• 한국재료학회지
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• 제9권10호
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• pp.1018-1024
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• 1999

Sn-3.5Ag 무연합금을 Cu 및 Alloy42 리드프레임에 납땜접합 (solder joint)하고 미세조직, 젖음성, 전단강도, 시효효과를 측정하여 비교하였다. Cu의 경우, 땜납의 Sn기지상안에 Ag(sub)3Sn과 Cu(sub)6Sn(sub)5상이, 그리고 땜납/리드프레임의 경계면에서는 1∼2㎛ 두께의 Cu(sub)6Sn(sub)5상이 형성되었다. Alloy42의 경우, 기지상내에 있는 낮은 밀도의 Ag(sub)3Sn상만이, 그리고 계면에는 0.5∼1.5㎛ 두께의 FeSn(sub)2이 형성되었다. 한편, Cu에 비해 Alloy42 리드프레임에서 퍼짐면적은 크고 접촉각은 작아 더 우수한 젖음성을 나타내었으나, 전단강도는 35%, 연신율은 75%로 낮았다. 180℃에서 1주일간 시효처리 후, Cu 리드프레임에는 계면에 η-Cu(sub)6Sn(sub)5 층외에 ξ-Cu(sub)3Sn층이 성장하였고, Alloy42 리드프레임에는 기지상내에 Ag(sub)3Sn이 구형으로 조대하게 성장하였고, 계면에는 FeSn(sub)2층만이 약 1.5㎛로 성장하였다.

• 대한금속재료학회지
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• 제46권1호
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• pp.26-32
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• 2008

Examination of two bronze vessels supposedly from the Koryo dynasty revealed that they consist of bowls and stands that are fixed together using rivet joints made of Cu-Ag alloys. The bowls and stands were forged out of unleaded bronze alloys of approximately 22 weight % Sn before being quenched from the ${\alpha}+{\beta}$ region of the Cu-Sn phase diagram. This specific alloy and the thermo-mechanical treatment constitute two key elements of the unique technical tradition called Bangcha (방짜) that has long been established in Korea. The high Sn content ensures better casting and the thermal treatment causes the brittle ${\delta}$ phase to be avoided in forging as well as in services. The experiment on the laboratory Cu-Ag alloys of varying Ag contents suggested that the Cu-Ag system was the best choice of materials for the rivets at the time in view of their color, availability, ductility and low melting points.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.

• 한국태양에너지학회 논문집
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• 제34권1호
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• pp.98-104
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• 2014

Photovoltaic (PV) cell is considered as one of the finest ways to utilize the solar power. A study of improving solar cell's efficiency is important because the lifetime of solar cell is determined by photovoltaic module technology. Therefore, oxidation (and/or corrosion) of solder materials will be one of the primary yield and long-term reliability risk factor. Recently, the development of lead-free solder alloy has been done actively about lead-free solder alloys of the thermodynamic and mechanical properties. However, the oxidation behavior have rarely been investigated In this study, the oxidations of 60 wt% Sn-40 wt% Pb, 62 wt% Sn-36 wt% Pb -2 wt% Ag, 50wt% Sn-48 wt% Bi-2 wt% Ag alloys for the interconnect ribbon after exposure in atmosphere at $100^{\circ}C$ for several times were investigated. The wettability of 62 wt% Sn-36 wt% Pb-2 wt% Ag and 50 wt% Sn-48 wt% Bi-2 wt% Ag solders was also studied to compare with that of 60 wt% Sn-40 wt% Pb alloy. The results howed that the zero cross time and the wetting time of 50 wt% Sn-48 wt% Bi-2 wt% Ag solder were better than other two samples. The surface of tested samples was analyzed by XPS. The XPS result showed that in all samples, SnO grew first and then the mixture of SnO and $SnO_2$ was detected. $SnO_2$ grew predominantly for the long time aging. Moreover XPS depth profile analysis has found surface enrichment of tin oxide.

