• Title/Summary/Keyword: Adhesive failure

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복합재료 접착체를 가지는 튜브형 접합부의 토크전달능력 예측 (Prediction of the Torque Capacity for Tubular Adhesive Joints with Composite Adherends)

  • 오제훈
    • 대한기계학회논문집A
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    • 제30권12호
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    • pp.1543-1550
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    • 2006
  • Since the performance of joints usually determines the structural efficiency of composite structures, an extensive knowledge of the behavior of adhesive joints and the related effect on joint strength is essential for design purposes. In this study, the torque capacity of adhesive joints was predicted using the combined thermal and mechanical analyses when the adherend was a composite tube. A finite element analysis was performed to evaluate residual thermal stresses developed in the joint, and mechanical s stresses in the adhesive were calculated including both the nonlinear adhesive behavior and the behavior of composite tubes. Three different joint failure modes were considered to predict joint failure: interfacial failure, adhesive bulk failure, and adherend failure. The influence of the composite adherend stacking angle on the residual thermal stresses was investigated, and how the residual thermal stresses affect the joint strength was also discussed. Finally, the predicted results were compared with experimental results available in literature.

금속-복합재 하이브리드 체결부의 강도 특성 연구 (A Study on the Strength of Metal-Composite Hybrid Joints)

  • 정재우;송민환;권진회;최진호
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2005년도 춘계학술발표대회 논문집
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    • pp.94-97
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    • 2005
  • The strength of aluminum 7075 and carbon composite hybrid joints was studied for adhesive, bolt, and the adhesive-bolt combined joints. Several hybrid joint specimens were tested to get the failure load and modes for three types of the joints. Adhesive Cytec EA9394S was used for aluminum and carbon bonding. Failure load of the adhesive-bolt combined joint was 94 % of the sum of the failure load of the separately bonded and bolted joints. Hybrid joint also showed more stable failure behavior than the simple adhesive or bolted joint.

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Experimental and numerical study on the failure of sandwich T-joints under pull-off loading

  • Nguyen, Khanh-Hung;Park, Yong-Bin;Kweon, Jin-Hwe;Choi, Jin-Ho;Shul, Chang-Won;Yang, Myung-Seog;Jun, Seung-Moon
    • International Journal of Aeronautical and Space Sciences
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    • 제13권2호
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    • pp.229-237
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    • 2012
  • In this study, the failure mechanism of sandwich-to-laminate T-joints under pull-off loading was investigated by experiment and the finite element method. A total of 26 T-joint specimens were manufactured and tested in order to investigate the effects of both adhesive thickness (0.4, 2.0, and 4.0 mm) and environmental conditions on the failure of the joints. The results showed that failure occurred mainly as intralaminar failure in the first layer of the sandwich face, which was contacted to the paste adhesive. The failure load did not significantly change with increasing adhesive thickness in both RTD (Room Temperature and Dry) and ETW (Elevated Temperature and Wet) conditions. In the case of ETW conditions, however, the failure load increased slightly with an increase in adhesive thickness. The joints tested in ETW conditions had higher failure loads than those tested in RTD conditions. In addition to the experiment, a finite element analysis was also conducted to investigate the failure of the joint. The stress inside the first ply of the sandwich face was of interest because during the experiment, failure always occurred there. The analysis results showed good agreement with the trend of experimental results, except for the case of the smallest adhesive thickness. The highest stress was predicted in the regions where initial failure was observed in the experiment. The maximum stress was almost constant when the adhesive thickness was beyond 2 mm.

반도체 패키지의 응력 해석 (The Stress Analysis of Semiconductor Package)

  • 이정익
    • 한국공작기계학회논문집
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    • 제17권3호
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    • pp.14-19
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    • 2008
  • In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

전자제품 적용 감압성 점착제(PSA)의 고장분석 (Failure Analysis of PSA applied electronics in home appliances)

  • 김소연;인태경;김진우;김명수
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제9권4호
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    • pp.331-341
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    • 2009
  • PSA (Pressure Sensitive Adhesive) is used for various purposes in electronic appliances such as double-sided tape for fitting parts, product's name plate, and surface protecting film, and so forth. In several kinds of PSAs, this paper dealt with the failure analysis of PET (Polyethylene Terephthalate) acrylic adhesive tapes. The causes of interface failure were investigated through the test of adhesive strength, thickness, and structure. And test standard methods to prevent recurrences were established.

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충전재가 함유된 단일겹치기 접착 조인트의 열적 특성에 관한 연구 (Thermal Characteristic of the Tubular Single tap Adhesively Bonded Joint bonded with filler containing epoxy adhesive)

  • 김진국;이대길
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.370-376
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    • 2001
  • When an adhesive joint is exposed to high environmental temperature, the tensile load capability of the adhesive joint decreases because the elastic modulus and failure strength of structural adhesive decrease. The thermo-mechanical properties of structural adhesive can be improved by addition of fillers to the adhesive. In this paper, the elastic modulus and failure strength of adhesives as well as the tensile load capability of tubular single lap adhesive joints were experimentally and theoretically investigated with respect to the volume fraction of filler (alumina) and the environmental temperature. Also the tensile modulus of the fille containing epoxy adhesive was predicted using a new equation which considers filler shape, filler content and environmental temperature. The tensile load capability of the adhesive joint was predicted by using the effective strain obtained from the finite element analysis and a new failure model, from which the relation between the bonding length and the crack length was developed with respect to the volume fraction of filler.

