• Title/Summary/Keyword: Ag-paste

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Reduce on the Cost of Photovoltaic Power Generation for Polycrystalline Silicon Solar Cells by Double Printing of Ag/Cu Front Contact Layer

  • Peng, Zhuoyin;Liu, Zhou;Chen, Jianlin;Liao, Lida;Chen, Jian;Li, Cong;Li, Wei
    • Electronic Materials Letters
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    • v.14 no.6
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    • pp.718-724
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    • 2018
  • With the development of photovoltaic industry, the cost of photovoltaic power generation has become the significant issue. And the metallization process has decided the cost of original materials and photovoltaic efficiency of the solar cells. Nowadays, double printing process has been introduced instead of one-step printing process for front contact of polycrystalline silicon solar cells, which can effectively improve the photovoltaic conversion efficiency of silicon solar cells. Here, the relative cheap Cu paste has replaced the expensive Ag paste to form Ag/Cu composite front contact of silicon solar cells. The photovoltaic performance and the cost of photovoltaic power generation have been investigated. With the optimization on structure and height of Cu finger layer for Ag/Cu composite double-printed front contact, the silicon solar cells have exhibited a photovoltaic conversion efficiency of 18.41%, which has reduced 3.42 cent per Watt for the cost of photovoltaic power generation.

Effects of Flux Activator on Wettability and Slump of Sn-Ag-Cu Solder Paste (플럭스 활성제 종류에 따른 Sn-Ag-Cu 솔더 페이스트의 젖음성 및 슬럼프 특성 평가)

  • Kwon, Soonyong;Seo, Wonil;Ko, Yong-Ho;Lee, Hoo-Jeong;Yoo, Sehoon
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.123-128
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    • 2018
  • Effect of activators in flux on the printability and wettability of a solder paste was evaluated in this study. The activators in this study were dicarboxylic acids, which were oxalic acid (n = 0), malonic acid (n = 1), succinic acid (n = 2), glutaric acid (n = 3), adipic acid (n = 4), and pimelic acid (n = 5). When the solder pastes were observed with a SMT scope, solder with glutaric acid showed clean and shiny surface when it was melted. Slump ratio of the solder pastes was low when the carbon numbers of the dicarboxylic acid were 1-3. Spreadability was high when the carbon number was over 2. Zero cross time of wetting balance test was under 1 sec when the carbon number was over 3. When activator was oxalic acid or malonic acid, zero cross time was over 1 sec and maximum wetting force was low. Fluxes with the oxalic acid and malonic acid showed decomposition at the temperature close to melting point. Among the dicarboxylic acids, glutaric acid provided excellent slump, spreadability, and wettability.

Study on Joining Strength Improvement of Solder Joint with Pb Free Solder (Pb Free 솔더를 사용한 솔더 접합부의 접합 강도 향상에 관한 연구)

  • 신영의;김영탁
    • Journal of Welding and Joining
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    • v.15 no.2
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    • pp.36-42
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    • 1997
  • In this paper, stability of initial strength at solder joint with lead free solders, such as Sn-In (52-48%) and Sn-Ag (96.5-3.5wt%) was studied. To obtain at solder joint with high quality, it is very important to control the temperature at the interface of solder joints. It is found that the thermal EMF (electro motive force) occurs betwee lead frame and copper pad on a substrate during reflow soldering process using heated tip. As a result of control the temperature at interface of solder joints, variation of initial strength at solder joint decreases from about $\pm40%$ to $\pm20%$, and it is realized Pb free soldering process using Sn/In and Sn-Ag solder paste.

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Assay of Dinitrotoluene on a Contaminated Soil Sample with an Anodic Stripping Peak Current

  • Ly, Suw-Young;Lee, Chang-Hyun;Jung, Young-Sam
    • Journal of Environmental Science International
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    • v.15 no.11
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    • pp.997-1002
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    • 2006
  • This report presents a voltammetric assay of dinitrotoluene using a DNA immobilized onto a carbon nanotube paste electrode (PE). The cyclic voltammetry (CV) and square wave (SW) stripping voltammetry parameters of the optimized conditions were obtained. An anodic peak current appeared at 0.3 V (versus Ag/AgCl) in a 0.1-M $NH_4H_2PO_4$ electrolyte solution. The detection limit was found to be $0.6ngL^{-1}$(S/N = 10), within a deposition time of 100 sec.

A Preliminary Study on the Corrosion Monitoring Sensor of Chloride Permeation into Concrete (콘크리트내 염분침투 모니터링을 위한 부식 센서 개발에 관한 기초적 연구)

  • Joh, Sung-Hyung;Lee, Hyun-Seok;Lee, Han-Seung
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2010.05a
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    • pp.5-7
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    • 2010
  • Corrosion sensors were devised to develop a system whereby the depth of chloride permeation from concrete surfaces can be monitored in cover concrete of reinforced concrete structures. For making sensor which is similar to rebar author uses Screen printer machines, Ag paste and Fe powder. Appropriate portion of Ag and Fe is over 1:2. The resistance of sensors increased as the degree of corrosion increased. And according to cover depth author suggests sensor system which has a demanded cover depth. It was therefore confirmed that the corrosion sensor can monitor chloride permeation by change of resistance.

