• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.101-103
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• 2002

PDP등의 각종 전자부품에 사용되는 Ag paste 의 frit은 주로 PbO를 주성분으로 하는 물질이 사용되어왔다. 그러나 이러한 Pb계 재료는 환경유해한물질로 규제대상이 되고 있다. 이에 대비하여 본 연구에서는 Bi$_2$O$_3$을 주성분으로 하여 B$_2$O$_3$, SiO$_2$, A1$_2$O$_3$가 함유된 새로운 frit을 개발하였다. TMA등을 이용하여 열적 특성을 관찰하였으며, 전극용 Ag-Paste를 제조한 후 스크린프린팅하여 인쇄성과 미세구조를 관찰하였고, 전기저항 및 소성두께를 측정하였다. 또한 전이온도, 연화점, 열팽창계수등을 조사하여 기존의 Pb함유 frit과 물성을 비교하였으며 PDP용 Ag전극에 적용하는 새로운 frit으로의 가능성을 검토하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.1
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• pp.33-38
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• 2000

In this study, multilayer piezoelectric actuators were fabricated with 75 layers by a conventional multi-layer capacitor (MLC) techniques, using 70Ag/30Pd paste as an internal electrode which can be sintered at low temperature and have cost down effect in mass productions. The multilayer piezoelectric actua-tors had no defects such as diffusions of internal electrode to ceramic bodies and shortages of internal electrodes. The multilayer piezoelectric actuators did not show the crack in the ceramics parts and the gapping phenomena in the external eletrodes when Ag paste was used as external electrodes. The multilayer piezoelectric actuators showed a maximum displacement of 4${\mu}{\textrm}{m}$ at 100V dc voltage and kept the maximum displacement constant for 300 seconds. The multilayer piezoelectric actuators showed good matching properties between ceramic bodies and AgPd internal electrodes. We confirmed the possibility of large-scaled production of the multilayer piezoelectric actuators with superior electrical properties and cost down effect using 70Ag/30Pd paste as an internal electrodes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.302-302
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• 2008

다층 세라믹 기판은 내열성, 내마모성 및 우수한 전기적 특성으로 인하여 기존의 PCB의 대체품으로 많이 이용되며 그 수요가 점점 늘어가고 있는 추세이다. 이에 고집적 다층 세라믹 기판을 보다 다기능화, 고밀도화, 고성능화하기 위해서는 세라믹 층간 정밀도가 아주 중요한 요소로 부각되고 있으며, 무수촉 기판 소성기술을 이용한 층간 정밀도를 높이는 연구가 진행되어지고 있다. 그러나 무수축 기판에서 이러한 정밀도를 유지하기 위해서는 전극의 수축률을 기판의 수축율과 같은 0%에 가깝게 제어하여야 하며 이를 위해서 여러 가지 Frit을 이용하여 수축율을 제어를 시도되고 있다. Ag 전극은 낮은 비저항 우수한 접착성 등의 장점을 가지고 있을 뿐 아니라 가격이 저렴하여 전극재료로서 많은 연구가 이루어졌다. 특히 Infiltration법에 의한 무수축소성의 경우 Glass가 Ag paste로 Infiltration되어 Ag paste와 세라믹의 matching성 확보에 많은 문제가 발생하였다. 이에 본 실험에서는 제조된 Ag conductor paste 에 첨가되는 frit이 무수축 기판과의 매칭성에 어떠한 영향이 있는지에 대하여 고찰하였다. 시편의 준비는 frit이 첨가된 Ag paste를 기판에 screen printing 한 후 $900^{\circ}C$에서 소결한 것을 사용하였으며 Ag 전극의 미세구조를 관찰하고 전기적 특성과 미세구조와의 연관성에 관해 고찰하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.160-160
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• 2016

In this study, we applied the low temperature curing Ag paste to replace PVD System. The electrode formation of low temperature curing Ag paste for silicon Hetero-junction solar cells is important for improving device characteristics such as adhesion, contact resistance, fill factor and conversion efficiency. The low temperature curing Ag paste is composed various additives such as solvent, various organic materials, polymer, and binder. it depends on the curing temperature conditions. The adhesion of the low temperature curing Ag paste was decided by scratch test. The specific contact resistance was measured using the transmission line method. All of the Ag electrodes were experimented at various curing temperatures within the temperature range of $160^{\circ}C-240^{\circ}C$, at $20^{\circ}C$ intervals. The curing time was also changed by varying the conditions of 10-50min. In the optimum curing temperature $200^{\circ}C$ and for 20 min, the measured contact resistance is $19.61m{\Omega}cm^2$. Over temperature $240^{\circ}C$, confirmed bad contact characteristic. We obtained photovoltaic parameter of the industrial size such as Fill Factor (FF), current density (Jsc), open-circuit voltage (Voc) and convert efficiency of up to 76.2%, 38.1 mA/cm2, 646 mV and 18.3%, respectively.

• Korean Journal of Materials Research
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• v.29 no.1
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.648-650
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• 2008

We used micro-contact printing for source and drain electrodes of OTFTs. The proper solvent of Ag paste and baking temperature were extracted for PVP gate dielectric and pentacene semiconductor. The mobility was 0.025 cm2/V.sec and on/off ratio was $2{\times}10^5$.

• ETRI Journal
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• v.33 no.6
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• pp.864-870
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• 2011

As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1789-1791
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• 2007

We fabricated OTFT-OLED display panel by using Ag-paste for source and drains electrode of OTFTs. The OTFTs were fabricated by solution processes such as spin-coating for PVP gate dielectric and screen printing for S/D electrodes with Ag-paste, except pentacene active layer which was deposited by evaporation. The mobility was 0.024 cm2/V.sec , off state current ${\sim}10-11A$, threshold voltage 7.6 V and on/off current ratio ${\sim}105$. The panel consisted of 16 x 16 pixels and each pixel consisted of 2 OTFTs, 1 Capacitor and 1 OLED. The pixels successfully worked in terms of current magnitude supplied to OLED and the control ability of driving and switching OTFTs.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.51-56
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• 2014

After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.721-722
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• 2008