• 한국표면공학회지
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• 제32권6호
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• 한국표면공학회지
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• 제27권5호
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• pp.261-272
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• 1994

Both Cu-Cr and Cu-Ti alloy films with different composition were prepared by dc magnetron sputtering onto polyimide substrate and their adhesion and microstructure were observed. In addition, the effect of heat treatment at $400^{\circ}C$ for 2 hours on the variation of adhesion properties and on the changess of microstructure were investigated. Cu-Cr alloy films have crystalline structure of either for or bcc phase depending on the composition of the film. However, the Cu-Ti alloy film forms fcc phase at low Ti concentration while it forms an amorphous phase as the Ti concentration in the films is increased to more than 25at.%. TEM analysis reveal that the microstructure of Cu-Cr and Cu-Ti films forms an open structure with vacant spaces. The adhesion between Cu-Cr, Cu-Ti alloy films and polyimide substrate is relatively good before the heat treatment, but is noticeably reduced after the heat treatment. In particular, the adhesion strength is significantly reduced in the Cu-Ti alloy films after the heat treatment. The reduction of adhesion strength after the heat treatment is identified to relate with the formation of oxide phases at the metal/polyimide interface by AES(Auger Electron Spectroscopy).

• 한국진공학회지
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• 제8권4B호
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• pp.514-518
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• 1999

Gold (Au) is not supposed to react with sapphire(single crystalline ) under thermodynamic equillibrium, therefore, a strong adhesion between these two dissimilar materials is not expected. However, pull test showed that the gold film sputter-deposited onto annealed and pre-sputtered sapphire exhibited very strong adhesion even without post-deposition annealing. Strongly and weakly adhered samples as a result of the pull testing were selected to investigate the adhesion mechanisms with Auger electron spectroscopy. The Au/ interfaces were analyzed using a new technique that probes the interface on the film using Auger electron escape depth. It revealed that one or two monolayers of Au-Al-O compound formed at the Au/Sapphire interface when AES in the UHV chamber. It showed that metallic aluminum was detected on the surface of sapphire substrates after irradiating for 3 min. with 7keV Ar+ -ions. These results agree with TRIM calculations that yield preferential ion-beam etching. It is concluded that the formation of Au-Al-O compound, which is responsible for the strong metal-ceramic bonding, is due to ion-induced cleaning and reduction of the sapphire surface, and the kinetic energy of depositing gold atoms, molecules, and micro-particles as a driving force for the inter-facial reaction.

• 한국재료학회지
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• 제17권4호
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

• 방사선산업학회지
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• 제4권4호
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• pp.335-339
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• 2010

In this study, the surface of polyimide (PI) films was modified using ion implantation to enhance its adhesion to a deposited copper (Cu) layer. The surfaces of the PI films were implanted with 150 keV $Xe^+$ ions at fluences varying from $1{\times}10^{14}$ to $1{\time}10^{16}ions\;cm^{-2}$. The Cu layers were then deposited on the implanted PI. The surface properties of the implanted PI film were investigated based on the contact angle measurements, Fourier transform infrared spectroscopy (FT-IR), X-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). Furthermore, the adhesive strength between the deposited Cu layer and PI film was estimated through a scratch test using a nanoindenter. As a result, the surface environment of the PI film was changed by the ion implantation, which could have a significant effect on the adhesion between the deposited Cu layer and the PI.

• 한국표면공학회지
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• 제26권3호
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• pp.109-114
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• 1993

Black magnetite film could be formed on Invar steel for shadows mask by iron electroplating in thickness of 0.46~0.63$\mu\textrm{m}$ on Invar steel and subsequent oxidation of iron by immersion in strongly alkaline soution for 30~60 minutes. blackness degreed of magnetite oxide film on Invar was C20BL90 in comparision of color chart of Dainippon Ink & Chemicals Inc. Co. and adhesion test showed excellent adhesion of oxide film on substrate. Magnetite oxide film grew up on iron in hot strongly alkaline solution according to 'Sato-Cohen' oxide film growth model.

