• 한국재료학회지
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• 제9권9호
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• pp.926-931
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• 1999

Sn-3.5g 무연합금을 Cu 및 Alloy42 리드프레임에 납땜접합 (solder joint)하고 미세조직, 젖음성, 전단강도, 시효 효과를 측정하여 비교하였다. Cu의 경우, 땜납의 Sn기지상안에 Ag(sub)3Sn과 Cu(sub)6Sn(sub)5상이, 그리고 땜납/리드프레임의 경계면에는 $1~2\mu\textrm{m}$ 두께의 Cu(sub)6Sn(sub)5 상이 형성되었다. Alloy42의 경우, 기지상내에 낮은 밀도의 $Ag_3Sn$상만이, 그리고 계면에는 $0.5~1.5\mu\textrm{m}$ 두께의 $FeSn_2$이 형성되었다. 한편, Cu에 비해 Alloy42 리드프레임에서 퍼짐면적은 크고 접촉각은 작아 더 우수한 젖음성을 나타내었으나, 전단강도는 35%, 연산율은 75%로 낮았다. $180^{\circ}C$에서 1주일간 시효처리 후, Cu 리드프레임에는 계면 $\eta-Cu_6Sn_5$ 층외에 $\xi-Cu_3Sn$층이 성장하였고, Alloy42 리드프레임에는 기지상내에 $Ag_3Sn$이 구형으로 조대하게 성장하였고, 계면에는$FeSn_2$층만이 약 $1.5\mu\textrm{m}$로 성장하였다.

• Applied Science and Convergence Technology
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• 제23권6호
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• pp.345-350
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• 2014

The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin $InO_x$ layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.551-554
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• 2004

Bi-2223 HTS tapes are used widely for application of superconducting power systems. However there are need the properties of high strength and low AC loss. Two kinds of Bi-2223 HTS tapes with different Ag sheath were used to know the effect of sheath alloying for the strength and the resistivity. The workability and reaction degree of superconducting phase at Bi-2223 HTS tapes were investigated. We designed conventional type-Ag/alloy and double sheathed mono filament type-Ag/alloy/alloy in order to increase the strength and resistivity of matrix in Bi-2223 HTS tapes. The effect of axial strain and thermal cycling on the critical current was investigated for the Bi-2223 HTS tapes. Because the workability of double sheath Bi-2223 HTS tape was lower than one sheath Bi-2223 HTS tape, it was need additional softening treatment. Bi-2223 formation reaction was decreased by Ag alloy matrix during sintering process. Two kinds of Bi-2223/Ag tapes with different Ag sheath were used to know the effect of sheath alloying for the tensile strain. Critical current is drastically decreased for Ag/alloy and Ag/alloy/alloy sheathed tapes at tensile strain above 0.24 % and 0.34 %, respectively. This result showed that mechanical strength was increased over than 40 % by introduce double sheath at mono filament stage.

• 한국재료학회지
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• 제8권11호
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• pp.1011-1019
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• 1998

Pb의 환경오염 문제를 발생하지 않는 저농도 Pb 솔도합금을 개발하기 위하여, 새로운 Sn-5%Pb-1.5%Ag-x%In계 합금 조성을 설계하고, 이 합금의 융점, 젖음성, 상분석, 경도, 인장강도, 드로스성을 평가하여, Sn-37%Pb 솔더오 대체 가능성을 타진하였다. Sn-37%Pb 솔도 합금의 Pbdldhs 용출농도는 국제규제치인 3ppm보다 훨씬 적은 0.46ppm이었고, 환경문제를 유발하지 않는 것으로 확인되었다. 이 합금계의 융점은 $183-192^{\circ}C$이고, 응고온도범위도 $5^{\circ}C$내외로 매우 좁았다. 젖음성은 In의 첨가양에 따라 큰 차이가 거의 없었으며, Sn-375Pb와 비슷하였다. 융점 및 젖음성 측면에서 Sn-37%Pb와 대체 가능한 것으로 판단되었다. 경도는 Sn-37%Pb의 약 1.5배이고, 인장강도는 Sn-37%Pb의 것보다 높고, In의 첨가량에 따라 증가하였지만, 연신율은 감소하였다. In이 1% 첨가된 합금에서는 수지 상정 경계에 Ag3Sn과 Pb가 정출되고, 3% 이상에서는 $Ag_3Sn$과 $Ag_3In$ 및 Pb가 정출되었다. 드로스 생성속도는 Sn-37%Pb 합금이 Sn-5%Pb-1.5%Ag 합금보다 빠르고, In을 첨가할수록 느리고 2%의 In을 첨가한 합금은 180분에서도 거의 드로스가 발생하지 않았다.

• Journal of Welding and Joining
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• 제18권6호
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• pp.42-47
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• 2000

The object of this study is to estimate Sn-Ag-Bi-Ga solder alloy as a substitute for Sn-37Pb alloy. For Sn-Ag-Bi-Ga alloys, Ag, Bi and Ga contents are varied. (Ag : 1~5%, Ga : 3%, Bi : 3~6%) Comparing to Sn-37Pb alloy Sn-Ag-Bi-Ga alloys have wider melting temperature range up to max. $18.7^{\circ}C$. With increasing Ag, Bi contents, the wettability of the alloys increased up to max. 6.6 mN. The vickers hardness of the alloys was max. 46.4 Hv. The ultimate tensile stress of the alloys was max. 60.3 MPa and the elongation was max. 1.2%. The joint strength between circuit board and solder was max. 55.5 N and the joint strength between connector and solder was max. 176.1 N. There were no cracks in this alloys after thermal shock test.

