• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.11
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• pp.961-968
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• 2009

In this work, transparent conductive oxide(TCO) films such as $In_2O_3-SnO_2$(ITO) and $In_2O_3-ZnO$(IZO) were prepared on polyethylene naphthalene(PEN) and glass substrates by using rf-magnetron sputtering system. The TCO films deposited on PEN substrate show very poor conductivity as compared to that of the TCO films deposited on glass substrates. From the results of the residual gas analysis(RGA) test, this poor stability of plastic substrate is presumed to be caused by the deteriorated adhesion between the TCO films and the plastic substrate due to outgassing from the plastic substrate during deposition of TCO films. From our experiment, it is found that the vaporization of some defects in the plastic substrates deteriorate the adhesion of the TCO films to the plastic substrate, because the most plastic substrates containing the water vapor and/or other adsorbed particles such as organic solvents. Mixing of these gases vaporized in the sputtering process will also affect the electrical property of the deposited TCO films. Inorganic thin composite $(SiO_2)_{40}(ZnO)_{60}$ film as a gas barrier layer is coated on the PEN substrate to protecting the diffusion of vapors from the substrate, so that the TCO films with an improved quality can be obtained.

• Journal of Adhesion and Interface
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• v.6 no.2
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• pp.6-12
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• 2005

The plasma generally, ionized gas state, is the 4th material state composed the universe. Generating the plasma artificially has been studied by spending energy and it has a lot of applications in human's life. There are several merits to modify the surface of polymer using plasma. Above all, plasma maintains the property of polymer because of it changes the property of surface only. Also, it doesn't use a organic solvent and it is the environment friendship because of there are no waste under processing. Furthemore, in case of high-pressure plasma, it is possible that automated-processing continuously. In this study, we tried the reforming of surface to rise the adhesive strength between the material of polymer, experimented the rising of adhesive strength through a experiment of peel strength by virtue of processing time and using gas, confirmed the change of polymer's surface through measuring the surface contact angle analyzer and scanning electron microscopy (SEM).

• Polymer(Korea)
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• v.38 no.4
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• pp.544-549
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• 2014

Double layered film consisting of polyimide/polysiloxane and interface with nano domain structure was fabricated through stepwise layer formation and subsequent aging steps. During aging of film, nano phase separation occurred between the top layer polysiloxane and the upper layer of polyimide, which was observed by transmission electron microscope (TEM). A stable and uniform polysiloxane layer was obtained, showing the reproducible pressure-sensitive adhesion (PSA) property with the peel strength of 8-13 g/inch at even $300^{\circ}C$. In addition, the resulting polymide/polysiloxane film was thermo-stable up to $435^{\circ}C$, providing the promising properties suitable for application in microelectronics processing.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.39-45
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• 2006

This study was investigated the thermal properties of underfill with various epoxy resins using thermal analysis methods such as differential scanning calorimetry (DSC), thermo gravimetry analysis (TGA), dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). And, the adhesion strength of the underfills/FR-4 substrate was evaluated. The glass transition temperature (Tg) of underfill which was composed the cycolaliphatic epoxy resin was lower than that of underfill which was not composed the cycolaliphatic epoxy resin. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The coefficient of thermal expansion (CTE) of underfill which was composed the cycolaliphatic epoxy resin was higher than that of underfill which was not composed the cycolaliphatic epoxy resin. The excessive curing temperatures caused a weak boundary layer of epoxy resin, which resulted in a deterioration of mechanical properties in the epoxy resin and thus led to poor adhesion property between the underfill/FR-4 substrate.

• The Korean Journal of Food And Nutrition
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• v.23 no.2
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• pp.147-153
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• 2010

Sulgidduk samples containing 1, 2, and 4% Adenophora remotiflora powder and a control were examined for moisture content, gelatinization property, color, textural characteristics, and sensory qualities to determine the optimal ratio of Adenophora remotiflora powder in the formulation. The highest viscosity, lowest viscosity, final viscosity, setback and breakdown decreased as the contents of Adenophora remotiflora powder increased in the gelatinization property of flour blends of rice cake made with Adenophora remotiflora powder. The water content of rice cake with Adenophora remotiflora powder was 40.54~41.30% and there was no significant difference between samples with Adenophora remotiflora powder. L values indicating brightness were highest in the control group and all of the a values displayed green color indicating that they were negative. The b values were lowest in the control group and the values increased as the level of Adenophora remotiflora powder increased. Evaluation of the mechanical characteristics of rice cake with Adenophora remotiflora powder, hardness, cohesion, adhesion and chewiness were all higher in the control group and as its contents were rich, such properties were reduced. In addition, there was no significant difference between adhesion and chewiness. Adhesion and elasticity were low in the control group and as its contents were rich, such properties increased. The results of the sensory test revealed that the, control group containing 1% Adenophora remotiflora powder had the highest color, flavor, taste and overall preference.