• 한국진공학회지
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• 제4권S2호
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• pp.8-19
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• 1995

Ion beam enhanced deopsition(IBED) was adopted to synthesize biocompatible titanium oxide film. Structure characteristics of titanium oxide film were investigated by RBS, AES and XRD. The blood compatibility of the titanium oxide film was studied by measurements of blood clotting time and platelet adhesion. The results show that the anticoagulation property of titanium oxide film is improved significantly. The mechanism of anticoagulation of the titanium oxide film was discussed.

• 마이크로전자및패키징학회지
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• 제6권1호
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• pp.31-37
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• 1999

본 연구에서는 집적회로의 배선공정에 적용될 무전해도금된 Cu박막의 열적 특성과 접착특성에 대하여 고찰하였다. 시편은 Si 기판에 MOCVD법으로 TaN 확산방지막을 증착시킨 후 그 위에 무전해도금법으로 Cu 막을 증착시켜 Cu/TaN/Si 구조의 다층박막을 제조하였다. 이렇게 제조된 Cu/TaN/Si 시편을 수소와 Ar 분위기에서 각각 열처리시킨 후 열처리온도에 따른 비저항을 측정함으로써 Cu박막의 열적 안정성을 분석하였다. Cu박막과 TaN확산방지막과의 접착특성을 분석하기 위하여 scratch test를 사용하였으며, TaN 확산방지막에 대한 무전해도금된 Cu배선막의 접착력은 일반적인 Thermal evaporation과 Sputturing 방법으로 증착된 Cu 박막의 경우와 비교함으로써 평가되었다. TaN 박막에 대한 Cu박막의 접착성을 평가하기 위해 scratch test를 행한 결과 무전해도금된 Cu박막의 경우 다른 방법으로 증착된 Cu 박막과 비슷한 접착특성을 나타내었으며, acoustic emission분석과 microscope 관찰 결과 sputtering이나 evaporation 방법으로 증착된 Cu박막 보다 무전해도금된 Cu박막이 상대 적으로 우수한 접착력을 나타내었다.

• 한국결정성장학회지
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• 제20권4호
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• pp.168-172
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• 2010

양전하를 갖는 poly(allylamine hydrochloride)(PAH)와 음전하를 갖는 poly(acrylic acid)(PAA) 전해질 폴리머를 사용하여 layer-by-layer(LBL) self-assembly 방법에 의해 초친수 특성을 갖는 박막을 제조하였다. PAH/PAA 박막의 밀착강도를 증가시키기 위하여 glutaraldehyde(GA) 수용액을 이용하여 amine-aldehyde의 화학반응에 따른 박막의 표면구조 변화, 막두께, 투과율, 접촉각, 밀착강도 특성을 측정하였다. PAH와 PAA 용액 침적 사이에 기판을 GA 수용액에 침적함으로써 박막의 두께는 감소하였지만 밀착강도는 2배 이상 증가하였다. 밀착강도의 증가는 PAH 와 GA의 amine-aldehyde의 화학반응에 의한 결과라는 것을 fourier transform infrared(FT-IR) spectroscopy를 사용하여 확인하였다. 제조된 PAH/PAA and PAH/GA/PAA 박막은 물 접촉각 $5^{\circ}$이하의 초친수 박막 특성을 보여주었고, 550 nm 파장에서 91.3% 이상의 높은 투과율을 나타내었다.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2001년도 제34회 추계학술대회 개최
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• pp.35-42
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• 2001

Nanotribological characteristics between a Si$_3$N$_4$ AFM tip and hydrophobic thin films were experimentally studied. Tests were performed to measure the nano adhesion and friction in both AFM(atomic force microscope) and LFM(lateral force microscope) modes in various ranges of normal load. Plasma-modified thin polymeric films were deposited on Si-wafer (100). Results showed that wetting angle of plasma-modified thin polymeric film increased with the treating time, which resulted in the hydrophobic surface and the decrease of adhesion and friction. Nanotribological characteristics of these surfaces were compared with those of other hydrophobic surfaces, such as DLC, OTS and IBAD-Ag coated surfaces. Those of OTS coated surface was superior to those of others, though wetting angle of plasma-modified thin polymeric film is higher.