• 한국가구학회지
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• 제23권3호
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• pp.261-270
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• 2012

Nowadays, kitchen are not for the housewives who were independent themselves in the past but for the functional spaces. Kitchen spaces are not only the main function in the residence but also changing spaces which provide the mutual understanding communication between the family members. Although the primary function of the kitchen is food preparation, it is commonly a gathering spot for family and friends, especially if it includes an informal eating area. With so much time spent in the kitchen, and can easily become tired do the decorating scheme. But, for fear of high remodeling costs, it is often unchanged for many years. Surprisingly, there are many changes that can de made to the decorating scheme of a kitchen without either the expense or the inconvenience of remodeling. Between materials on the market, materials for kitchen interior were chosen for this study. Following results came from the materials after combustion. Among boards, MDF showed the highest score in these four categories; residual inflame time, residual glow time, carbonization length, carbonization area. Also, among finishing materials (interior materials), MDF + Poly Coating showed the highest score in those categories. Therefore, it seemed that interior materials need flame retardancy.

• 한국자동차공학회논문집
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• 제15권5호
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• pp.24-29
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• 2007

This study aims to provide a fundamental data for directly injected hydrogen fuel engines. Spray, ignition and combustion characteristics of hydrogen were studied using constant volume chamber. For spray visualization, hydrogen was vertically injected into a combustion chamber at various condition, for example, injection pressure, ambient pressure. And an argon laser was used for the shadowgraph photography by applying optical method. Also, to investigate heat-release rate and flame propagations, spark was ignited on hydrogen injected at the different time after injection and the duration of injection was also changed. Processes of ignition and combustion were analyzed by heat-release rate calculated by pressure history and were observed by shadowgraph photography The results gave much knowledge of spray, ignition and combustion characteristics of hydrogen.

• Bulletin of the Korean Chemical Society
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• 제21권11호
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• pp.1101-1105
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• 2000

A simultaneous determination method of BTEX (benzene, toluene, ethylbenzene, o,m.p-xylene) and TPH (kerosene, diesel, jet fuel and bunker C) in soil with gas chromatography/flame ionization detection (GC-FID) was described. The effects of extracti on method, extraction solvent, solvent volume and extraction time on the extraction performance were studied. A sonication method was simpler and more efficient than Soxhlet or shaking methods. Sonication with 10 mL of acetone/methylene chloride (1 : 1, v/v) for 10 min was found to be optimal extraction conditions for 20 g of soil. Peak shapes and quantification of BTEX and TPH were excellent, with linear calibration curves over a wide range of 1-500 mg/L for BTEX and 10-5000 mg/L for TPH. Good reproducibilities by sonication were obtained, with the RSD values below 10%. By using about 20 g of soil, detection limits were 0.8 mg/L for BTEX and 10 mg/L for TPH. The advantages of this procedure are the use of simple and common equipment, reduced volumes of organic solvents, rapid extraction periods of less than 20 min, and simultaneous analysis of volatile and semivolatile compounds.

• International Journal of Automotive Technology
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• 제6권5호
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• pp.445-451
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• 2005

Most of the pollutants from passenger cars are emitted during the cold-transient phase of the FTP-75 test. In order to reduce the exhaust emissions during the cold-transient period, it is essential to warm up the catalyst as fast as possible after the engine starts, and the Unburned Exhaust Gas Ignition (UEGI) technology was developed through our previous studies to help close-coupled catalytic converters (CCC) reach the light-off temperature within a few seconds after cold-start. The UEGI system operates by igniting the unburned exhaust mixture by glow plugs installed upstream of the catalyst. The flame generates a high amount of heat, and if the heat is concentrated on a specific area of monolith surface, then thermal crack or failure of the monolith could occur. Therefore, it is very important to monitor the temperature distribution in the CCC during the UEGI operation, so the local temperatures in the monolith were measured using thermocouples. Experimental results showed that the temperature of CCC rises faster with the UEGI technology, and the CCC reaches the light-off temperature earlier than the baseline case. Under the conditions tested, the light-off time of the baseline case was 62 seconds, compared with 33 seconds for the UEGI case. The peak temperature is well under the thermal melting condition, and temperature distribution is not so severe as to consider thermal stress. It is noted that the UEGI technology is an effective method to warm up the catalyst with a small amount of thermal stress during the cold start period.

• 자원리싸이클링
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• 제23권6호
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• pp.30-39
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• 2014

코로나 방전 정전선별기 내에서 인쇄회로기판(Printed Circuit Board, PCB) 분쇄 입자의 이동궤도를 전산 모사하였다. 여기서 PCB입자는 전자부품 분리된 기판을 파쇄한 것으로, 대부분 구리와 FR-4(Flame Retardant Level-4)로 이루어져있다. 우선 입자가 선별기내 회전전극으로부터 탈착 지점을 계산하였으며, 중력, 원심력, 정전기력의 평형으로부터 유도되었다. 한편 탈착 후 이동궤도는 입자의 운동방정식으로부터 구한 가속도를 시간 적분하여 계산하였다. 시뮬레이션 변수는 입자의 크기, 공급전압의 세기, 회전전극속도 및 유도전극 각도로 하였다. 입자 이동궤도에 미치는 영향은 구리 입자의 경우에는 회전속도가 주요 변수였으나, 반면 FR-4 입자의 경우에는 상기 모든 변수에 영향을 받는 것으로 나타났다.

