• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1248-1251
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• 2005

In PDP, a transparent dielectric is formed on a front glass substrate so as to cover bus electrodes (Ag). During the fabrication process, sometimes, a transparent dielectric reacts with bus (Ag) electrode in the range of $560-600^{\circ}C$, and the reaction gives the dielectric its yellow coloration, what is called "yellowing phenomena". In this paper, we investigated the reaction between bus electrode and transparent dielectric covered with different frit content in Ag paste.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.72-73
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• 2003

• 한국진공학회지
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• 제7권s1호
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• pp.50-56
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• 1998

Ion beam assisted deposition (IBAD) was successfully used to produce a dense and ultra-adherent Hydroxyapatite (HA) film on titanium alloy and alumina. Recently it is also proved that the HA coatings on alumina substrate treated with 20 ppm $AgNO_3$ had the structure of $(Ag, Ca)_10(PO_4)6(OH)_2$, which exhibited excellent antimicrobial effects. The present paper aims to morphlogically characterize the adhesion of macrophages on newly developed Ag-HA coated alumina and Ti6A14V substrates and to evaluate the biocompatibility of the coatings in vitro. It can be found that the cell number on alumina of the concentration of $AgNO_3$ in the treatment, the cell number on Ag-HA coatings decreased. Up to 20 ppm $AgNO_3$ by Ag-treatment, the morphological development of the cells on Ag-HA coating was similar to that of the cells on HA coating, suggesting the biotolerance of the Ag-HA coatings.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

• Journal of Microbiology and Biotechnology
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• 제26권11호
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• pp.1933-1942
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• 2016

A novel ${\alpha}-glucoside$ hydrolase (named PspAG97A) from glycoside hydrolase family 97 (GH97) was cloned from the deep-sea bacterium Pseudoalteromonas sp. K8, which was screened from the sediment of Kongsfjorden. Sequence analysis showed that PspAG97A belonged to GH97, and shared 41% sequence identity with the characterized ${\alpha}-glucoside$ BtGH97a. PspAG97A possessed three key catalytically related glutamate residues. Mutation of the glutamate residues indicated that PspAG97A belonged to the inverting subfamily of GH97. PspAG97A showed significant reversibility against changes in salt concentration. It exhibited halophilic ability and improved thermostability in NaCl solution, with maximal activity at 1.0 M NaCl/KCl, and retained more than 80% activity at NaCl concentrations ranging from 0.8 to 2.0 M for over 50 h. Furthermore, PspAG97A hydrolyzed not only ${\alpha}-1,4-glucosidic$ linkage, but also ${\alpha}-1,6-$ and ${\alpha}-1,2-glucosidic$ linkages. Interestingly, PspAG97A possessed high catalytic efficiency for long-chain substrates with ${\alpha}-1,6-linkage$. These characteristics are clearly different from other known ${\alpha}-glucoside$ hydrolases in GH97, implying that PspAG97A is a unique ${\alpha}-glucoside$ hydrolase of GH97.

• 마이크로전자및패키징학회지
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• 제24권2호
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• pp.69-74
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• 2017

인쇄전자소자 금속 배선의 고온 신뢰성 평가를 위해 스크린 프린팅 기법으로 도포된 Ag 박막과 폴리이미드 기판 사이의 계면접착력을 $200^{\circ}C$ 후속 열처리 시간에 따라 $180^{\circ}$ 필 테스트를 통해 평가하였고, 박리 계면 미세구조를 분석하였다. 후속 열처리 전 필 강도는 약 16.7 gf/mm 이었고, 열처리 24 시간 후 필 강도는 29.4 gf/mm까지 증가하였는데, 이는 초기 열처리에 의해 접합계면에서 Ag-O-C 화학 결합의 증가와 바인더의 organic bridges 효과가 주 원인인 것으로 판단된다. 한편, 열처리 시간이 48, 100, 250, 500 시간으로 더욱 증가함에 따라 필 강도는 각각 22.3, 3.6, 0.6, 0.1 gf/mm으로 급격히 감소하는 거동을 보였다. 이는 $200^{\circ}C$의 고온에서 장시간 노출되었을 때 Cu/Ag 계면 산화막 형성이 주 원인인 것으로 판단된다.

• 한국재료학회지
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• 제17권8호
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.78-79
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• 2009

We have investigated low temperature sintering characteristics of organic Ag complex. Organic Ag complex was coated on the glass substrate by spin coating method. The coated Ag complex was sintered in an air atmosphere. The sintering temperature was varied from 30 to $80^{\circ}C$ and sintering time was varied from 1 to 228 hour. The sheet resistance was abruptly changed at $80^{\circ}C$-6h, $65^{\circ}C$-24h, $30^{\circ}C$-228 hour and the thickness of the coated film was significantly decreased. The sheet resistance of Ag films were about $0.53\;{\Omega}/{\square}$ at the $80^{\circ}C$ - 12hour.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.189-190
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• 2007

본 논문에서는 칼코게나이드 박막의 Ag 포토 도핑시 기판의 변화에 따른 Ag 이온의 도핑 특성을 예측하고자 하였다. 도핑 특성은 Ag 이온의 도핑으로 인한 굴절률 변화를 이용하여 진폭혈 회절격자 효율을 측정하여 확인하였다. 시료는 5N의 순도를 갖는 Ge, Se, Ag 물질을 준비하였고, 이중 GeSe를 조성의 비에 맞추어서 석영관에 진공 봉입후 용융 혼합하고 급냉하여 비정질 빌크를 제작한다. 만들어진 비정질 벌크와 Ag를 열 증착법을 이용하여 기판에 올리는 방법으로 샘플을 제작한다. 제작된 샘플에 레이저와 몇몇 광학 소자로 구성된 흩로-리소그라피 장치를 이용하여 격자구조로 442nm 의 빛을 조사 시킨다. 결론으로는 기판은 칼코게나이드 박막에의 Ag 도핑에 영향을 미친다는 것을 확인하였다.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.63-69
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• 2007

Cu 비아를 이용한 MEMS 센서의 스택 패키지용 interconnection 공정을 연구하였다. Ag 페이스트 막을 유리기판에 형성하고 관통 비아 홀이 형성된 Si 기판을 접착시켜 Ag 페이스트 막을 Cu 비아 형성용 전기도금 씨앗층으로 사용하였다. Ag 전기도금 씨앗층에 직류전류 모드로 $20mA/cm^2$와 $30mA/cm^2$의 전류밀도를 인가하여 Cu 비아 filling을 함으로써 직경 $200{\mu}m$, 깊이 $350{\mu}m$인 도금결함이 없는 Cu 비아를 형성하는 것이 가능하였다. Cu 비아가 형성된 Si 기판에 Ti/Cu/Ti metallization 및 배선라인 형성공정, Au 패드 도금공정, Sn 솔더범프 전기도금 및 리플로우 공정을 순차적으로 진행함으로써 Cu 비아를 이용한 MEMS 센서의 스택 패키지용 interconnection 공정을 이룰 수 있었다.