• 한국표면공학회지
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• 제46권6호
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• pp.235-241
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• 2013

In this study, the effects of alloying elements and thermal aging on the contact resistance of electroplated gold alloy layers were investigated by surface analysis using X-ray photoelectron spectroscopy (XPS). The contact resistance of Au-Ag alloy was lower than that of Au-Ni or Au-Co alloy after thermal aging. The XPS results show that nickel and oxygen present as nickel oxides such as NiO and $Ni_2O_3$ on the surface of gold layers after thermal aging. The increase in the contact resistance after thermal aging is attributable to the nickel oxide layer formed on the surface of the gold layers. The content of nickel diffused from the underlayer during the thermal aging was high in the order of Au-Co, Au-Ni and Au-Ag alloy because the area of grain boundary was large in the order of Au-Ag, Au-Ni and Au-Co alloy.

• 한국표면공학회지
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• 제51권5호
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• pp.277-290
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• 2018

In this study, Pd-Ni-Ag alloy hydrogen separation membranes were fabricated by Pd/Ag/Pd/Ni/Pd multi-layer sputter deposition on the modified MIM(Metal Injection Molding)-PSS(Porous Stainless Steel) support and followed heat treatment. Nickel, used as an alloying element in Pd alloy membranes, is inexpensive and stable material in a hydrogen isotope environment at high temperature up to 1123 K. Hydrogen perm-selectivity of Pd-Ni-Ag alloy membranes is affected not only by composition of membrane films but also by other factors such as surface properties of PSS support, microstructure of membrane films and inter-diffused impurities from PSS support. In order to clarify the effect of surface Ni composition on hydrogen perm-selectivity of Pd-Ni-Ag alloy membranes, the other effects were significantly minimized by the formation of dense and homogeneous Pd-Ni-Ag alloy membranes. Hydrogen permeation test showed that hydrogen permeability decreased from $7.6{\times}10^{-09}$ to $1.02{\times}10^{-09}mol/m{\cdot}s{\cdot}Pa^{0.5}$ as Ni composition increased from 0 to 16 wt% and the selectivity for $H_2/N_2$ was infinite.

• 한국주조공학회지
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• 제24권1호
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• pp.40-44
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• 2004

The influence of Pd and Ag additions on the thermal stability, the glass forming ability (GFA) and mechanical property of $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_{(5-x)}Ag_x$ (x = $0{\sim}5at%$) alloys obtained by melt spun and injection casting method have been investigated by using of X-ray diffraction, thermal analysis (DTA, DSC) and micro-Vickers hardness(Hv) testing. The thermal properties of melt-spun $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_{(5-x)}Ag_x$ (x = $0{\sim}5at%$) alloys exhibit a supercooled liquid region(${\Delta}T_x$) exceeding 91 K before crystallization. The largest ${\Delta}T_x$ reaches as large as 126 K for the $Zr_{55}Al_{10}Cu_{20}Ni_{10}Pb_5$ alloy. The reduced glass transition temperature, $T_{rg}$ increased with increasing Ag content. The largest $T_{rg}$ is obtained for the $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ alloy. The $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ bulk amorphous alloy rod with 3 mm in diameter was fabricated by injection casting. Hv increased with increasing Ag content and the largest value was obtained for the $Zr_{55}Al_{10}Cu_{10}Ni_{10}Ag_5$ bulk amorphous alloy.

• 한국수소및신에너지학회논문집
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• 제8권3호
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• pp.137-141
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• 1997

The effects of Ag addition to Zr-based hydrogen storage alloys ($Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.4}$, $Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.3}Cr_{0.1}$ and $Zr_{0.6}Ti_{0.4}V_{0.4}Ni_{1.2}Mn_{0.3}Fe_{0.1}$) on the electrode properties were examined. Ag-free and Ag-added Ze-based alloys were prepared by arc melting, crushed mechanically, and subjected to the electrochemical measurement. In $Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.4}$ alloy, 0.08 wt% Ag addition to the alloy improved the activation rate. Also Ag addition improved both activation property and discharge capacity in $Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.3}Cr_{0.1}$. For these Ag-added alloys, discharge capacities with the change of charge-discharge current density(10mA, 15mA and 30mA) are almost constant. Showing very high rate capability, discharge capacity of $Zr_{0.6}Ti_{0.4}V_{0.4}Ni_{1.2}Mn_{0.3}Fe_{0.1}$ alloy increased by Ag addition to the alloy. When the amount of Ag addition in $Zr_{0.7}Ti_{0.3}V_{0.4}Ni_{1.2}Mn_{0.4}$ alloy increased too much, the electrode properties became worse. Unveiling mechanism of effect of Ag addition is now progressing in our laboratory.

• 한국주조공학회지
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• 제21권4호
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• pp.239-245
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• 2001

Microstructure and mechanical properties of Sn-3.1 wt.%Ag-6.9 wt.%Bi system solders on Cu-substrate were studied. The Sn3.1 wt.%Ag-6.9 wt.%Bi alloy was designed by phase diagram and chemical properties and was prepared by melting in argon atmosphere. The mechanical properties of solder/Cu joints were examined by shear strength test, and also creep test. The microstructure of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy consists of Bi-rich phase and $Ag_3Sn$ precipitate in {\beta}-Sn$ matrix phase. The shear strength of the joint was decreased with aging treatment. Crack path under shear test was through the solder. Similar crack path change mode was observed at the creep test of solder/Cu joint. The creep behavior of Sn-3.1 wt.%Ag-6.9 wt.%Bi alloy represented the inverse primary creep behavior at all test condition. It is suggested that the inverse primary creep behavior is induced from Bi solute atoms in Sn-matrix. The creep resistance of Sn-3.1Ag-6.9Bi alloy is better than that of Sn-3.5 wt.%Ag alloy at all test conditions.