• Composites Research
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• v.33 no.2
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• pp.55-60
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• 2020

A study on the heating behavior and adhesion property of structural epoxy adhesive through induction heating have been conducted. An adhesive for induction heating was manufactured through mixing with nano and micro sized Fe₃O₄. From the results, it was observed that induction heating is less affected by adherend (GFRP) thickness than oven heating. The heating rate of Fe₃O₄ embedded epoxy adhesive using induction heating much higher than that of oven curing process and it is more appreciable when the contents of Fe₃O₄ increased. Furthermore, adhesion strength increased with increase of Fe₃O₄ particle contents.

• Polymer(Korea)
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• v.35 no.4
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• pp.302-307
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• 2011

The parameters of silanol formation reaction of organosilane including solvent type, solution concentration, pH and hydrolysis time influence the adhesion property of 2 layer flexible copper clad laminate (FCCL). Especially, the hydrolysis reaction time of silane coupling agent affects the formation of the silanol groups and their self-condensation to generate oilgomeric structure to enhance the surface treatment as an adhesive promoter. In our study, we prepared the binary silane coupling agents to control hydrolysis reaction rate and surface energy after treatment of silane coupling agents for increasing the adhesive property between a copper layer and a polyimide layer. The surface morphology of rolled copper foil, as a function of the contents of the coated binary silane coupling agent, was fully characterized. As fabricated 2-layer FCCL, we observed that adhesive properties were changed by hydrolysis rate and surface energy.

• Applied Chemistry for Engineering
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• v.16 no.6
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• pp.827-833
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• 2005

This study focused on the establishment of optimum formulation of polyamide based hot melt adhesive through adhesive synthesis, study of physical property, and adhesion study. In the previous study, the optimum formulation of base resins (CM831, 843P) and tackifying resin (terpene resin) was determined. The weight ratio of CM831, 843P, and terpene resin was 75, 25, and 10, respectively. Based on the optimum formulation, the effect of wax and filler addition was examined in this study. According to the results, the maximum adhesion strength with the steel could be obtained by the addition of 5 wt% of polyethylene wax although the melt viscosity of adhesive decreased continuously with the addition of wax. In the case of filler, the optimum adhesion property could be achieved by the addition of 10 wt% of talc. However, the addition of filler caused little increase of melt viscosity of adhesive.

• Journal of Adhesion and Interface
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• v.18 no.1
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• pp.25-32
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• 2017

For application to display module junction process, the silk screen printing based on UV curable acrylic pressure sensitive adhesive(PSA) with silica nano-particles and the rheological properties were studied to investigate the effect on printability and adhesion. The monomers for PSA were based on 2-ethylhexyl acrylate(2-EHA) and acrylic acid(AA) 93:7, butyl acylate(BA), 2-hydroxyethyl acrylate(2-HEA) and tetrahydrofurfuryl acrylate(THFA) were added. Additionally, hydrophobic and hydrophilic nano-particles AEROSIL R974 and AEROSIL 200 were added, respectively. When the ratio of nano-particle was used above 4 or 7 phr, G' and ${\eta}^*$ were increased significantly. When the ratio of AEROSIL 200 was used above 7 phr, the penetration property was decreased during the silk screen printing. We found that the adhesion was decreased with increasing the nano-particle content, and it was decreased in the case of the hydrophilic nano-particle AEROSIL 200.

• Textile Coloration and Finishing
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• v.27 no.1
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• pp.18-26
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• 2015

para-aramid fibers were treated by atmosphere air plasma to improve the interfacial adhesion. The wettability of plasma-treated aramid fiber was observed by means of dynamic contact angle surface free energy measurement. Surface roughness were investigated with the help of scanning electron microscopy and atomic force microscopy. The tensile test of aramid fiber roving was carried out to determine the effect of plasma surface treatments on the mechanical properties of the fibers. A pull-out force test was carried out to observe the interfacial adhesion effect with matrix material. It was found that surface modification and a chemical component ratio of the aramid fibers improved wettability and adhesion characterization. After oxygen plasma, it was indicated that modified the surface roughness of aramid fiber increased mechanical interlocking between the fiber surface and vinylester resin. Consequently the oxygen plasma treatment is able to improve fiber-matrix adhesion through excited functional group and etching effect on fiber surface.