• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.31-38
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• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Journal of the Korean Institute of Telematics and Electronics
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• v.18 no.3
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• pp.42-51
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• 1981

Boron was predeposited into p (100) Si wafer at 94$0^{\circ}C$ for 60minutes to make the back surface field. High tempreature diffusion process at 1145$^{\circ}C$ for 3 hours was immediately followed without removing boron glass to obtain high surface concentration Back boron was annealed at 110$0^{\circ}C$ for 40minutes after boron glass was removed. N+ layer was formed by predepositing with POCI3 source at 90$0^{\circ}C$ for 7~15 minutes and annealed at 80$0^{\circ}C$ for 60min1es under dry Of ambient. The triple metal layers were made by evaporating Ti, Pd, Ag in that order onto front and back of diffused wafer to form the front grid and back electrode respectively. Silver was electroplated on front and back to increase the metal thickness form 1~2$\mu$m to 3~4$\mu$m and the metal electrodes are alloyed in N2 /H2 ambient at 55$0^{\circ}C$ and followed by silicon nitride antireflection film deposition process. Under artificial illumination of 100mW/$\textrm{cm}^2$ fabricated N+PP+ cells showed typically the open circuit voltage of 0.59V and short circuit current of 103 mA with fill factor of 0.80 from the whole cell area of 3.36$\textrm{cm}^2$. These numbers can be used to get the actual total area(active area) conversion efficiency of 14.4%(16.2%) which has been improved from the provious N+P cell with 11% total area efficiency by adding P+ back.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2009.11a
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• pp.19-20
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• 2009

최근 화학, 물리, 생명과학, 전기, 전자등의 다양한 분야에 활발하게 연구가 이루어지고 있는 초분자 화학은 선택적 분자인지를 위한 효율적인 골격구조와 나아가 다양한 계에 응용할 수 있다. 초분자 화학의 분자인지 과정의 특징은 일반적으로 수용체 (receptor 혹은 host)가 목표가 되는 기질 (substrate, analyte, 혹은 guest)에 대하여 선택적으로 식별하고 반응하는 것이다. 비공유 결합성 상호작용에 의하여 이루어지는 초분자 화학의 분자 인지 과정의 특징은 일반적으로 수용체 (receptor 혹은 host)가 목표가 되는 기질 (substrate, analyte, 혹은 guest)에 대하여 선택적으로 식별하고 반응하는 것이다. 이는 공유결합을 이용하는 분자화학과는 차별화 된 것이다. 수용체는 간단한 구조의 화합물 및 금속 이온들과 같은 기질과 가역적으로 상호 작용할 수 있는 착물을 형성한다. 최근들어 급격한 산업화가 진행되어 환경문제가 심각하게 대두 되어져 왔고, 그 중에서 특히 수은이나 카드뮴에 의한 질병, 납에 의한 중독 등 중금속에 의한 오염이 크게 나타남에도 불구하고, 현재 그러한 중금속을 검출함에 있어 많은 비용과 시간이 드는 문제점이 있다. 또한 우리에게 이로운 금속은 효율적 분석을 통해 환경계와 의료계에 많은 도움을 줄 것으로 사례되므로 화학센서 기술의 개발은 절실히 요구되어지고 있다. 이에 새로운 1,3-bisdicyanovinylindane 을 통해 $Hg^{2+}$ 금속의 감지 여부 알아보고, 그 특성을 파악하고자 한다. 1,3-indandion (2.18g, 14.9mmol), malononitrile (2.95g, 44.7mmol), ethanol 50ml를 20분간 상온에서 용해시킨다. 후에 sodium trihydrate acetate(3.05g)을 첨가한 후 5시간 동안 환류반응 시킨다. 이 과정에서 얻어진 용액을 필터과정을 통하여 에서 합성 반응 중에 생성된 불순물(1,3-dicyanovinylindane-1-one, monocondensation)을 제거한다. 필터과정을 통해 걸러진 미 반응 물질을 제�G 용반응욕액을 증류수(100ml)를 이용하여 희석시키고 난 후 염산을 이용, 산성화 시켜 고체 생성물을 얻어낸다. 이렇게 생성된 고체 생성물은 다시 필터 및 건조를 통하여 회색의 고체 화합물을 얻어낸다. 1,3-bisdicyanovinylindane과 금속이온에 대한 감응도를 확인하기 위하여 metanol/water(1:2)을 용매로 하여 금속이온의 농도를 변화시켜 발색특성을 살펴보았다. 본 색소화합물과 Hg2+에 대한 UV 흡광도 변화 적정결과와 그 화합물의 상태 살펴본 결과 금속이온이 0.2ml씩 더 참가되면서 색의 변화를 뚜렷하게 나타내었다. 반면 그 밖에 이온($Fe^{3+}$, $Ag^{2+}$, $Pd^{2+}$, $Zn^2$, $Fe^{2+}$, $Cu^{2+}$, $Pb^{2+}$)은 UV 흡광도 변화가 적거나 변화 자체가 없었다. 하지만 과량의 $Fe^{3+}$, $Ag^{2+}$, $Pd^{2+}$는 색상 변화를 나타내었으며,이와 같은 흡광도 변화는 금속에 따라 약간의 차이가 있지만, 420nm를 등흡수점으로 하여, 580nm의 파장 영역에 있는 흡수 밴드의 세기는 감소하는 반면 400nm 파장 영역에 있는 흡수 밴드의 세기가 증가하였다. 1,3-bisdicyanovinylindane 화합물은 다양한 생물계 및 환경계에서 요구되는 micro mol에서 milli mol 농도 영역의 $Hg^{2+}$ 이온의 선택적이고 민감한 검출과 정량적인 분석에 유용하게 사용될 수 있을 것이다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.306-306
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• 2007

