• Journal of Powder Materials
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• v.14 no.5
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• pp.320-326
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• 2007

Ag-Cu alloy nano powders were fabricated by the electrical explosion of Cu-plated Ag wires. Ag wires of 0.2mm diameter was electroplated to final diameter of 0.220 mm and 0.307 mm which correspond to Ag-27Cu and Ag-68Cu alloy. The explosion product consisted of equilibrium phases of ${\alpha}-Ag$ and ${\beta}$-Cu. The particle size of Ag-Cu nano powders were 44 nm and 70 nm for 0.220 mm and 0.307 mm wires, respectively. The Ag-Cu nano powders contained less Cu than average value due to higher sublimation energy compared to that of Ag. As a result, micron-sized spherical particles formed from liquid droplets contained higher Cu content.

• Journal of Welding and Joining
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• v.15 no.5
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• pp.104-114
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• 1997

The microstructure and bond strength were investigated on the SiC/SiC and SiC/mild steel joints brazed by Ag-5at%Ti alloy. Ag-5at%Ti-2at%Fe and -5at%Fe brazing alloys were also used to see the effects of Fe addition on the bond strength of SiC/SiC brazed joints. Brazing temperature and brazing gap were selected and examined as brazing variables. The microstructure of SiC/SiC brazed joints was affected by Fe addition to the Ag-5at%Ti alloy, but the bond strength was not. Increasing brazing temperature also changed the microstructure of $Ti_5Si_3$ reaction layer and brazing alloy matrix of the SiC/SiC and SiC/mild steel joints, but not the bond strength. Brazing gap had a great effects on the bond strength. Decreasing brazing gap from 0.2 mm to 0.1 mm in SiC/SiC brazing increased the bond strength from 187 MPa to 263 MPa and, in SiC/mild steel brazing, from 189 MPa to 212 MPa. It was concluded that the most important parameter on the bond strength in SiC/SiC and SiC/mild steel brazing was the relative ratio between brazing gap and specimen size.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.41-45
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• 2011

SnAgCu lead-free solder alloy is considered as the best alternative to eutectic tin-lead solder. However, the detailed material properties of SnAgCu solder are not available in public. Hence, this paper presents an estimation of mechanical properties of SnAgCu lead-free solder. In particular, the weight percent of Ag was varied as 1.0wt%, 2.5wt%, 3.0wt%, and 4.5wt% in order to estimate the effect of Ag in the Sn-xAg-0.5Cu ternary alloy system. For this purpose, four types of SnAgCu bars were first molded by casting and then standard specimens were cut out of molded bars. Micro-Vickers hardness, tensile tests were finally performed to estimate the variations in mechanical properties according to the weight percent of Ag. Test results reveal that the higher the weight percent of Ag is, the higher the hardness, yield strength, and ultimate tensile strength become. More material properties will be further investigated in the future work.

• The Journal of Korean Academy of Prosthodontics
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• v.27 no.1
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• pp.143-179
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• 1989

To observe the bonding behavior of palladium-based alloys to porcelain; 1. Pd-Co binary alloy with the higher cobalt content, 2. Pd-Co binary alloy with the lower cobalt content, 3. Pd-Ag-Sn ternary alloy, 4. Pd-Ag binary alloy, 5. Pd-Cu-Au ternary alloy and 6. Pd-Cu binary alloy were made as 6 groups of experimental alloys. Each group of alloy was divided into 4 sub-groups such as one sub-group that was not degassed and three sub-groups that degassed for 5 minutes, 10 minutes and 15 minutes. On each specimen, weight changes after degassing, morphological changes of oxide layer by changing the degassing time, compositional changes at metal-ceramic interface and bond strength of metal-ceramic measured with planar shear test were observed and compared. The results of the present study allow the following conclusions to be drawn: 1. The alloy showing the greatest bond strength was Pd-Cu alloy without gold and bond strength was decreased by alloying gold to them. 2. Although Pd-Co alloy showed the most prominent oxidation behavior, bond strength of them to porcelain was not greatly high by the formation of porosities at metal-ceramic interfaces. 3. Likewise tin, cobalt formed the peaks on line profiles at metal-ceramic interface, however copper did not exhibit such peaks on line profiles. 4. Mainly, oxide layer on Pd-Co alloy was composed with cobalt, and for Pd-Co alloy with higher cobalt content the rise of bond strength was not significant by increased degassing time. 5. On Pd-Ag alloy not containing tin, during degassing for 15 minutes silver content was increased at metal-ceramic interface. 6. As an oxidized element, tin formed the oxide layers that widen their area by increasing the degassing time, while cobalt and copper showed the morphological changes of particle or crystal on oxide layer.

