• Journal of Powder Materials
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• v.19 no.4
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• pp.271-277
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• 2012

$SnO_2$ nanotubes were successfully synthesized using an electrospinning technique followed by calcination in air. The nanotubes were the single phase nature of $SnO_2$ and consisted of approximately 14 nm nanocrystals. SEM and TEM characterizations demonstrated that uniform hollow fibers with an average outer diameter of around 124 nm and wall thickness of around 25 nm were successfully obtained. As anode materials for lithium ion batteries, the $SnO_2$ nanotubes exhibited excellent cyclability and reversible capacity of $580mAhg^{-1}$ up to 25 cycles at $100mAg^{-1}$ as compared to $SnO_2$ nanoparticles with a capacity of ${\sim}200mAhg^{-1}$. Such excellent performance of the $SnO_2$ nanotube was related to the one-dimensional hollow structure which acted as a buffer zone during the volume contraction and expansion of Sn.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.181-182
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• 2015

본 실험에서는 PET 위 무전해 도금을 위한 대안 공정 개발을 목적으로 은(Ag)와 과망간산염($MnO_4{^-}$)를 사용하여 기존에 일반적으로 사용된 Sn/Pd의 Sensitization과 Activation process를 대체하는 기술을 연구했다. Palladium(Pd)의 경우 공정비용에서 높은 부분을 차지하기 때문에 이를 대신하여 Ag를 사용했으며, PET 표면의 전처리를 위해 Ultra Violet과 과망간 산염을 이용하여 표면의 친수성을 높였다. 과망간산염을 사용하여 표면을 전처리하는 과정에서 이산화망간($MnO_2$)과 알코올 작용기가 생성되는데 Ag activation 단계에서 촉매 생성에 중간 매개체 역할을 하는 것으로 사료된다. 이와 같은 결론을 도출 하기 위해서 표면 위 Ag의 화학적 구조 및 상 분석을 위해 XPS와 TEM이 사용되었으며 표면에서 Ag는 Ag-O와 같은 Silver oxide의 형태와 Ag-Mn-O와 같은 Compound로 무전해 도금을 위한 촉매 역할 하는 것으로 판단된다.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.19-27
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• 2003

Surface finishes of PCB laminates are important in the solder joint reliability of flip chip package because the types and thicknesses of intermetallic compound(IMC), and compositions and hardness of solders are affected by them. In this study, effects of surface finishes of PCB on the low cycle fatigue resistance of Sn-based lead-free solders; Sn-3.5Ag, Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag-XBi(X=2.5, 7.5) and Sn-0.7Cu were investigated for the Cu and Au/Ni surface finish treatments. Displacement controlled room temperature lap shear fatigue tests showed that fatigue resistance of Sn-3.5Ag-XCu(X=0.75, 1.5), Sn-3.5Ag and Sn-0.7Cu alloys were more or less the same each other but much better than that of Bi containing alloys regardless of the surface finish layer used. In general, solder joints on the Au/Ni finish showed better fatigue resistance than those on the Cu finish. Cross-sectional fractography revealed microcracks nucleation inside of the interfacial IMC near the solder mask edge, more frequently on the Cu than the Au/Ni surface finish. Macro cracks followed the solder/IMC interface in the Bi containing alloys, while they propagated in the solder matrix in other alloys. It was ascribed to the Bi segregation at the solder/IMC interface and the solid solution hardening effect of Bi in the $\beta-Sn$ matrix.

• Proceedings of the KIEE Conference
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• 2008.10a
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• pp.169-170
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• 2008

In this study, low temperature sintering property of the $0.6TiTe_3O_8-0.4MgTiO_3$ ceramics with sintering adds were investigated for LTCC application which enable to cofiring with Ag electrode. $TiTe_3O_8$ mixed with $MgTiO_3$ to improve the temperature property. In the X-ray diffraction patterns, the columbite structure of $TiTe_3O_8$ phase and ilmenite structure of $MgTiO_3$ phase were coexisted in all specimens. In the case of SnO addition, the bulk density and dielectric constant were increased but quality factor was decreased with amount of SnO additions. The TCRF of the $0.6TiTe_3O_8-0.4MgTiO_3$+xwt%SnO ceramics were shifted to negative direction. The dielectric constant, quality factor and TCRF of the $0.6TiTe_3O_8-0.4MgTiO_3$ ceramics with 2.5wt% addition of SnO sintered at $830^{\circ}C$ for 1hr were 29.86, 35,800 GHz, -0.58 ppm/$^{\circ}C$, respectively.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.7-14
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• 2017

