• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.384-385
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• 2006

We studied about conductive pastes of the source-drain contacts for OTFTs(organic thin-film transistors) fabricated by direct printing(screen printing) method. We used Ag and conductive carbon black powder as the conductive fillers of pastes. The conductive pastes were manufactured by various dispersing agents and dispersing conditions and source-drain contacts with $100{\mu}m$ of channel length were fabricated. We could obtain the OTFTs which exhibited different field-effect behaviors over a range of source-dram and gate voltages depending on a kind of conductive fillers used conductive pastes.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.73-79
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• 2001

In this paper, shielding effectiveness(SE) of the shielding material of electromagnetic(EM) waves was investigated with actual experiments. The materials used in this study were made up of sputtering, film and powder of conductive materials - Cr, Al, Ag and Cu etc. Also, the polyester film was used as a base material. The experiment was carried out by using a shielding evaluator(Shielding box) TR17302 with an ADVANTEST spectrum analyzer, model R3361C. It was found from the experimental results that silver, copper, aluminum and chromium were good candidates as a shielding material against the EM waves with increasing the SE as the composite was laminated. The characteristics of the SE against the EM waves depended on a mode of preparation of specimen. The effects of density of particles on the SE were studied when the sputtering. The SE strongly depended on the electric resistance by density of sputtering and painting particles. SE increased as the density of particles was increasing.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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• 2006.04a
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• pp.41-44
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• 2006

The objective of this study was to evaluate the stabilization of As and heavy metals in tailings from the Samkwang Au-Ag mine with $Ca(OH)_2$. In order to evaluate the stabilization ability of As and heavy metals in the tailings, column test was implemented with various conditions as 1) particle size of $Ca(OH)_2$, 2) mixing method and 3) flow rate of eluents during 60 days. The results showed that addition with 5% of $Ca(OH)_2$ in 1kg of the tailings had the most effective ability of stabilization up to 95%. In addition, stabilization ability of As and heavy metals in tailings was enhanced using a fine powder of $Ca(OH)_2$. Therefore, stabilization technology can be used as a remediation of As and heavy metals in mine wastes including tailings and a nearby soils from abandoned metal mines.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05b
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• pp.12-15
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• 2003

The YBaCuO thick film was deposited by the electrophoresis in the solution with different dimension particles. The morphology of the films deposited from different particles size was compared. The powder made by sol-gel method has the submicron particles, which deposit the most smooth film, and without microcracks after sintering. After sintering of the deposited film, the zone-melting process was carried out in low oxygen partial pressure (100 Pa) and Ag was used as substrate. And the zone-melted YBaCuO was studied by XRD.

• ETRI Journal
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• v.35 no.2
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• pp.340-343
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• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.503-506
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• 2000

YBCO superconducting thick films were prepared on Ag wire by electrophoresis in acetone and ethanol with chemically modified suspension. The addition of organic compounds, such as PEG, EG into suspension solution for improving critical current density was investigated. Surface state, deposition condition, pore distribution and cracks were investigated by using SEM photographs. Controlling preparation conditions were studied for reducing these defects. As a results, in acetone solution, the surface crack of samples was decreased with increasing PEG. On the contrary, the surface crack of sample was increasing with increasing the amount of EG. In ethanol solution without I$_2$, which was generally used for an electrolyte, the deposition time was longer than this of acetone. For that reason the sample deposition in ethanol time was needed with enough stirring time for suspending YBCO powder and deposition time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.263-266
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• 2003

The fine $YBa_2Cu_3O_x$ powder ($0.2{\sim}1.0\;{\mu}m$) is produced by sol-gel method, and electrophoresis deposition is used for the preparation of $YBa_2Cu_3O_x$ thick films which are deposited on Ag wire. The oriented $YBa_2Cu_3O_x$ was tried to be prepared by the zone-melting method under low oxygen partial pressure. The orientation and the phase composition were examined by the X-ray diffraction and the superconductivities were measured by 4 line method. The critical current densities are still quite low, which may be due to unsuitable technical parameters for zone-melting of $YBa_2Cu_3O_x$ thick films. Therefore the heat treatment condition and controlling of low oxygen partial pressure should be improved in the future experiment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.559-560
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• 2006

Inkjet Printing is very attractive method for direct patterns with no masks, In order to Achieve direct printing with nano metal, It is often necessary to print them with highly concentrated Ink We research the High Concentrated silver nano ink. Formulation which has a good thermal stability and storage stability and jet stability using a ethylene glycol ether. Normally Alcohol-based inks can be sensitive But High boiling point ethylene glycol ether base Ink is creating a stable meniscus and minimum maintenance issues. We are reaching a 50~60wt% high Silver Ink using a Hydrophilic Ag Nano powder. (30~50nm)

• Progress in Superconductivity
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• v.3 no.1
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• pp.115-119
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• 2001

For the fabrication of HTS power cable, multifilamentary Bi-2223/Ag tapes have been prepared using the powder-in-tube (PIT) process. After final heat treatment, these tapes have $I_{c}$ value of 43A, and$ J_{c}$ value of $28,000A/\textrm{cm}^2$(77K, 0T). Prototype 1000A class multistrand conductor(length~1m) was fabricated using these tapes(length~300m). This multistrand conductor was impregnated with low-temperature epoxy. The transportation properties of prototype 1000A class multistrand conductor has been evaluated at 77K, and yielding a current capacity up to 1200A.A.A.

• Restorative Dentistry and Endodontics
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• v.9 no.1
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• pp.101-106
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• 1983

It was the purpose of this study to investigate the fracture mode of dental amalgam by observing the crack propagation, and to relate this to the microstructure of the amalgam. Caulk 20th Century Regular, Caulk Spherical, Dispersalloy, and Tytin amalgam alloys were used for this study. After each amalgam alloy and Hg measured exactly by the balance was triturated by the mechanical amalgamator (Capmaster, S.S. White), the triturated mass was inserted into the cylindrical metal mold which was 4 mm in diameter and 12 mm in height and was pressed by the Instron Universal Testing Machine at the speed of 1mm/min with 120Kg. The specimen removed from the mold was stored in the room temperature for a week. This specimen was polished with the emery papers from #100 to #200 and finally on the polishing cloth with 0.06${\mu}Al_2O_3$ powder suspended in water. The specimen was placed on the Instron testing machine in the method similar to the diametral tensile test and loaded at the crosshead speed of 0.05mm/min. The load was stopped short of fracture. The cracks on the polished surface of specimen was examined with scanning electron microscope (JSM-35) and analyzed by EPMA (Electron probe microanalyzer). The following results were obtained. 1. In low copper lathe-cut amalgam, the crack went through the voids and ${\gamma}_2$ phase, through the ${\gamma}_1$ phase around the ${\gamma}$ particles. 2. In low copper spherical amalgam, it was observed that the crack passed through the ${\gamma}_2$ and ${\gamma}_1$ phase, and through the boundary between the ${\gamma}_1$ and ${\gamma}$ phase. 3. In high copper dispersant (Dispersalloy) amalgam, the crack was found to propagate at the interface between the ${\gamma}_1$ matrix and reaction ring around the dispersant (Ag-Cu) particles, and to pass through the Ag-Sn particles. 4. In high copper single composition (Tytin) amalgam, the crack went through the ${\gamma}_1$ matrix between ${\eta}$ crystals, and through the unreacted alloy particle (core).