• Title/Summary/Keyword: Ag-coated Cu

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Preparation and Antibacterial Properties of the Planar-Type ZnO Powder Coated with Ag or CuO (Ag 또는 CuO를 코팅한 평판형 ZnO 분말의 합성 및 항균성 평가)

  • Hong, Da-Hee;Gwack, Ji-Yoo;Jeon, Deock-Seong;Jo, Dong-Hyeon;Lee, Gun-Sub;Lee, Jung-Hwan;Lee, Hee-Chul
    • Journal of the Korean institute of surface engineering
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    • v.54 no.3
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    • pp.144-151
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    • 2021
  • In the present work, planar-type ZnO powder of [0001] plane with a high aspect ratio range of 20:1 to 50:1 was synthesized. Ag or CuO could be coated on the planar-type ZnO powder by wet methods such as centrifugation or ball milling. During the coating, the average size of the powder was slightly increased while maintaining the shape and XRD pattern of ZnO. When Ag or CuO was coated, the absolute value of the zeta potential, as well as the concentration of oxygen vacancy, was increased. Ag or CuO coated planar-type ZnO power exhibited excellent antibacterial performance, which seems to be related to their high electrostatic attraction force. They could be made into a masterbatch by mixing with ABS resin, and their applicability to antibacterial substances was confirmed by manufacturing the caps of a keyboard.

Fabrication of a Ultrathin Ag Film on a Thin Cu Film by Low-Temperature Immersion Plating in an Grycol-Based Solution (글리콜 용매 기반 저온 치환 은도금법으로 형성시킨 동박막 상 극박 두께 Ag 도금층)

  • Kim, Ji Hwan;Cho, Young Hak;Lee, Jong-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.2
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    • pp.79-84
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    • 2014
  • To investigate the plating properties of a diethylene glycol-based Ag immersion plating solution containing citric acid, silver immersion plating was performed in a range from room temperature to $50^{\circ}C$ using sputtered Cu specimens. The used Cu specimens possessed surface structure with large numbers of pinholes which were created with over-acid etching. The Ag immersion plating performed at $40^{\circ}C$ exhibited that the pinholes and copper surface were completely filled with Ag just after 5 min mainly due to galvanic displacement reaction, indicating the best plating properties. Subsequently, the surface morphology of Ag-coated Cu became rougher as the plating time increased to 30 min because of the deposition of silver nanoparticles created by chemical reduction in the solution. The specimen that its overall surface was covered with silver indicated the start of oxidation at temperature higher than around $50^{\circ}C$ in air as compared with pure Cu, indicating enhanced anti-oxidation properties.

SYNTHESIS OF SILICA-COATED Au WITH Ag, Co, Cu, AND Ir BIMETALLIC RADIOISOTOPE NANOPARTICLE RADIOTRACERS

  • Jung, Jin-Hyuck;Jung, Sung-Hee;Kim, Sang-Ho;Choi, Seong-Ho
    • Nuclear Engineering and Technology
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    • v.44 no.8
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    • pp.971-976
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    • 2012
  • Silica-coated Au with Ag, Co, Cu, and Ir bimetallic radioisotope nanoparticles were synthesized by neutron irradiation, after coating $SiO_2$ onto the bimetallic particles by the sol-gel St$\ddot{o}$ber process. Bimetallic nanoparticles were synthesized by irradiating aqueous bimetallic ions at room temperature. Their shell and core diameters were recorded by TEM to be 100 - 112 nm and 20 - 50 nm, respectively. The bimetallic radioisotope nanoparticles' gamma spectra showed that they each contained two gamma-emitting nuclides. The nanoparticles could be used as radiotracers in petrochemical and refinery processes that involve temperatures that would decompose conventional organic radioactive labels.

Surface Modification of Ag Coated Cu Conductive Metal Powder for Conductive Silicone Sealant Gasket Paste

  • Park, Seong-Yong;Yoon, Tae-Won;Lee, Chung-Ho;Jeong, In-Bum;Hyun, Sang-Hoon
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.1076-1077
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    • 2006
  • Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.

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Preparation of Ag/Ni-coated Cu Flakes for High-temperature Conductive Paste and Ag Dewetting Behavior (고온용 전도성 페이스트를 위한 Ag/Ni 코팅 Cu 플레이크의 제조 및 Ag dewetting 거동 분석)

  • Kim, Ji-Hwan;Lee, Jong-Hyeon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.11a
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    • pp.151-153
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    • 2015
  • 무전해도금법을 이용하여 Ag/Ni 코팅 Cu 플레이크를 제조한 후 Ni 코팅층의 P 함량에 따른 Ag dewtting 거동에 대한 연구를 수행하였다. Ni 코팅층 내 P 함량이 낮을수록 Ni 코팅층의 결정성 및 결정화 속도가 높아지는 것을 알 수 있었으며, 이는 Ni 코팅층 위에 형성된 Ag 코팅층의 dewetting 거동에 영향을 주는 것으로 분석되었다. 또한 격자 불일치도가 높을수록 잘 발생하는 dewetting 현상은 P 함량이 높아 결정성이 떨어지는 Ni 코팅층에서 더욱 빨리 일어남을 알 수 있었다.

