• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.3
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• pp.14-19
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• 2008

In the semiconductor IC(Integrated Circuit) package, the top surface of silicon chip is directly attached to the area of the leadframe with a double-sided adhesive layer, in which the base layer have the upper adhesive layer and the lower adhesive layer. The IC package structure has been known to encounter a thermo-mechanical failure mode such as delamination. This failure mode is due to the residual stress on the adhesive surface of silicon chip and leadframe in the curing-cooling process. The induced thermal stress in the curing process has an influence on the cooling residual stress on the silicon chip and leadframe. In this paper, for the minimization of the chip surface damage, the adhesive topologies on the silicon chip are studied through the finite element analysis(FEA).

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.4
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• pp.50-56
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• 2003

Most engineering products contain more than one component. Failure occurs either at the connection itself or in the component at the point of attachment of the connection in many engineering structures. The allocation and design of connections such as bolts, spot-welds, adhesive etc. usually play an important role in the structure of multi-components. Topology optimization of connection component provides more practical solution in design of multi-component connection system. In this study, a topology optimization based on density distribution approach has been applied to optimal location of fasteners such as T-shape, L-shape and multi-component connection system. From the results, it was verified that the number of iteration was reduced, and the optimal topology was obtained very similarly comparing with ESO method. Therefore, it can be concluded that the density distribution method is very suitable for topology optimization of multi-component structures.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.15-20
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• 2003

Most engineering products contain more than one component. Failure occurs either at the connection itself or in the component at the point of attachment of the connection in many engineering structures. The allocation and design of connections such as bolts, spot-welds, adhesive etc. usually play an important role in the structure of multi-components. Topology optimization of connection component provides more practical solution in design of multi-component connection system. In this study, a topology optimization based on density distribution approach has been applied to optimal location of fasteners such as T-shape, L-shape and multi-component connection system. From the results, it was verified that the number of iteration was reduced, and the optimal topology was obtained very similarly comparing with ESO method. Therefore, it can be concluded that the density distribution method is very suitable for topology optimization of multi-component structures.

• Textile Coloration and Finishing
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• v.11 no.4
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• pp.50-56
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• 1999

The adhesive properties of polyester cord in rubber matrix were investigated according to the surface modification. The polyester cord was oxidized in sodium hypochlorite solution, and graft-polymerized with acrylic acid under the irradiation with ultraviolet light, and then coated with resorcinol-formaldehyde latex (RFL). The modified surface was checked with scanning electron microscope. The adhesive properties were measured by the full-Out method, and evaluated with regard to the energy of adhesion and the maximum load. The polyester was not oxidized in sodium hypochlorite solution, so the surface was not able to etch to produce the coarse topology. As the concentration of acrylic acid and the reaction time were increased, the graft yields were also increased. It was considered that the acrylic acid would swell the polyester and diffuse easily to the inner side of substrate. The adhesive properties of polyeser to rubber matrix were affected by the surface condition. Namely, the maximum load was almost same, but the energy of adhesion was rather higher In the polyester grafted with acrylic acid than in control one. We concluded that the flexible aliphatic chains of polyacrylic acid situated in the interface of cord and rubber matrix were distributed well the stress and strain all over the filler resulting the high energy of adhesion.

• Food Science and Preservation
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• v.24 no.2
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• pp.246-253
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• 2017

This study was conducted prepare spray-dried powder using pumpkin sweet potato hydrolysates and examine the physicochemical properties of the powder. The insoluble dietary fiber and soluble dietary fiber of the pumpkin sweet potato treated by enzyme were 4.17% and 2.07%, respectively. The spray-dried pumpkin sweet potato hydrolysates was manufactured via spray-drying with different forming agents: i.e., pectin 0.1%, 0.5%, 1%, and 2.0%. The moisture contents and total starches of the spray-dried powders were approximately 1.68-2.46 and 45.32-46.51%, respectively. The color of the L and a value decreased, and that of the b and ${\Delta}E$ value increased. The particle size and outer topology of the spray-dried powders were $37.17-42.32{\mu}m$, and its shape was generally globular. The water absorption index of the spray-dried powder (1.74-1.91) was lower than that of the freeze-dried powder (2.15). The water solubility index of the spray-dried powder, 80.75-87.61%, was higher than that of the freeze-dried powder (70.47%). The adhesion values of spray-dried powder to epithelial HT-29 cells were 2.66-6.18% of the initial cell counts, whereas freeze-dried powder showed lower adhesive ability (1.79%). The in vitro human digestibility in the spray-dried powder was 70.09% which is very effective in digestion.