• Proceedings of the Korean Magnestics Society Conference
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• 1995.05a
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• pp.90-91
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• 1995

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.05a
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• pp.87-87
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• 1997

• Korean Journal of Materials Research
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• v.19 no.1
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• pp.13-17
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• 2009

A semi-empirical method to estimate the surface tension of molten alloys at different oxygen partial pressures is suggested in this study. The surface tension of molten Ag-Sn and Ag-Cu alloys were calculated using the Butler equation with the surface tension value of pure substance at a given oxygen partial pressure. The oxygen partial pressure ranges were $2.86{\times}10^{-12}$－$1.24{\times}10^{-9}$ Pa for the Ag-Sn system and $2.27{\times}10^{-11}$－$5.68{\times}10^{-4}$ Pa for the Ag-Cu system. In this calculation, the interactions of the adsorbed oxygen with other metallic constituents were ignored. The calculated results of the Ag-Sn alloys were in reasonable accordance with the experimental data within a difference of 8%. For the Ag-Cu alloy system at a higher oxygen partial pressure, the surface tension initially decreased but showed a minimum at $X_{Ag}$ = 0.05 to increase as the silver content increased. This behavior appears to be related to the oxygen adsorption and the corresponding surface segregation of the constituent with a lower surface tension. Nevertheless, the calculated results of the Ag-Cu alloys with the present model were in good agreement with the experimental data within a difference of 10%.

• Journal of Technologic Dentistry
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• v.31 no.4
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• pp.9-15
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• 2009

The purpose of this study was to observe the change of mechanical property and microstructure in porcelain fused to gold alloy by heat treatment. PFG alloys are composed with Au-Pd-Ag alloy of the additional elements with indium, tin and copper. Specimens were tested in hardness using vicker,s micro-hardness tester and the surface micro structural changes were analysed by SEM and EDS. The results were as fellows: 1. The vickers hardness showed highest in Au-Pd-Ag alloy of the additional element with tin. 2. By hardening-oxiding result, the vicker,s hardness increased in additional element with tin but there was no significant difference in additional elements with indium and copper. 3. The surface oxide layer of Au-Pd-Ag alloy with added indium and tin increased but there was small change in additional element with copper. 4. The elements of indium and tin increased with increasing heat treatment in the surface alloy.

• Archives of Metallurgy and Materials
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• v.65 no.4
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• pp.1329-1333
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• 2020

In this study, we have developed Sn-Ag alloy by a simple high energy ball milling technique. We have ball-milled the eutectic mixture of Sn and Ag powders for a period of 45 h. The milled powder for 45 h was characterized for particle size and morphology. Microstructural investigations were carried out by scanning electron microscopy and X-ray diffraction studies. The melting behavior of 45 h milled powder was studied by differential scanning calorimetry. The resultant crystallite size of the Sn(Ag) solid solution was found to be 85 nm. The melting point of the powder was 213.6℃ after 45 h of milling showing depression of ≈6℃ in melting point as compared to the existing Sn-3.5Ag alloys. It was also reported that the wettability of the Sn-3.5Ag powder was significantly improved with an increase in milling time up to 45 h due to the nanocrystalline structure of the milled powder.

• Korean Journal of Materials Research
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• v.27 no.7
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• pp.381-385
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• 2017

In order to replace 14K white gold alloys, the properties of 5K white gold alloys (Au20-Ag80) were investigated by changing the contents of In (0.0-10.0 wt%). Energy dispersive X-ray spectroscopy (EDS) was used to determine the precise content of alloys. Properties of the alloys such as hardness, melting point, color difference, and corrosion resistance were determined using Vickers Hardness test, TGA-DTA, UV-VIS-NIR-colorimetry, and salt-spray tests, respectively. Wetting angle analysis was performed to determine the wettability of the alloys on plaster. The results of the EDS analysis confirmed that the Au-Ag-In alloys had been fabricated with the intended composition. The results of the Vickers hardness test revealed that each Au-Ag-In alloy had higher mechanical hardness than that of 14K white gold. TGA-DTA analysis showed that the melting point decreased with an increase in the In content. In particular, the alloy containing 10.0 wt% In showed a lower melting temperature (> $70^{\circ}C$) than the other alloys, which implied that alloys containing 10.0 wt% In can be used as soldering materials for Au-Ag-In alloys. Color difference analysis also revealed that all the Au-Ag-In alloys showed a color difference of less than 6.51 with respect to 14K white gold, which implied a white metallic color. A 72-h salt-spray test confirmed that the Au-AgIn alloys showed better corrosion resistance than 14K white gold alloys. All Au-Ag-In alloys showed wetting angle similar to that of 14K white gold alloys. It was observed that the 10.0 wt% In alloy had a very small wetting angle, further confirming it as a good soldering material for white metals. Our results show that white 5K Au-Ag-In alloys with appropriate properties might be successful substitutes for 14K white gold alloys.