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Preparation of YBCO films on Ag substrates by MOCVD process (MOCVD공정에 의한 Ag 기판 위에 YBCO 박막의 증착)

  • 김호진;주진호;전병혁;김찬중
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2003.10a
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    • pp.79-82
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    • 2003
  • We prepared YBCO coated conductor by direct deposition of YBCO on Ag substrate by a MOCVD method. The Ag substrate was only prepared by cold rolling. The XRD data of the as-rolled Ag tape showed the formation of dominant (420) oriented grains. Processing variables were the oxygen partial pressure (Po$_2$) and deposition temperature (T$_{d}$). It was found that the a-axis oriented films were grown at lower T$_{d}$ below 80$0^{\circ}C$, while the c-axis oriented films were grown about 80$0^{\circ}C$. The surface of the films consisted of a second inclusion phase dispersed in the YBCO matrix. The Cu-rich phase regions were observed at the YBCO/Ag interface probably due to the inter-diffusion of Ag and Cu. Cu.

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The Fluxless Wetting Properties of TSM-coated Glass Substrate to the Pb-free Solders (TSM(Top Surface Metallurgy)이 증착된 유리기판의 Pb-free 솔더에 대한 무플럭스 젖음 특성)

  • 홍순민;박재용;박창배;정재필;강춘식
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.2
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    • pp.47-53
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    • 2000
  • The fluxless wetting properties of TSM-coated glass substrate were evaluated by the wetting balance method. We could estimate the wettability of the TSM with new parameters obtained from the wetting balance test for one side-coated specimen. It was more effective in wetting to use Cu as a wetting layer and Au as a protection layer than to use Au itself as a wetting layer. The SnSb solder showed better wettability than SnAg, SnBi, and SnIn solders. The contact angle of the one side-coated glass substrate to the Pb-free solders could be calculated from the farce balance equation by measuring the static force and the tilt angle.

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Effect of thermo-mechanical treatment and annealing atmosphere on fabrication of Ag tapes for YBCO coated conductor (차세대 선재 기판용 Ag 테이프의 제조공정에서 가공 열처리 및 열처리 분위기 변화가 집합조직에 미치는 영향)

  • Lee, N.J.;Oh, S.S.;Park, C.;Song, K.J.;Ha, D.W.;Kwon, Y.K.;Ryu, K.S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.519-522
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    • 2002
  • Ag (silver) can be used for YBa$_2$Cu$_3$O$\_$7-$\delta$/(YBCO) coated conductor tape as the substrate on which YBCO can be deposited directly because of the chemical compatibility of Ag with YBCO. We have fabricated rolled Ag tapes with various total reduction ratios and different thicknesses. As-rolled Ag tape was recrystallized at 750$^{\circ}C$ for 30min in air and vacuum of 10$\^$-3/ torr. The orientation distribution functions (ODF) calculated from three x-ray pole figures of as-rolled and recrystallized tapes were analysed. As the total reduction ratio increased from 94 to 98%, the development of {110}texture of as-rolled Ag improved. Under the present experimental condition, maximum {110}ODF value of Ag tape was obtained for the sample with 94% total reduction ratio which was recrystallized at 750$^{\circ}C$ for 30min in vacuum of 10$\^$-3/ torr.

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Effect of thermo-mechanical treatment on fabrication of Ag tapes for YBCO coated conductor (차세대 선재 기판용 Ag 테이프의 제조공정에서 가공 열처리가 집합조직에 미치는 영향)

  • Lee, N.J.;Oh, S.S.;Park, C.;Song, K.J.;Ha, D.W.;Kwon, Y.K.;Ryu, K.S.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.04a
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    • pp.46-49
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    • 2002
  • The aim of this paper is to investigate the influence of various deformation ratio on texture of Ag tapes that can be used as a RE-$Ba_2Cu_3O_{7-{\delta}}$ coated conductor tapes without any buffer layer. We fabricated as-rolled Ag substrate with various deformation ratio per step. Thickness and total deformation ratio of Ag tapes were $100{\mu}m$ and >98%, respectively. And as-rolled Ag substrate was annealed at $750^{\circ}C$ for 30min. The as-rolled and recrystallization textures were measured using x-ray pole figures and orientation distribution function (ODF) analysis. With the increase of rolling ratio from 5 to 20%, deformation texture are changed from {1l0}<311> to {1l0}<112>, {032}<100>, {051}<211>. After recrystallization by annealing, main texture was observed to {013}<100> under present condition.

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A Study on Lamination Property of Superconducting Coated Conductor

  • Kim, T.H.;Oh, S.S.;Ha, D.W.;Kim, H.S.;Ko, R.K.;Song, K.J.;Ha, H.S.;Yang, J.S.;Park, Y.M.;Oh, J.K.;Jung, K.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.161-162
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    • 2005
  • 2G HTS coated conductor wire consists of textured substrate, buffer layer, superconduct layer, Ag cap layer, stabilizer. For practical application filed, coated conductor have mechanical and electrical stability and environment protection properties. This property Cu and stainless steel strip is laminated to Ag cap layer as stabilizer materials. Lamination process join stabilizer material strip and Ag cap layer with soldering method. we have laminated HTS with continuous dipping soldering process different stabilizer Cu and stainless steel strip and changed lamination process condition. The effect of lamination stabilizer and process condition has been investigated mechanical and electrical properties.

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