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Functional Improvement of Hot Melt Adhesive Using Polyamide Type Resin - (III) The Effect of Wax and Filler -  

Chung, Kyung-Ho (Department of Polymer Engineering, The University of Suwon)
Han, Kyung-A (Department of Polymer Engineering, The University of Suwon)
Cho, Wook-Sang (Department of Environmental Engineering, The University of Suwon)
Publication Information
Applied Chemistry for Engineering / v.16, no.6, 2005 , pp. 827-833 More about this Journal
Abstract
This study focused on the establishment of optimum formulation of polyamide based hot melt adhesive through adhesive synthesis, study of physical property, and adhesion study. In the previous study, the optimum formulation of base resins (CM831, 843P) and tackifying resin (terpene resin) was determined. The weight ratio of CM831, 843P, and terpene resin was 75, 25, and 10, respectively. Based on the optimum formulation, the effect of wax and filler addition was examined in this study. According to the results, the maximum adhesion strength with the steel could be obtained by the addition of 5 wt% of polyethylene wax although the melt viscosity of adhesive decreased continuously with the addition of wax. In the case of filler, the optimum adhesion property could be achieved by the addition of 10 wt% of talc. However, the addition of filler caused little increase of melt viscosity of adhesive.
Keywords
hot melt adhesive; polyamide; wax; filler;
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