2O_{3p}/Al$ composites which were fabricated by mixtures of Mg and $Al_2O_3l$ powders resulted in high hardness value, but hardness values were scattered due to non uniform dispersion of $Al_2O_3l$ particles by excessive reaction of Mg.

• Journal of the Korean Society for Heat Treatment
• /
• v.18 no.5
• /
• pp.281-287
• /
• 2005

Titanium aluminium nitride((TiAl)N) film is anticipated as an advanced coating film with wear resistance used for drills, bites etc. and with corrosion resistance at a high temperature. In this study, (TiAl)N thin films were deposited both at room temperature and at elevated substrate temperatures of 573 to 773 K by using a two-facing-targets type DC sputtering system in a mixture Ar and $N_2$ gases. Atomic compositions of the binary Ti-Al alloy target is Al-rich (25Ti-75Al (atm%)). Process parameters such as precursor volume %, substrate temperature and Ar/$N_2$ gas ratio were optimized. The crystallization processes and phase transformations of (TiAl)N thin films were investigated by X-ray diffraction, field-emission scanning electron microscopy. The microhardness of (TiAl)N thin films were measured by a dynamic hardness tester. The films obtained with Ar/$N_2$ gas ratio of 1:3 and at 673 K substrate temperature showed the highest microhardness of $H_v$ 810. The crystallized and phase transformations of (TiAl)N thin films were $Ti_2AlN+AlN{\rightarrow}TiN+AlN$ for Ar/$N_2$ gas ratio of 1:3, $Ti_2AlN+AlN{\rightarrow}TiN+AlN{\rightarrow}Ti_2AlN+TiN+AlN$ for Ar/$N_2$ gas ratio of 1:1 and $TiN+AlN{\rightarrow}Ti_2AlN+TiN+AlN{\rightarrow}Ti_2AlN+AlN{\rightarrow}Ti_2AlN+TiN+AlN$ for Ar/$N_2$ gas ratio of 3:1. The above results are discussed in terms of crystallized phases and microhardness.

• Journal of Korea Foundry Society
• /
• v.42 no.5
• /
• pp.273-281
• /
• 2022

In order to understand the solidification behavior and microstructural evolution of the Al-Cu-Si ternary eutectic alloy system, changes of the microstructure of the Al-Cu-Si ternary eutectic alloy with different cooling rates were investigated. When the mold preheating temperature is 500℃, primary Si and Al2Cu dendrites are observed, with (α-Al+Al2Cu) binary eutectic and needle-shaped Si subsequently observed. In addition, even when the mold preheating temperature is 300℃, primary Si and Al2Cu dendrites can be observed, and both (α-Al+Al2Cu+Si) areas observed and areas not observed earlier appear. When the mold preheating temperature is 150℃, bimodal structures of the binary eutectic (α-Al+Al2Cu) and ternary eutectic (α-Al+Al2Cu+Si) are observed. When the preheating temperature of the mold is changed to 500℃, 300℃, and 150℃, the greatest change is in the Si phase, and upon reaching the critical cooling rate, the ternary eutectic of (α-Al+Al2Cu+Si) forms. If the growth of the Si phase is suppressed upon the formation of (α-Al+Al2Cu+Si), the growth of both Al and Cu is also suppressed by a cooperative growth mechanism. As a result of analyzing the Al-27wt%Cu-5wt%Si ternary eutectic alloy with a different alloy design simulation programs, it was confirmed that different results arose depending on the program. A computer simulation of the alloy design is a useful tool to reduce the trial and error process in alloy design, but this effort must be accompanied by a task that increases reliability and allows a comparison to microstructural results derived through actual casting.

• Journal of the Korean Ceramic Society
• /
• v.35 no.9
• /
• pp.923-932
• /
• 1998

Al2O3/Al composites were produced by displacement reaction method which was carried out by imm-ersing the sintered silica preform which was prepared form fused silica powder in molten aluminu. an ac-tivation energy of 94kJ/mole was calculated from Al-SiO2 reaction data in 1000-130$0^{\circ}C$ temperature range With increase of reaction temperature the alumina particle in the Al2O3/Al composites produced with pur metal Al showed grain growth and the growth of alumina particle in Al2O3/Al composite produced by using of Mg contained Al alloy was inhibited. The flexural strength of Al2O3/Al composites produced at 100$0^{\circ}C$ showed the highest value as 393 MPa. Flexural strength of the composite fabricated at 85$0^{\circ}C$ showed higher deviation than that of the composite produced at above 100$0^{\circ}C$ Low flexural strength of the composite fa-bricated at 120$0^{\circ}C$ due to the growth of pore and alumina particle size. The hardness of composites de-pended on alumina content in Al2O3/Al composite decreased with increasing of aluminium content in case the same alumina content and increased with increasing of silicon content in composite.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.7 no.4
• /
• pp.610-618
• /
• 1997

$Al_2O_3$/Al composite was produced by the infiltration of molten Al Into $Al_2$O$_3$ preform at 900-$1200^{\circ}C$, The process was accelerated by spreading borosilicate glass powder onto the interface between Al powder compact and $Al_2O_3$ preform. Melt infiltration initialed after incubation period, and the growth of infiltration was observed to be linearly propotional with time. The major components of the composite are $Al_2O_3$ and Al with a trace of Si which is remained from borosilicate, the reaction accelerator. Relative density of the composite increased with the particle size of $Al_2O_3$ but decreased with infiltration temperature. As infiltration temperature increases from room to $950^{\circ}C$ higher strength and fracture toughness were obtained.