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일방향 복합재료 Single Lap접합 조인트의 파손 모드 및 강도 I. 실험 (Failure Mode and Strength of Unidirectional Composite Single Lap Bonded Joints I. Experiments)

  • 김광수;유재석;안재모;장영순
    • Composites Research
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    • 제17권6호
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    • pp.14-21
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    • 2004
  • 본 연구에서는 몇 가지 접합 방법에 따라 일방향 복합재료 단일 겹치기 접합 조인트의 파손 과정, 모드 및 강도를 실험적으로 평가하였다 접합 방법으로는 접착제 없는 동시성형, 접착제를 사용한 동시성형 및 이차 접합의 세 가지를 고려하였다 또한 이차 접합 조인트에서 몇 가지 파라미터의 영향도 살펴보았다. 접착제 없는 동시성형 시편은 가장 우수한 조인트 강도를 나타내었다. 이차접합 조인트에서는 접착제 층의 점진적인 파손이 발생하였다. 접착제의 재료 및 접합 강도가 상대적으로 강한 필름 접착제의 동시성형 조인트는 갑작스런 층간분리 파손이 발생하였으며 이차 접합 조인트보다 더 낮은 파손 강도를 나타내었다. 이차 집합 조인트에서 층간분리 파손이 발생하지 않은 것은 접착제 층에서의 균열 진전 및 점진적 파손이 층간분리 파손을 방지한 것으로 보인다. 따라서 복합재료 접합 조인트의 파손 강도는 접착제의 재료 강도 또는 접착 성능과 항상 비례하지 않으며 이것은 복합재료가 층간 분리 파손에 약하기 때문이다.

복합재료 Single Lap 접합 조인트의 파손 예측 (Failure Prediction of Composite Single Lap Bonded Joints)

  • 김광수;장영순;이영무
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2004년도 추계학술발표대회 논문집
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    • pp.73-77
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    • 2004
  • Failure predictions of composite single-lap bonded joints were performed considering both of composite adherend failure and bondline failure. An elastic-perfectly plastic model of adhesive and a delamination failure criterion are used. The failure prediction results such as failure mode and strength have very good agreements with the test results of joint specimens with various bonding methods and parameters. The influence of variations in the effective strength (that is, adhesion performance) and plastic behavior of adhesive on the failure characteristics of composite bonded joints are investigated numerically. The numerical results show that optimal joint strength is archived when adhesive and delamination failure occur in the same time.

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압연강판 접착제 접합부의 환경 접합강도에 미치는 온도 및 침수시간의 영향 (Effect of Temperature and Immersion Time on the Environmental Adhesive Strength of Adhesively Bonded Joints of Rolled Steel Sheet)

  • 송준희;이희제;임재규
    • 대한기계학회논문집A
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    • 제26권12호
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    • pp.2662-2669
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    • 2002
  • Recently structural applications of adhesive bonding method have been increased extensively in automobile industry. Adhesively-bonded joints which are used in automobile field are exposed to various environmental conditions. In this study, several environmental factors were concerned to evaluate their effects on the adhesive strength such as air temperature, water temperature, exposed time in water. The specimens are exposed for 1, 10 and 100 hours at various air temperatures to evaluate the effects of the air and water temperature on the adhesive strength. It is proved that the adhesive strength decrease with rising the air and water temperature, and the adhesive strength decrease steeply at the higher temperature with increasing the exposure time in water.

Cocure/Precure 경화공정에 의해 제조된 Carbon/Epoxy 복합재료의 미시적 파손거동에 대한 AE 특성 (AE Characteristics on Microscopic Failure Behavior of Carbon/Epoxy Comosite Prepared by Cocure and Precure Process)

  • 이진경;이준현;이민래;최흥섭
    • 대한기계학회논문집A
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    • 제24권10호
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    • pp.2520-2528
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    • 2000
  • Mechanical and physical properties of composite materials make a great difference due to their cure process condition. In order to clarify the effect of cure process condition on the microscopic damage behavior and failure mechanism of Carbon/Epoxy composites, three point bend test has been performed. For this purpose, two kinds of specimens with single adhesive and multiple adhesive layers were prepared. For single adhesive layer, four different types of specimen were used, that is, non-sanding, sanding, cocured, laminated specimens. Three different types of specimen were also used for the multiple adhesive layer, non-sanding, sanding, cocured specimens. Acoustic emission technique has also been employed to monitor the damage progresses associated with each micro-failure mechanism. The characteristics of AE parameters associated with micro-failure mechanism of each specimen were discussed.