• 한국재료학회지
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• 제19권2호
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• pp.79-84
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• 2009

A series of experiments demonstrated that an addition of Ag into $(Cu_{0.5}Zr_{0.5})_{100-x}Ag_{x}$ amorphous alloys alters the plasticity of the alloys in a systematic manner. Energy dispersive x-ray spectroscopy (EDS) conducted on the $(Cu_{0.5}Zr_{0.5})_{100-x}Ag_{x}$ alloys exhibited the presence of compositional modulation, indicating that compositional separation had occurred. The presence of compositional modulation was also validated using a combined technique of molecular dynamics and Monte Carlo simulation. In this study, the effect of Ag on the compositional separation in $(Cu_{0.5}Zr_{0.5})_{100-x}Ag_{x}$ bulk amorphous alloys was investigated to understand the role played by the phase-separating element on the plasticity of the amorphous alloys.

• 한국초전도ㆍ저온공학회논문지
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• 제3권1호
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• pp.6-10
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• 2001

Stress/stram dependencies of the critical current $I_c$ in AgMgNi sheathed multifilamentary Bi(2212) superconducting tapes were evaluated at 77K, 0T. The external reinforcement was accomplished by soldering Ag-Mg tapes to sin91e side or both sides of the sample. With the external reinforcement. the strength of tapes increased but $I_c$, decreased The $I_c$, degradation characteristic according to the external reinforcement was improved markedly in terms of the stress although it appeared less rectal.table on the basis of the strain. Effects of external reinforcement were discussed in a viewpoint of monitoring sensitivity of cracking in superconducting filaments by considering n-value representing the transport behavior of the current. It is closely associated with the location of them relative to the voltage-monitoring region in the tape.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2001년도 학술대회 논문집
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• pp.17-20
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• 2001

Stress/strain dependencies of the critical current I$_{c}$ in AgMgNi sheathed multifilamentary Bi(2212) superconducting tapes were evaluated at 77K. The external reinforcement was accomplished by soldering Ag-Mg tapes to single side or both sides of the sample. With the external reinforcement, the strength of tapes increased but I$_{c}$ decreased. The I$_{c}$ degradation characteristic according to the external reinforcement was improved markedly in terms of the stress although it appeared less remarkable on the basis of the strain. Effects of external reinforcement were discussed in a viewpoint of monitoring sensitivity of cracking in superconducting filaments by considering n-value representing the transport behavior of the current, which is closely associated with the location of them relative to the voltage-monitoring region in the tape. tape.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• 한국에너지공학회:학술대회논문집
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• 한국에너지공학회 1992년도 학술발표회 초록집
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• pp.39-40
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• 1992

This paper dealt with the manufacturing of binary alloy catalyst and showed simple electrochemical method for determing catalytic activity of oxygen reduction in acid or alkaline electrolyte. The catalyst was prepared by impregnating transition metal salts on platinum or silver particles adsorbed before on carbon paper substrate. The electrochemical characteristics of the catalysts was investigated with carbon paper electrode or PTFE-boned porous electrode and then cathodic current densities and tafel slopes were compared. As a result, of all binary catalysts utilized in this work, Pt-Fe, Pt-Mo showed better oxygen reduction activity than pure platinum catalyst in acid electrolyte and Ag-Fe, Ag-Pt, and Ag-Ni-Bi-Ti catalyst did than pure silver catalyst in alkaline electrolyte. The current density of Pt-Fe electrode in acid electrolyte was one and half times higher than that of Pt electrode(~500mA/$\textrm{cm}^2$ at 0.7VvsNHE).

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 학술대회 논문집
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• pp.101-104
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• 2003

Influences of transverse compressive stress on the critical current ( $I_{c}$) in AgMg and AgMn alloy sheathed Bi-2223 tapes were investigated at 77 K and 0 T. The $I_{c}$ degradation behavior depending on sample specifications was discussed in viewpoints of n-value and damage morphology. As a result, Bi-2223 tapes showed a significant drop in $I_{c}$ for stresses greater than 50MPa. The AgMg sheathed Bi-2223 tapes representing higher $I_{c}$ showed a lower $\sigma$$_{irr}$ and a significant $I_{c}$ degradation with increase in compressive stress. There existed a voltage tap separation dependency of the $I_{c}$ degradation behavior caused by the transverse compressive stress.sive stress.s.