• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.12 s.255
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• pp.1543-1550
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• 2006

Since the performance of joints usually determines the structural efficiency of composite structures, an extensive knowledge of the behavior of adhesive joints and the related effect on joint strength is essential for design purposes. In this study, the torque capacity of adhesive joints was predicted using the combined thermal and mechanical analyses when the adherend was a composite tube. A finite element analysis was performed to evaluate residual thermal stresses developed in the joint, and mechanical s stresses in the adhesive were calculated including both the nonlinear adhesive behavior and the behavior of composite tubes. Three different joint failure modes were considered to predict joint failure: interfacial failure, adhesive bulk failure, and adherend failure. The influence of the composite adherend stacking angle on the residual thermal stresses was investigated, and how the residual thermal stresses affect the joint strength was also discussed. Finally, the predicted results were compared with experimental results available in literature.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2005.04a
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• pp.94-97
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• 2005

The strength of aluminum 7075 and carbon composite hybrid joints was studied for adhesive, bolt, and the adhesive-bolt combined joints. Several hybrid joint specimens were tested to get the failure load and modes for three types of the joints. Adhesive Cytec EA9394S was used for aluminum and carbon bonding. Failure load of the adhesive-bolt combined joint was 94 % of the sum of the failure load of the separately bonded and bolted joints. Hybrid joint also showed more stable failure behavior than the simple adhesive or bolted joint.

• International Journal of Aeronautical and Space Sciences
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• v.13 no.2
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• pp.229-237
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• 2012

In this study, the failure mechanism of sandwich-to-laminate T-joints under pull-off loading was investigated by experiment and the finite element method. A total of 26 T-joint specimens were manufactured and tested in order to investigate the effects of both adhesive thickness (0.4, 2.0, and 4.0 mm) and environmental conditions on the failure of the joints. The results showed that failure occurred mainly as intralaminar failure in the first layer of the sandwich face, which was contacted to the paste adhesive. The failure load did not significantly change with increasing adhesive thickness in both RTD (Room Temperature and Dry) and ETW (Elevated Temperature and Wet) conditions. In the case of ETW conditions, however, the failure load increased slightly with an increase in adhesive thickness. The joints tested in ETW conditions had higher failure loads than those tested in RTD conditions. In addition to the experiment, a finite element analysis was also conducted to investigate the failure of the joint. The stress inside the first ply of the sandwich face was of interest because during the experiment, failure always occurred there. The analysis results showed good agreement with the trend of experimental results, except for the case of the smallest adhesive thickness. The highest stress was predicted in the regions where initial failure was observed in the experiment. The maximum stress was almost constant when the adhesive thickness was beyond 2 mm.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• Journal of Applied Reliability
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• v.9 no.4
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• pp.331-341
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• 2009

PSA (Pressure Sensitive Adhesive) is used for various purposes in electronic appliances such as double-sided tape for fitting parts, product's name plate, and surface protecting film, and so forth. In several kinds of PSAs, this paper dealt with the failure analysis of PET (Polyethylene Terephthalate) acrylic adhesive tapes. The causes of interface failure were investigated through the test of adhesive strength, thickness, and structure. And test standard methods to prevent recurrences were established.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.370-376
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• 2001

When an adhesive joint is exposed to high environmental temperature, the tensile load capability of the adhesive joint decreases because the elastic modulus and failure strength of structural adhesive decrease. The thermo-mechanical properties of structural adhesive can be improved by addition of fillers to the adhesive. In this paper, the elastic modulus and failure strength of adhesives as well as the tensile load capability of tubular single lap adhesive joints were experimentally and theoretically investigated with respect to the volume fraction of filler (alumina) and the environmental temperature. Also the tensile modulus of the fille containing epoxy adhesive was predicted using a new equation which considers filler shape, filler content and environmental temperature. The tensile load capability of the adhesive joint was predicted by using the effective strain obtained from the finite element analysis and a new failure model, from which the relation between the bonding length and the crack length was developed with respect to the volume fraction of filler.

• Composites Research
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• v.17 no.6
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• pp.14-21
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• 2004

Failure process, mode and strength of unidirectional composite single lap bonded joints were investigated experimentally with respect to bonding methods, those are, co-curing with and without adhesive and secondary bonding. The co-cured joint specimens without adhesive had the largest failure strength. Progressive failures along the adhesive layer occurred in the secondary bonded specimens. In the co-cured specimens with adhesive film which had better material strength and adhesion performance, delamination failure occurred and the joint strengths were less than those of secondary bonded specimens. Delamination failure did not occur in the secondary bonded specimens because of earlier crack growth and progressive failure in the adhesive layer. Therefore, failure strength of composite bonded Joints were not always proportionate to material strength and adhesion performance of the adhesive due to the weakness of delamination in composite materials. The effects of surface roughness, bondline thickness and fillets were also studied on secondary bonded specimens.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.73-77
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• 2004

Failure predictions of composite single-lap bonded joints were performed considering both of composite adherend failure and bondline failure. An elastic-perfectly plastic model of adhesive and a delamination failure criterion are used. The failure prediction results such as failure mode and strength have very good agreements with the test results of joint specimens with various bonding methods and parameters. The influence of variations in the effective strength (that is, adhesion performance) and plastic behavior of adhesive on the failure characteristics of composite bonded joints are investigated numerically. The numerical results show that optimal joint strength is archived when adhesive and delamination failure occur in the same time.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.12
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• pp.2662-2669
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• 2002

Recently structural applications of adhesive bonding method have been increased extensively in automobile industry. Adhesively-bonded joints which are used in automobile field are exposed to various environmental conditions. In this study, several environmental factors were concerned to evaluate their effects on the adhesive strength such as air temperature, water temperature, exposed time in water. The specimens are exposed for 1, 10 and 100 hours at various air temperatures to evaluate the effects of the air and water temperature on the adhesive strength. It is proved that the adhesive strength decrease with rising the air and water temperature, and the adhesive strength decrease steeply at the higher temperature with increasing the exposure time in water.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.10 s.181
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• pp.2520-2528
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• 2000

Mechanical and physical properties of composite materials make a great difference due to their cure process condition. In order to clarify the effect of cure process condition on the microscopic damage behavior and failure mechanism of Carbon/Epoxy composites, three point bend test has been performed. For this purpose, two kinds of specimens with single adhesive and multiple adhesive layers were prepared. For single adhesive layer, four different types of specimen were used, that is, non-sanding, sanding, cocured, laminated specimens. Three different types of specimen were also used for the multiple adhesive layer, non-sanding, sanding, cocured specimens. Acoustic emission technique has also been employed to monitor the damage progresses associated with each micro-failure mechanism. The characteristics of AE parameters associated with micro-failure mechanism of each specimen were discussed.