최근, LED 구동 인버터, DC-DC 컨버터, AC-DC 컨버터 및 형광등 ballaster 등의 고전압전원장치등에 압전변압기를 적용하고자 하는 연구가 활발히 진행되고 있다. 순수한 $PbTiO_3$는 큐리온도($490^{\circ}C$)가 높고, 기계적강도가 크며, 비유전율(약 200 정도)이 작다. 또한, 두께방향 진동의 전기기계 결합계수 ($K_t$)가 윤곽진동의 전기기계 결합계수($K_p$)보다 크므로 두께방향의 진동모드를 이용한 벌크파 진동자의 경우 윤곽진동방향으로 불요신호(spurious signal)가 적고, 작은 grain size($1\;{\mu}m$정도)로 미세가공이 가능하여 고주파 재료로 이용되고 있다. 압전변압기의 출력 전력을 향상시키기 위해서는 적층으로 제작하여야 하는데 적층 압전변압기 제작시 층간의 내부 전극이 도포된 상태에서 소결하여야 한다. 이때 소걸 온도가 높으면 Pd 함랑이 높은 전극을 사용하여야 하는데 Pd 전극의 가격이 비싸 소자의 경제성이 떨어지게 된다. 따라서 순수한 Ag 전극을 내부전극으로 사용하기 위해서는 $900^{\circ}C$ 이하에서 소결이 가능하여야 한다. 따라서 본 연구에서는 $(Pb,Ca,Sr)Ti(Mn,Sb)O_3$ 조성을 이용하여 $900^{\circ}C$ 이하의 저온소결이 가능한 두께방향진동모드 적층 압전변암기를 제작하여 그에 대한 전기적 특성을 조사하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.369-370
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• 2005

LTCC (Low Temperature Cofired Ceramic) technology is one of technologies which can realize SIP (System-In-a-Package). In this paper realization of gas sensor using LTCC technology was described. In the conventional gas sensor structure, wire bonding method is generally used as an interconnection method whereas in the LTCC sensor structure, via was used for the interconnection. As sensing materials, $SnO_2$ was adopted. The effect of frit glass portion on the adhesion of the sensing material to the LTCC substrate and the electrical conductivity of the sensing material were analyzed. AgPd, PdO, Pt was added to the sensing material as an additive for improving the gas sensitivity and electrical conductivity and the effect of the amount of additives in the sensing material on the electrical conductivity was investigated. The effect of the amount of frit glass in the termination on the sensor performance, especially mechanical integrity, was considered and the crack initiation and propagation in the boundary between the sensing material and the termination was studied.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.328-328
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• 2010