The effect of high temperature-moisture on corrosion and mechanical properties for Sn-0.7Cu, Sn-3.0Ag-0.5Cu (SAC305) solders on flexible substrate was studied using Highly Accelerated Temperature/Humidity Stress Test (HAST) followed by three-point bending test. Both Sn-0.7Cu and SAC305 solders produced the internal $SnO_2$ oxides. Corrosion occurred between the solder and water film near flexible circuit board/copper component. For the SAC305 solder with Ag content, furthermore, octahedral corrosion products were formed near Ag3Sn. For the SAC305 and Sn-0.7Cu solders, the amount of internal oxide increased with the HAST time and the amount of internal oxides was mostly constant regardless of Ag content. The size of the internal oxide was larger for the Sn-0.7Cu solder. Despite of different size of the internal oxide, the fracture time during three-point bending test was not significantly changed. It was because the bending crack was always initiated from the three-point corner of the chip. However, the crack propagation depended on the oxides between the flexible circuit board and the Cu chip. The fracture time of the three-point bending test was dependent more on the crack initiation than on the crack propagation.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.127-127
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• 2011

We investigate the transparent TFTs using a transparent ZnSnO3 (ZTO)/Ag/ZTO multilayer electrode as S/D electrodes with low resistivity of $3.24{\times}10^{-5}$ ohm-cm, and high transparency of 86.29% in ZTO based TFTs. The Transparent TFTs (TTFTs) are prepared on glass substrate coated 100 nm of ITO thin film. On atomic layer deposited $Al_2\;O_3$, 50 nm ZTO layer is deposited by RF magnetron sputtering through a shadow mask for channel layer using ZTO target with 1 : 1 molar ratio of ZnO : $SnO_2$. The power of 100W, the working pressure of 2mTorr, and the gas flow of Ar 20 sccm during the ZTO deposition. After channel layer deposition, a ZTO (35 nm)/Ag (12 nm)/ZTO(35 nm) multilayer is deposited by DC/RF magnetron sputtering to form transparent S/D electrodes which are patterned through the shadow mask. Devices are annealed in air at 300$^{\circ}C$ for 30 min following ZTO deposition. Using UV/Visible spectrometer, the optical transmittances of the TTFT using ZTO/Ag/ ZTO multilayer electrodes are compared with TFT using Mo electrode. The structural properties of ZTO based TTFT with ZTO/Ag/ZTO multilayer electrodes are analyzed by high resolution transmission electron microscopy (HREM) and X-ray photoelectron spectroscopy (XPS). The transfer and output characterization of ZTO TTFTs are examined by a customized probe station with HP4145B system in are.

• Journal of the Korean Society of Marine Environment & Safety
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• v.14 no.1
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• pp.9-14
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• 2008

A Nano particle is a small particle with at least one dimension less than 100 nm Nanoparticle is currently used in an area cf intense scientific research, due to a wide variety cf potential applications in biomedical, optical, and electronic fields. In order to know the biological effect of the nine Nano particles on fertilized egg of Crassostrea gigas experiments were performed Development rates of control (free Nano particles) C. gigas to a particular larval stage (D-shape) was 78%. Development rate of C gigas to a parcicular larval stage (D-shape) after 24 hours exposure to 0.05ppm of AGZ020, Nano silver, P-25 and SnO were 22%, 52%, 58% and 76%, respectively. However, all fertilized eggs were destructed within 8 hours afters exposure to 20ppm of respective particles. On the other hand, All fertilized eggs were not affected after 24 hours respective exposure to 0.05ppm of In, Sb, Sn, Zn, and Ag-$TiO_2$ particles. However, development rates of C. gigas after 24 hours exposure to 20ppm of In, Sb, Sn, Zn, Ag-$TiO_2$ were 57%, 60%, 50%, 65%, and 64% respectively.