• Bulletin of the Korean Chemical Society
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• 제28권8호
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• pp.1375-1382
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• 2007

A column preconcentration method with pulverized Amberlite XAD-4 loaded with bismuthiol I (BI) has been developed for the determination of trace Cd(II) and Cu(II) in various real samples by flame atomic absorption spectrophotometry. Various experimental conditions, such as the size of XAD-4, adsorption flow rate, amount of bismuthiol I, stirring time for adsorbing bismuthiol I on XAD-4, pH of sample solution, amount of XAD-4- BI, desorption solvent, and desorption flow rate, were optimized. Also, the adsorption capacity and the adsorption rate of Cd(II) and Cu(II) on XAD-4-BI were investigated. The interfering effects of various concomitant ions were investigated, Bi(III), Sn(II) and Fe(III) were found to affect the determination. But the interference by these ions was completely eliminated by adjusting the amount of XAD-4-BI resin to 0.70 g, although the adsorption flow rate was slower. For Cd(II) our proposed technique obtained a dynamic range of 0.5-40 ng mL-1, a correlation coefficient (R2) of 0.9913, and a detection limit of 0.3 ng mL-1. For Cu(II), the corresponding values were 2.0-120 ng mL-1, 0.9921 and 1.02 ng mL-1. To validate this proposed technique, the aqueous samples (stream water, reservoir water, tap water and wastewater), the diluted brass sample and the plastic sample, as real samples, were used. Recovery yields of 91-103% were obtained. These measured data were not different from ICP-MS data at 95% confidence level. Our proposed method was also validated using rice flour CRM (normal, fortified) samples. From the results of our experiment, we found that the technique we present here can be applied to the determination of Cd(II) and Cu(II) in various real samples.

• Korean Chemical Engineering Research
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• 제59권3호
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• pp.359-365
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• 2021

본 연구에서는 분진의 착화 특성 및 정전기 위험성 평가법을 실험적으로 조사하였다. 착화에너지 시험은 PE(HD), PE(LD), PMMA 분진에 대해 MIKE-3장치를 사용하여 실시하였다. PE (HD)의 경우 약 8 ms의 일정 시간 경과 후에 분진운의 착화 화염이 형성되고, 착화원 중심부에서는 화염 핵이 관찰되지 않았다. 분진의 분산 횟수가 증가함에 따라 정전압이 증가하고 분진 농도에 따른 정전압 발생 증가율은 PMMA, PE(LD), PE (HD) 순으로 가장 높았다. PE(HD) 분진의 분산 조건이 정전압에 미치는 영향을 조사하였으며, 분산 횟수가 많아질수록 정전압이 증가하였고 동일한 분산 횟수에서는 분진 농도가 높아질수록 정전압이 증가하였다. 정전기 착화에 의한 화재폭발사고 예방을 위한 안전 정전압은 PE(HD), PE(LD)-1, PE(LD)-2, PMMA에 있어서 각각 2.58, 44.72, 25.82, 8.16 kV로 추정되었다. 정전압 측정자료를 사용하여 정전기 착화 위험성을 효율적으로 조사하여 최소착화에너지를 추정하는 방법을 제안하였다.

• 한국재료학회지
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• 제25권10호
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• pp.571-576
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• 2015

The effects of coating thickness on the delamination and fracture behavior of thermal barrier coating (TBC) systems were investigated with cyclic flame thermal fatigue (FTF) and thermal shock (TS) tests. The top and bond coats of the TBCs were prepared by electron beam-physical vapor deposition and low pressure plasma spray methods, respectively, with a thickness ratio of 2:1 in the top and bond coats. The thicknesses of the top coat were 200 and $500{\mu}m$, and those of the bond coat were 100 and $250{\mu}m$. FTF tests were performed until 1140 cycles at a surface temperature of $1100^{\circ}C$ for a dwell time of 5 min. TS tests were also done until more than 50 % delamination or 1140 cycles with a dwell time of 60 min. After the FTF for 1140 cycles, the interface microstructures of each TBC exhibited a sound condition without cracking or delamination. In the TS, the TBCs of 200 and $500{\mu}m$ were fully delaminated (> 50 %) within 171 and 440 cycles, respectively. These results enabled us to control the thickness of TBC systems and to propose an efficient coating in protecting the substrate in cyclic thermal exposure environments.

• 한국산학기술학회논문지
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• 제19권2호
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• pp.653-659
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• 2018

초고층 복합시설은 수많은 사람들이 이용하고 있는 도심의 핵심시설로서 안전성을 최우선으로 하고 있으며, 화재발생 시 연기와 유독가스는 대형사고를 유발할 수 있다. 본 연구는 초고층 복합시설물에서 화재에 의한 재난이 발생했을 경우, 피난자들이 신속히 안전한 곳으로 피할 수 있는 비상 대피통로용 접이장치에 적용되는 섬유 스크린 소재를 개발하는 데 목적이 있다. 섬유 스크린 소재 개발 방향은 일반적으로 사용되는 철제 소재와 달리 접이장치 내 롤형태로 장기간 보관 시 하중 부담이 적은 경량일 것과 차염/차연 기능이 우수해야 하며 복사열에 의한 피난자의 영향이 적어야 할 것이다. 이에 대해 난연성이 우수한 원단과 후가공을 조건으로 3종의 섬유 스크린 소재를 선정하여 열수축시험, 접촉열시험, 연소성시험, 난연도시험, 인장강도시험, 인열강도시험을 통해 성능평가를 수행하였다. 그 결과 경량의 원단이라도 후가공을 통해 우수한 성능을 발휘할 수 있으며, 실리콘수지 코팅이 섬유 스크린 소재 성능과 복사열에 의한 대피자의 안전을 확보할 수 있는 것으로 나타났다. 이에 따라 무게와 두께가 상이한 유리섬유 2종과 난연 실리콘수지 4종을 대상으로 코팅을 한 후 연소성시험을 수행하여 최적의 후가공조건을 평가하였다.

• 대한금속재료학회지
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• 제50권1호
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• pp.71-77
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• 2012

We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.