압전 세라믹스는 엑츄에이터 및 센서 등의 다양한 응용분야로 인하여 많은 연구가 진행되어왔다. 최근 친환경 무연 압전계인 Bi층상구조 (BNT) 및 알칼리 니오븀산화물계 (KNN)에 대한 연구가 집중되고 있다. 한편, 소형화 및 고성능의 압전소자에 대한 요구 증가로 고가의 내부전극인 Ag, Ag-Pd합금으로 이루어진 적층압전소자에 대한 연구개발이 진행되어 왔다. 본 연구에서는 Ni이나 Cu를 내부전극으로 사용하는 적층압전소자의 개발가능성을 타진하고자 Ni의 산화를 억제할 수 있는 환원분위기 소결시에 압전소재의 상변화 및 내환원성 정도를 조사하였다. 압전소재인 BNT 및 KNN를 공기중에서 합성한 후, 환원분위기의 영향을 조사하고자 샘플을 디스크 형태로 성형하여 $1000{\sim}1200^{\circ}C$에서 2 시간 동안 공기, 중성 (N2) 와 환원 분위기 (3 % H2 - 97 %의 N2) 에서 소결한 후 미세구조와 전기적 특성을 SEM, EDS, XRD, impedance analyzer로 조사였다. 환원분위기에서 소결된 BNT 샘플은 페롭스카이트 상이 관찰되지 않았으며, SEM/EDS 분석결과 시편의 표면에 Bi의 석출이 관찰되었다. KNN의 경우에는 공기중에서 소결 시편뿐만 아니라 환원분위기에서 소결된 시편에서도 페롭스카이트 구조를 보였으며, EDS분석결과 K 및 Na의 휘발이 비교적 적었다.

• The Journal of Korean Academy of Prosthodontics
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• v.23 no.1
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• pp.39-59
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• 1985

The purpose of this study was to investigate how gap distances of 0.13mm, 0.15mm, 0.20mm, and 0.30mm affects solder joint strength from gold alloys and nickel-chromium base alloys and to examine the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys. The tensile test specimens were prepared in the split stainless steel mold with a half dumbbell shape 2.5mm in diameter and l2mm in length. 6 pairs of specimens of each gap distance group of gold alloys and nickel-chromium base alloys were made and 48 pairs of all specimens were soldered with solder gold of 666 fineness. All soldered specimens were machined to a uniform diameter and then a tensile load was applied at a cross-head speed of 0.10mm/min using Instron Universal Testing Machine, Model 1115. The fractured specimens at solder gold of solder joint fracture with each gap distance of 0.13mm, 0.15mm, 0.20mm, and 0.30mm were examined under the Scanning Electron Microscope, JSM-35c and the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys was analyzed by Electron Probe Micro Analyzer. The results of this study were obtained as follows: 1. In case of soldering of gold alloys, the tensile strength between gold alloys showed $37.33{\pm}2.52kg/mm^2$ at 0.13, $39.14{\pm}3.35kg/mm^2$ at 0.15mm, $43.76{\pm}2.97kg/mm^2$ at 0.20mm, and $49.18{\pm}4.60kg/mm^2$ at 0.30mm. There was statistically significant difference at each gap distance, and so the greater increase of gap distance showed the greater tensile strength. 2. In case of soldering of nickel-chromium base alloys, the tensile strength between nickel-chromium base alloys showed $34.84{\pm}4.26kg/mm^2$ at 0.13mm, $37.25{\pm}2.49kg/mm^2$ at 0.15mm, $42.91{\pm}4.32kg/mm^2$ at 0.20mm, and $46.93{\pm}4.21kg/mm^2$ at 0.30mm. There was not statistically significant difference only between 0.13mm and 0.15mm and bet ween 0.20 mm and 0.30mm, but generally the greater increase of gap distance showed the greater tensile strength. 3. The greater increase of gap distance shoed less porosities in solder gold at solder joint fracture. 4. In solder gold Au, Cu, Ag, Zn, and Sn were composed and Au and Cu were mostly distributed uniformly. 5. In solder joints of solder gold and gold alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Au, Cu, Ag, Pt, and Pd were composed in gold alloys. Au and Cu of solder gold and gold alloys were mostly distributed uniformly and the diffusion of other elements except Pt and Pd around the solder joint was not almost found. In solder joints of solder gold and nickel-chromium base alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Ni, Cr, and Al were composed in nickel-chromium base alloys. Au and Cu of solder gold and Ni and Cr of nickel-chromium base alloys were mostly distributed uniformly and the diffusion of other elements except Cr around the solder joint was not almost found.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1541-1543
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• 1999