• Korean Chemical Engineering Research
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• v.56 no.5
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• pp.694-704
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• 2018

Novel $SnO_2$ mixed biochar composite was prepared from banana peel developed as electrode material for supercapacitor using simple chemical co-precipitation method. The physiochemical and morphological properties of activated composite $SnO_2$ mixed biochar were investigated with XRD, FTIR, UV-vis, FESEM and HRTEM. The composite accounts for outstanding electrochemical behavior such as high specific capacitance, significant rate capability and leading to good cycle retention up to 3500 cycles when used as electrode material for supercapacitors. Highly permeable $SnO_2$ mixed biochar derived from banana peel exhibited maximum specific capacitance of $465F\;g^{-1}$ at a scan rate of $10mV\;s^{-1}$ by cyclic voltammetry (CV) and $476Fg^{-1}$ at current density of $0.15Ag^{-1}$ by charge discharge studies significantly higher about 47% than previously reported identical work on banana peel biochar.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.278.2-278.2
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• 2014

We have investigated the highly flexible and transparent Si-doped $In_2O_3$(ISO)/Ag/ISO multilayer grown on polyethylene terephthalate (PET) substrates using a roll-to-roll sputtering system. The electrical and optical properties of ISO/Ag/ISO multilayer electrodes depended on the insertion of a nano-size Ag layer. Due to the high conductivity of a nano-size Ag layer, the optimized ISO/Ag/ISO multilayer electrodes showed the lowest resistivity of $3.679{\times}10^{-5}Ohm-cm$, even though the ISO/Ag/ISO multilayer electrodes was sputtered at room temperature. Furthermore, the ISO/Ag/ISO multilayer electrodes exhibited a high transmittance of 86.33%, because of the anti-reflection effect, comparable to Sn-doped $In_2O_3$ (ITO) electrodes. In addition, the ISO/Ag/ISO multilayer electrodes had a very smooth surface morphology without surface defects and showed good flexibility. The flexible OSCs fabricated on ISO(30nm)/Ag(8nm)/ISO(30nm) multilayer electrode showed a power conversion efficiency of 3.272%. This result indicates that the ISO/Ag/ISO multilayer is a promising transparent conducting electrode for flexible OSCs.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.150-150
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• 2012

본 연구는 1차원 나노 구조의 합성과 기초적 분석에 관한 연구로써 특히 무기 산화물 나노재료를 그 대상으로 하였다. 내용으로는 첫째, 1차원 코어 나노와이어의 합성을 하였고 Thermal evaporation, substrate의 가열, 그리고 MOCVD 를 사용한 결과들을 나열한다. 둘째, 코어-쉘 나노와이어를 제작하기 위하여 특히 쉘층의 제작방법을 연구하였는데 PECVD, ALD, 그리고 sputtering에 의한 결과들을 나열하고 간단히 설명한다. Thermal evaporation에 의한 1차원 나노와이어 합성의 경우는 MgO의 예를 들었는데 MgO 나노와이어는 Au가 증착된 기판을 열처리하여 Au dot를 형성하고 이의 morphology를 조절하여 최적의 나노와이어 합성조건을 선정하였다. 이로써 기판 morphology가 나노선의 성장및 형상에 영향을 준다는 사실을 알게 되었다. 이 사실은 In2O3기판을 사용하고 이의 표면거칠기를 열처리로 조절하므로써 역시 나노와이어의 성장을 촉진하는 방법을 찾아내었다. 또한 thermal evaporation공법은 source분말의 선택에 따라 다양한 소재를 제작가능하다는 결과를 제시하였다. 예를 들면 SiOx 층이 precoating된 chamber내에서 MgO 나노선을 합성하는 것과 동일한 조건으로 실험을 진행하면 Mg2SiO4 나노와이어가 형성된 것을 확인하였다. 또한 Sn과 MgB2 분말을 함께 적용할 경우 Sn tip을 가진 MgO 나노와이어를 얻을 수 있었다. 이는 Sn이 동시에 촉매의 역할을 하였기 때문일 것으로 추정된다. 한편 Sn과 Bi 혼합분말을 적용한 경우 Bi2Sn2O7 신소재 tip을 포함한 SnO2 나노와이어를 얻을 수 있었다. 이 경우 Bi원자가 적절한 촉매의 역할을 수행한 것으로 사료된다. Substrate의 가열공법에서는 Si wafer상에 각종 금속 즉 Au, Ag, Cu, Co, Mo, W, Pt, Pd등 초박막을 DC sputter 로 형성한후 annealing하는 기술을 사용하였다. 특기할 만한 것은 Co를 사용한 경우 나노와이어의 spring구조를 얻을 수 있었다는 점이다. MOCVD에 의하여는 Ga2O3및 Bi2O3 나노와이어를 비교적 저온에서 합성하였고 In2O3의 경우는 독특한 나노구조를 형성하였고 이의 결정학적 특성에 대하여 조사하였다.