• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.584-589
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• 2001

Diamond thin films were synthesized on WC-Co substrate by RF PACVD(radio frequency plasma-assisted chemical vapor deposition) technique with H$_2$-CH$_4$-O$_2$ gas mixture. WC-Co substrate was pre-treated in HNO$_3$solution, scratched with 3$\mu\textrm{m}$ diamond paste and exposed in the O$_2$ plasma before deposition. The diamond thin film prepared at 11% oxygen concentration showed the best quality of good adhesion and wear resistance at various oxygen concentration with the fixed 5% CH$_4$ concentration.

• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1791-1793
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• 1998

The thin film metal electrode for PDP needs low resistivity and strong adhesion. But the sputtered copper film is weak, in the adhesion between copper and glass. In this paper, we investigated the characteristics of resistivity and adhesion about Cu thin film using Ion Beam Assisted DC Planar Magnetron Sputtering(DCPM) Device.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2021.05a
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• pp.67-68
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• 2021

Social infrastructure facilities can be destroyed instantly when exposed to EMP (ElectroMagnetic Pulse), causing social chaos. However, concrete structures with low electrical conductivity cannot expect EMP shielding effect. Therefore, in this study, a metal sprayed thin film showing excellent EMP shielding performance was applied to a concrete structure to evaluate the metal spray welding efficiency and adhesion performance of the thin film according to the concrete surface treatment method. As a result according to the concrete surface treatment method, It was confirmed that the use of a roughening agent that generates physical irregularities in order to improve the welding efficiency and adhesion performance increases the physical performance of the concrete and metal sprayed thin film.

• Journal of Advanced Marine Engineering and Technology
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• v.29 no.1
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• pp.98-106
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• 2005

The chemical conversion film formed on magnesium alloy was investigated by using the colloidal silica with some parameters such as solution pH. temperature, solution conditions, and treatment time. Moreover. the solutions consisted of colloidal silica titanium sulfate, and cobalt ions were used for the colloidal silica film to having a good corrosion resistance and adhesion properties. It was thought that the film at 298K was made with combination of Si-O. The quantity of film formed at high temperature such as 333K and 353K is smaller than dissolved quantity during chemical conversion treatment. Adding $CoSO_4$ to the colloidal silica solution enhanced the adhesion force between the silica film and magnesium substrate, The optimum conditions for the chemical conversion treatment solution were PH 2.90 s treatment, and 298K.

• Journal of the Korean institute of surface engineering
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• v.28 no.2
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• pp.77-82
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• 1995

In this study, we examined the relationships between the coating film's properties, such as microhardness, adhesion of coating fil $m_strate, and machining tool's life time. Samples were prepared by coating TiN on the 5.5 diameter twist drills using reactive ion plating technology, For measuring microhardness and adhesion of fil $m_strate, HSS plate was used for substrate. TiN coated drill's life time was dependent on the adhesion of fil $m_strate and averagely increased by several ten times more than uncoated drill's. The major parameter affecting TiN coated drill's life time was the strong adhesion between coating film and substrate.ate.

• Journal of the Korean institute of surface engineering
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• v.28 no.5
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• pp.267-275
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• 1995

Electron beam can provide convenient way to heat the substrate during Hollow Cathode Discharge (HCD) ion plating of Ti(C, N)films. Densification of columnar structrue is enhanced by longer duration of electron beam heating(EBH). While strong(111) texture is identified always to be formed, the amount of (200) oriented grains which coherently interfaced with carbide particles of the substrate increased with heating(EBH). In turns, these crystallogaphical change lead to the increase of micro hardness and adhesion of coating. Adhesion of Ti(C, N) films increased more dramatically in case of ASP30 substrate of which carbide particles dispersed more finely than M42. Therefore, it could be concluded that both the density of film and interfacial structure can affect the adhesion property. Overheating of substrate could be resulted in low adhesion resistance due to high residual stress developed in the film.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.63-70
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• 2011

Anorthite forming glass frits in amounts up to 25 vol% of the silver powder were added to improve the adhesion between the conductor pattern formed by thick film photoimageable process and the low temperature co-fired ceramics (LTCC) substrate. The sheet resistance of the conductor pattern was raised from 0.13 ${\Omega}/{\square}$ to 2.25 ${\Omega}/{\square}$ as the volume percentage of glass frit increased up to 25 vol%. The adhesion strength was improved with this glass frit increase, but it decreased when the glass content exceeded 20 vol% which are possibly attributed to the liquid pool effect and the reduced fracture toughness in the interface between conductor and LTCC layer. The shrinkage of the width of the conductor pattern decreased with the addition of glass contents.

• Bulletin of the Korean Chemical Society
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• v.28 no.2
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• pp.188-192
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• 2007

In this work, the effects of chemical treatment of polyimide films were studied by FT-IR, X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and contact angles. The adhesion characteristics of the films were also investigated in the peel strengths of polyimide/aluminum films. The increases of surface functional groups of KOH-treated polyimide films were greatly correlated with the polar component of surface free energy. The peel strength of polyimides to metal substrate was also greatly enhanced by increasing the KOH treatment time, which can be attributed to the formation of polar functional groups on the polyimide surfaces, resulting in enhancement of the work of adhesion between polymer film and metal plate.

• Journal of the Korean institute of surface engineering
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• v.42 no.1
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• pp.21-25
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• 2009

Using an evaporation system, $SiO_2$ was deposited as a buffer layer between a PET substrate and a ITO layer and then ITO/$SiO_2$/PET layers were annealed for 1.5 hours at the temperature of $180^{\circ}C$. Adhesion and electro-optical properties of ITO films were studied with thickness variance of a $SiO_2$ buffer layer. As a result of introduction of the $SiO_2$ buffer layer, sheet resistance and resistivity increased and a ITO film with optimum sheet resistance ($529.3{\Omega}/square$) for an upper ITO film of resistive type touch panel could be obtained when $SiO_2$ of $50{\AA}$ was deposited. And it was found that ITO films with $SiO_2$ buffer layer have higher transmittance of $88{\sim}90%$ at 550 nm wavelength than ITO films with no buffer layers and the transmittance was enhanced as $SiO_2$ thickness increased from $50{\AA}$ to $100{\AA}$. Adhesion property of ITO films with $SiO_2$ buffer layers became better than ITO films with no buffer layers and this property was independent of $SiO_2$ thickness variance ($50{\sim}100{\AA}$). By depositing a $SiO_2$ buffer layer of $50{\AA}$ on the PET substrate and sputtering a ITO thin film on the layer, a ITO film with enhanced adhesion, electro-optical properties could be obtained.

• Journal of Adhesion and Interface
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• v.24 no.2
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• pp.54-59
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• 2023

Silver nanowire-based transparent electrodes are very attractive as a next-generation flexible and transparent electrode that can replace ITO-based flexible electrodes because they have excellent conductivity, transmittance and mechanical flexibility. However, weak understanding of the silver nanowire solution for the fabrication of silver nanowire-based transparent electrodes often cause abnormal operation of the electrical device or peeling problem of the electrode films when applied to electronic devices. Here, we studied a Hydroxypropyl Methylcellulose (HPMC) adhesion promoter, which is one of the additives for silver nanowire solution, to improve the understanding of silver nanowire solution. In detail, it is characterized how the HPMC changes the properties of silver nanowire solution and silver nanowire film, which is fabricated with silver nanowire solution including the HPMC adhesion promoter. As the characteristics of solution, polar surface tension and dispersive surface tension were measured. As the film characteristics, surface energy, surface morphology, silver nanowire density, and sheet resistance were analyzed.