• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.9-18
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• 1999

In this study, Metallugical properties between Sn-3.5Ag, Sn-37Pb eutectic solders and Au/Ni/cu substrate according to time span above the melting point were investigated. A conventional reflow soldering machine wert used for this study and time span above the melting point was determined by changing peak soldering temperature and conveyor speed. As results, scallop type intermetallic compounds of $Ni_3Sn_4$ were formed at joint interface and no Cu-Sn compounds were found at all; Ni layer performed as a barrier for Cu diffusion. As the peak soldering temperature increased, thickness of the intermetallic compound layer increased; maximum thickness of the scallop-layer was 2.2$\mu\textrm{m}$. The shape of scallops were transformed from hemi-sphere type to elliptical shape with smaller size. Micro-hardness of the solder joint decreased as the eutectic structure of Sn-3.5Ag and Sn-37Pb increased.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.65-69
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• 2010

In this study, we investigated the effects of UBM(Under Bump Metallization) and solder composition on the drop impact reliability of wafer level packaging. Fan-in type WLP chips were prepared with different solder ball composition (Sn3.0Ag0.5Cu, and Sn1.0Ag0.5Cu) and UBM (Cu 10 ${\mu}m$, Cu 5 ${\mu}m$\Ni 3 ${\mu}m$). Drop test was performed up to 200 cycles with 1500G acceleration according to JESD22-B111. Cu\Ni UBM showed better drop performance than Cu UBM, which could be attributed to suppression of IMC formation by Ni diffusion barrier. SAC105 was slightly better than SAC305 in terms of MTTF. Drop failure occurred at board side for Cu UBM and chip side for Cu\Ni UBM, independent of solder composition. Corner and center chip position on the board were found to have the shortest drop lifetime due to stress waves generated from impact.

• Journal of the Korean Applied Science and Technology
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• v.31 no.1
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• pp.66-73
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• 2014

In this work, the current-voltage curves for stainless steel in the ethanolamine solution containing alkyl group were measured using the conventional three electrodes of cyclic voltammetry. Stainless steel as working electrode, Ag/AgCl electrode as reference electrode and Pt wire as counter electrode were used respectively. As a result, the C-V characteristics of stainless steel were to be for an irreversible process due to the oxidation current from cyclic voltammogram, using N-ethylethanolamine and N,N-dimethylethanolamine solutions. Effective diffusivity of corrosion inhibitors was decreased with increasing concentration. It was found from SEM images of the metal that the electrolyte (specific name ?)(0.5 N) as corrosion inhibitor was added into a N, N-diethylethanolamine solution ($1.0{\times}10^{-3}M$) containing copper and nickel, the corrosion inhibiting effect was enhanced.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.22-22
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• 2009

The silver thick film has been used in many industries such as display, chip, solar cell, automobile, and decoration with conventional heating. The silver thick film is fired with optimal time and temperature. However, decreasing the fabrication time is required due to high production power. Furthermore, there is a problem that silver in electrode is diffused throughout any substrates. For inhibiting the Ag diffusion and long fabrication time we considered a microwave heating. We investigated firing of silver thick film with conventional and microwave heating. The temperature of substrate was measured by thermal paper and the temperature of substrate was under $100\;^{\circ}C$ The shrinkage of electrode was measured with optical microscopy and optical profilometry. The shrinkage of electrode heat treated with microwave for 5min was similar to the that fired by the conventional heating for several hours. After firing by two types of heating, the diffusion of silver was determined using a optical microscope. The microstructure of sintered silver thick film was observed by SEM. Based on our results, the microwave heating should be a candidate heating source for the fabrication electronic devices in terms of saving the tact time and preventing the contamination of substrate.

• Journal of the Korean Chemical Society
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• v.20 no.6
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• pp.494-499
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• 1976

The extraction-polarographic method applied to the determination of micro amount of chromium (Ⅵ). Chromium(Ⅵ) was extracted into methylisobuthylketone(MIBK) layer containing diethyldithiocarbamate(DDTC) as Cr(Ⅲ)-DDTC complex from acetate buffered aqueous, solution of pH 5.4 and the direct current polarogram for the extract was recorded after addition of sodium perchlorate as supporting electrolyte. The reduction current was diffusion controlled. And the half wave potential of this reduction wave was -0.81 volt vs. SCE. The diffusion current was proportional to the chromium concentraticn in aqueous solution in the range of 8∼160 ppm. And the chromium(Ⅵ) could be selectively determined in the presence of chromium(Ⅲ), since the chromium(Ⅲ) did not interfere up to twice the amount of chromium(Ⅵ). Many of other metals such as Mn(Ⅱ), Cu(Ⅲ), Zn(Ⅱ), Mg(Ⅱ), Ni(Ⅱ) and Ag(Ⅰ) were found to have no effect even when present in 1000 times the amount of chromium (Ⅵ).

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.23-30
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• 2004

Interfacial reaction of Pb-free $Sn0.7wt{\%}Cu$ and $Sn3.8wt{\%}Ag0.7wt{\%}Cu$ solders and Pt during aging has been investigated. After the $Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens were reflowed at $250^{\circ}C$ for 30s and the $Sn0.7wt{\%}Cu/Pt$ specimens were reflowed at $260^{\circ}C$, the specimens were aged at $125^{\circ}C,\;150^{\circ}C$ and $170^{\circ}C$ for 25-121 hours. The intermetallic thitkness and morphology change during aging were characterized using SEM, EDS and XRD. $PtSn_4$ and $PtSn_2$ were observed in the solder/pt interface and the intermetallic formation was governed by diffusion. The activation energy of intermetallic formation was 145.3 kJ/mol for$Sn3.8wt{\%}Ag0.7wt{\%}Cu/Pt$ specimens for $Sn0.7wt{\%}Cu/Pt$ specimens from the measurement of the intermetallic thickness with aging temperature and time.

