• The Korean Journal of Ceramics
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• 제3권2호
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• pp.73-81
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• 1997

In this paper, it is intended to present more reproducible and quantitative method for adhesion assemssement. In scratch test, micromechanical analysis on the stress state beneath the indenter was carried out considering the additional blister field. The interface adhesion was quantified as work of adhesion through Griffith energy approach on the basis of the analyzed stress state. The work of adhesion for DLC film/WC-Co substrate calculated through the proposed analysis shows the identical value regardless of distinctly different critical loads measured with the change of film thickness and scratching speed. On the other hand, uniaxial loading was imposed on DCL film/Al substrate, developing the transverse film cracks perpendicular to loading direction. Since this film cracking behavior depends on the relative magnitude of adhesion strength to film fracture strength, the quantification of adhesion strength was given a trial through the micromechanical analysis of adhesion-dependence of film cracking patterns. The interface shear strength can be quantified from the measurement of strain $\varepsilon$s and crack spacing $\lambda$ at the cessation of film cracking.

• 접착 및 계면
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• 제4권3호
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• pp.1-8
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• 2003

철판에 도금한 아연을 구리이온으로 치환하는 치환도금법과 철판에 직접 구리를 증착하는 진공증착법으로 두께가 다른 구리박막 피복철판을 제조하여 배합고무와 접착성질을 조사하였다. 구리박막 피복철판과 배합고무의 접착세기는 제조방법에 관계없이 구리박막 두께에 따라 결정되었다. 구리박막이 75 nm보다 얇으면 안정한 접착층이 형성되어 황동판에 못지 않게 고무와 강하게 접착되었으나, 90 nm보다 두터우면 구리황화물이 지나치게 성정하여 접착세기가 약하였다.

• 한국표면공학회지
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• 제43권3호
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• pp.127-131
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• 2010

Adhesion of DLC film is very significant property that exhibits wear resistance, chemical inertness and high hardness when being deposited to metal substrate. This study was considered that change adhesion of DLC film produced by Plasma Enhanced Chemical Vapor Deposition can be presented through inserting interlayer (Cr, Si-C:H). The thickness of interlayer was result of changing adhesion and residual stress. It was showed that the maximum 12 N of adhesion is on DLC film of Cr interlayer, and that a tendency is to be increased residual stress depend on the thickness. DLC film of Si-C:H interlayer represented 16 N of adhesion at $1{\mu}m$, whereas adhesion is decreased when the thickness is increased. For the interlayer at multi-layer, it was the best that adhesion of Cr/Si-C:H/DLC film was 33 N. Si-C:H interlayer at DLC film controled adhesion of the whole film. It was relaxed the internal stress of DLC film produced by inserting Cr, Si-C:H interlayer.

• 한국표면공학회지
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• 제54권6호
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• pp.307-314
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• 2021

Diamond-like carbon (DLC) is difficult to achieve sufficient adhesion because of weak bonding between DLC film and the substrate. The purpose of this study is to improve the adhesion between substrate and DLC film. DLC film was deposited on AISI H13 using linear ion source. To improve adhesion, the substrate was treated by dual post plasma nitriding. In order to define the mechanism of the improvement in adhesive strength, the gradient layer between substrate and DLC film was analyzed by Glow Discharge Spectrometer (GDS) and Scanning Electron Microscope (SEM). The microstructure of the DLC film was analyzed using a micro Raman spectrometer. Mechanical properties were measured by nano-indentation, micro vickers hardness tester and tribology tester. The characteristic of adhesion was observed by scratch test. The adhesion of the DLC film was enhanced by active screen plasma nitriding layer.

• 열처리공학회지
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• 제3권1호
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• pp.17-24
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• 1990

In this study, TiN film was deposited onto steel by R.F.-PACVD in order to investigate the influence of parameters on the adhesion strength between film and substrate. Experimental results showed that adhesion strength by SAT is different from by optical microscopy. Adhesion strength is increased when the deposition temperature increases and is influenced by R.F. power and electrode distance. Especially heat treatment on the substrate has influenced over the adhesion strength, so it showed the 22 Newtons in adhesion strength by SAT and adhesion strength is decreased when deposition thickeness is thick and hardness is high. Also if the film is thick and high hardness simultaneous, the film was delaminated seriously.