Screen printing에 의해 압전 후막을 제조하기 위하여 약 $0.6{\mu}m$의 평균 입자 크기를 갖는 PMN-PZT와 PAN-PZT 분말을 산화물 혼합법에 의해 제조하였다. 치밀한 후막의 제조를 위한 분말과 유기물의 비율은 분산이 가능한 범위에서 80:20 (분말:유기물)의 중량비를 나타내었다 사용된 기판과 하부전극은 각각 $SiO_2$/Si와 AgPd 였으며, 후막 제조시 박리 및 균열현상은 발생되지 않았다. 프린트된 후막은 건조온도와 무관한 미세구조를 나타내었으며, 보다 치밀한 구조를 갖는 후막의 제조를 이해 입자의 분산 및 열처리 조건 그리고 기판과의 매칭에 대해 연구가 계속되어야 할 것으로 생각된다.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.374.2-374.2
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• 2016

Volatile organic compounds (VOCs) in the atmosphere are harmful materials which influence indoor air environment and human health. Titanium dioxide ($TiO_2$) is photocatalyst extensively used in degradation of organic compound. To improve the photocatalytic activity in the visible light region, doping with non-metals element or loading noble metals on the surface of $TiO_2$ is generally proposed. In this study, N- doped $TiO_2$ having photocatalytic activity in visible light region was attached noble metal such as Pt, Ag, Pd, Au by coupling method. Catalytic activities of Noble metal coupled $N-TiO_2$ powders were evaluated by the improvement of their photocatalytic activities and the degradation of VOC gas. A UV-Vis spectrophotometer was used to measure the diffuse reflectance spectra of coupled $N-TiO_2$ sample. The photocatlytic activities of as prepared samples were characterized by the decoloration of aqueous MB solution under Xenon light source (UV and visible light). To measure of decomposition VOCs, ethylbenzene was selected for target VOC material and the concentration was monitored under UVLED irradiation in a closed chamber system. Adjusting the initial concentration of 10~12 ppm, to evaluate the removal characteristics by using the coupled $N-TiO_2$.

• Advances in materials Research
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• v.3 no.4
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• pp.199-216
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• 2014

Noble metal nanoparticles (mainly Au, Ag, Pt and Pd) have received enormous attention owing to their unique and fascinating properties. In the past decades, many researchers have reported methods to control the shape and the size of these noble metal nanoparticles. They have consequently demonstrated outstanding and tunable properties and thus enabled a variety of applications such as surface plasmonics, photonics, diagnostics, sensing, energy storage and catalysis. This paper focuses on the recent advances in the solution-phase synthesis of shape- and size-controlled noble metal nanoparticles. The strategies and protocols for the synthesis of the noble metal nanoparticles are introduced with discussion of growth mechanisms and important parameters, to present the general criteria needed for producing desirable shapes and sizes. This paper reviews their remarkable properties as well as their shape- and size- dependence providing insights on the manipulation of shape and size of metal nanoparticles, necessary for appropriate applications. Finally, several applications using the shape- and size-controlled noble metal nanoparticles are highlighted.