• Journal of the Korean Chemical Society
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• v.37 no.10
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• pp.874-880
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• 1993

Spectrophotometric enzymatic analysis and amperometric enzymatic analysis for the determinations of glucose and ethanol were studied utilizing glucose oxidase (GO) and alcohol oxidase (AO), respectively, which commonly consume $O_2$ and produce $H_2O_2$. For the determination of glucose, $H_2O_2$ were coupled to $K_4Fe(CN)_6$ via peroxidase producing $K_3Fe(CN)_6$ whose absorbance was measured at 418 nm or whose diffusion current was measured on the glassy carbon electrode at an applied potential of -55 mV vs. Ag/AgCl (sat. KCl) reference electrode. Amperometric analysis was 1000 times more sensitive as well as 10 times better in the linear concentration range than spectrophotometric analysis. For the determination of ethanol, AO only was used for the enzymatic analysis, since $K_3Fe(CN)_6$ was completely disappeared as soon as AO was added. Either rate of $H_2O_2$ produced was amperometrically measured at +0.900 V or rate of $O_2$ consumed was measured at -0.500 V vs. Ag/AgCl(sat. KCl) reference electrode.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.85-91
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• 2002

Even though electroless Hi and Sn-Ag-Cu solder are widely used materials in electronic packaging applications, interfacial reactions of the ternary Ni-Cu~Sn system have not been known well because of their complexity. Because the growth of intermetallics at the interface affects reliability of solder joint, the intermetallics in Ni-Cu-Sn system should be identified, and their growth should be investigated. Therefore, in present study, interfacial reactions between electroless Ni UB7f and 95.5Sn-4.0Ag-0.5Cu alloy were investigated focusing on morphology of the IMCs, thermodynamics, and growth kinetics. The IMCs that appear during a reflow and an aging are different each other. In early stage of a reflow, ternary IMC whose composition is Ni$_{22}$Cu$_{29}$Sn$_{49}$ forms firstly. Due to the lack of Cu diffusion, Ni$_{34}$Cu$_{6}$Sn$_{60}$ phase begins growing in a further reflow. Finally, the Ni$_{22}$Cu$_{29}$Sn$_{49}$ IMC grows abnormally and spalls into the molten solder. The transition of the IMCs from Ni$_{22}$Cu$_{29}$Sn$_{49}$ to Ni$_{34}$Cu$_{6}$Sn$_{60}$ was observed at a specific temperature. From the measurement of activation energy of each IMC, growth kinetics was discussed. In contrast to the reflow, three kinds of IMCs (Ni$_{22}$Cu$_{29}$Sn$_{49}$, Ni$_{20}$Cu$_{28}$Au$_{5}$, and Ni$_{34}$Cu$_{6}$Sn$_{60}$) were observed in order during an aging. All of the IMCs were well attached on UBM. Au in the quaternary IMC, which originates from immersion Au plating, prevents abnormal growth and separation of the IMC. Growth of each IMC is very dependent to the aging temperature because of its high activation energy. Besides the IMCs at the interface, plate-like Ag3Sn IMC grows as solder bump size inside solder bump. The abnormally grown Ni$_{22}$Cu$_{29}$Sn$_{49}$ and Ag$_3$Sn IMCs can be origins of brittle failure.failure.

• Research in Plant Disease
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• v.14 no.1
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• pp.43-50
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• 2008

Rhizoctonia blight (large patch) caused by Rhizoctonia solani AG2-2 is one of the major diseases on zoysiagrass in golf courses. In this study, anatgonistic bacteria to R. solani AG2-2 were selected in vitro tests using confrontation bioassay and triple layer agar diffusion method. The most active bacteria, Bacillus subtilis CJ-9 were tested for controlling large patch in pots. Relative Performance Indies (RPI) was used as a criterion for the selection of potential biocontrol agent. B. subtilis CJ-9 showed resistance to major synthetic agrochemicals used in golf course. In field tests at golf course, B. subtilis CJ-9 was more effective in suppression of large patch severity and population development of R. solani AG2-2 in soil than chemical fungicides. B. subtilis CJ-9 could be an alternative to chemical fungicides for eco-friendly management of large patch on zoysiagrass.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.6
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• pp.520-525
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• 2000

Glucose oxidase was immobilized in polypyrrole by electrosynthesis. The enzyme had an influence on the redox properties of a complex enzyme electrode. In the cyclic voltammograms of the enazyme electrode new peaks were appeared at the potential around 0.7V vs. Ag/AgCl in additional to the typical peaks for polypyrrole. The more immobilized the stronger the peaks became. During the cycling the pH of electrolyte solution was decreased to about 4.4 The reason for that is to be the proton released from the carboxyl in the glucose oxidase in order to keep on a charge neutrality of the oxidized enzyme. This fact suggests that the new peaks in the voltammograms are caused by the redox of glucose oxidase. In the AC impedance spectrum analysis of the electrode the diffusion of electrolyte anion was limited because of chained structure of the enzyme. The faradic impedance was large since the glucose oxidase is an insulator. Therefore when glucose oxidase is entrapped the enzyme should be limited in amount. Because the growth of the polypyrrole is accompanied both charge transfer and mass transport. For the traditional electrosynthesis that means amount of enzyme present in the electrode is limited to as much as film growable.