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Printed flexible OTFT backplane for electrophoretic displays

  • Ryu, Gi-Seong;Lee, Myung-Won;Song, Chung-Kun
    • Journal of Information Display
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    • v.12 no.4
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    • pp.213-217
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    • 2011
  • Printing technologies were applied to fabricate a flexible organic thin-film transistor (OTFT) backplane for electrophoretic displays (EPDs). Various printing processes were adopted to maximize the figures of each layer of OTFT: screen printing combined with reverse offset printing for the gate electrodes and scan bus lines with Ag ink, inkjet for the source/drain electrodes with glycerol-doped Poly (3,4-ethylenedioxythiophene): Poly (styrenesulfonate) (PEDOT:PSS), inkjet for the semiconductor layer with Triisopropylsilylethynyl (TIPS)-pentacene, and screen printing for the pixel electrodes with Ag paste. A mobility of $0.44cm^2/V$ s was obtained, with an average standard deviation of 20%, from the 36 OTFTs taken from different backplane locations, which indicates high uniformity. An EPD laminated on an OTFT backplane with $190{\times}152$ pixels on an 8-in panel was successfully operated by displaying some patterns.

AC & DC Electrical Characterization of PTC $BaTiO_3$ and Electrodes (PTC $BaTiO_3$ 및 전극의 직류 및 교류 특성)

  • 전표용;최경만
    • Journal of the Korean Ceramic Society
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    • v.28 no.2
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    • pp.101-108
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    • 1991
  • 0.2 mo1% La doped BaTiO3 samples were prepared by a wet chemical process (Pechini process) and electrical conductivity were measured from annealing temperatures(800-110$0^{\circ}C$) to room temperature continuously. 2 probe I-V characteristics showed that Pt electrodes were non-ohmic below about 80$0^{\circ}C$ for Ladoped sample. I-V curves showed varistor behavior and breakdown voltages showed PTC-like behavior. AC complex impedance of 0.2 La and 0.05 Mn mo1% doped BaTiO3 samples with three different electrodes (electroless Ni, Pt, Ag electrodes) were measured with temperature variation. Complex impedance plots showed that the samples with electroless Ni electrodes have negligible electrode resistance. Samples with Ag or Pt paste electrodes showed large electrode resistance. PTC effect, which is defined as the ratio of maximum resistance to minimum resistance, was found to be less than 10 for 0.2 mo1% La doped dense sample however greater than 105 with codoping of 0.05 mo1% Mn and 0.2 mol% La.

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Influence of Flip Chip Bonding Conditions Using Anisotropic Conductive Adhesive(ACA) in the Fabrication of RFID Tag (RFID tag의 제작 공정에서 비등방 전도성 접착제를 사용한 flip chip bonding 조건의 영향)

  • Lee, Jun-Sik;Kim, Jeong-Han;Kim, Mok-Sun;Lee, Jong-Hyeon
    • Proceedings of the KWS Conference
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    • 2007.11a
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    • pp.223-226
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    • 2007
  • 본 연구에서는 Ag anisotropic conductive adhesive(ACA)의 종류, 경화 조건 및 안테나 패턴의 재질에 따른 flip chip bonding된 RFID die의 접합부 신뢰성이 조사되었다. 접합강도 측정에 의하여 접합강도가 최적화되는 공정 시간을 결정할 수 있었으며, 그러한 최적의 공정조건에서는 paste-type Ag ink로 인쇄된 안테나 상에서의 RFID die의 접합강도가 Cu 재질 안테나에 비해 상대적으로 높게 측정됨을 알 수 있었다. RFID tag의 인식거리 측정 시험을 통하여 적절한 경화 조건이 적용된다면 안테나의 재질이 인식거리 변화에 가장 주요한 영향을 미치는 인자임을 알 수 있었다. 아울러 Cu 안테나 패턴은 RFID die의 접합 과정에서 곡률을 가지며 휘어지면서 인식거리와 관련된 long-tem reliability를 악화시킬 수 있음을 관찰할 수 있었다.

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Electrochemical Assay of Neurotransmitter Glycine in Brain Cells

  • Ly, Suw-Young;Kim, Dong-Young
    • Bulletin of the Korean Chemical Society
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    • v.28 no.4
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    • pp.515-519
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    • 2007
  • Neurotransmitter glycine in the nano gram range was analyzed using a paste electrode (PE) in cyclic voltammetry (CV) and square-wave stripping voltammetry (SWSV). An anodic peak caused by oxidation of the glycine ion appeared at the 0.4 V (versus Ag/AgCl/KCl) potential in a 0.1 M NH4H2PO4 electrolyte solution. At optimized conditions, the working range of the SWSV and CV concentration was found to be 5-60 ngL-1 glycine; precision of R2 = 0.9816 (SWSV) and 0.9986 (CV); and detection limit of 0.65 ngL-1 (5.82 × 10-12 molL-1) (S/N = 3). The optimized conditions were applied to an assay in a fish brain tissue and a living brain cell in real time.

Antibiotics Assay of Doxycycline in Food System using Stripping Voltammetry

  • Ly, Suw Young;Lee, Chang Hyun
    • Journal of the Korean Applied Science and Technology
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    • v.33 no.4
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    • pp.726-733
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    • 2016
  • A voltammetric analysis of doxycycline was developed using DNA immobilized onto a carbon nanotube paste electrode (PE). An anodic peak current was indicated at 0.2 V (versus Ag/AgCl) in a 0.1M $NH_4H_2PO_4$ electrolyte solution. The linear working range of the cyclic and square wave stripping voltammetry was obtained to $1-27ngL^{-1}$ with an accumulation time of 800 s. Final analytical parameters were optimized to be as follows: amplitude, 0.35 V; frequency, 500 Hz; and pH, 5.43. Here detection limit was found to be $0.45ngL^{-1}$, this result can be applied in foods systems and in the biological diagnostics