• 비파괴검사학회지
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• 제29권6호
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• pp.534-549
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• 2009

As the thin film technology has emerged in various fields, adhesion of the film interface becomes an important issue in terms of the longevity and durability of thin film devices. Diverse nondestructive methods utilizing acoustic techniques have been developed to assess the interfacial integrity. As an effective technique based on the ultrasonic wave focusing and the surface acoustic wave(SAW) generation, scanning acoustic microscopy(SAM) has been investigated for adhesion evaluation. Visualization of film microstructures and quantification of adhesion weakness levels by SAW dispersion are the recent achievements of SAM. To overcome the limitations in the theoretical dispersion model only suitable for perfectly elastic and isotropic materials, a new model has been more recently developed in consideration of film anisotropy and viscoelasticity and applied to the adhesion evaluation of polymeric films fabricated on semiconductive wafers.

• The Korean Journal of Ceramics
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• 제3권2호
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• pp.105-109
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• 1997

The effects of surface conditions of the C-2 cemented carbide substrate on the adhesion of diamond film were investigated. The substrates were pretreated for different times with Murakami's reagent and then the acid solution of an H2SO4-H2O2. The adhesion strength was estimated by a peeling area around the Rockwell-A indentation. The cutting performance of the diamond-coated tools was evaluated by measuring flank wears in dry turning of Al-17% Si alloy. The morphology of deposited diamond crystallites was dominated by (111) and (220) surfaces with a cubooctahedral shape. The diamond film quality was hardly affected by the surface conditions of the substrate. The variation of tool life with longer substrate etching times resulted from a compromies between the increase of film adhesion at the interface and the decrease of toughness at the substrate surface. The coated tools were mainly deteriorated by chipping and flaking of the diamond film form a lock of adhesion strength, differently from the wear phenomena of PCD tools.

• 접착 및 계면
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• 제3권4호
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• pp.37-43
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• 2002

표면 개질 또는 박막 공정을 위하여 많은 박막 증착 기술들이 지속적으로 개발, 발전되어 왔다. 그러나, 증착된 박막의 접착성이 불량하여 사용 도중에 기판으로부터 분리된다면 아무리 좋은 성질을 가진 박막일지라 할지라도 제대로 사용될 수 없을 것이다. 이처럼 박막의 접착성은 박막의 기능 못지않게 매우 중요하다. 본 원고에서는 계면 구조와 박막의 접착력 사이의 관계와 박막의 접착력에 영향을 주는 인자들을 살펴보았다. 박막의 접착력에 영향을 주는 인자들에는 박막 및 기판의 화학 조성 및 구조, 박막과 기판의 반응성, 기판의 표면 거칠기, 박막의 잔류 응력 등과 같은 내부 인자와 하중, 온도, 습도, 부식환경 등의 외부 인자가 있는데, 이들을 어떻게 조절하여 박막의 접착력을 향상 또는 유지시키는 방법을 알아보았다.

• Tribology and Lubricants
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• 제25권2호
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• pp.86-95
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• 2009

Adhesion tests were carried out in order to investigate the effect of temperature on the adhesion behavior between a PMMA film and a fused silica lens in the micro scale. For the tests, a microtribometer system was specially designed and constructed. The pull-off forces on the PMMA film were measured under atmospheric condition as the temperature of the PMMA film was increased from 300 K to 443 K and decreased to 300 K. The contact area between the PMMA film and the lens was observed during the test. The adhesion behavior was changed with the change of the PMMA surface state as the temperature increased. In glassy state below 363 K, the pull-off force did not change with the increase of temperature. In rubbery state from 383 K to 413 K, the pull-off force increased greatly as the temperature increased. In addition, the area of contact was enlarged. In viscous state above 423 K, the fingering instability was observed in the area of contact when the PMMA film contacted with the lens. It was also found that the adhesion behavior can be varied with the thermal history of the PMMA film. The residual solvent in the PMMA film could emerge to the PMMA surface due to the heating and reduced the pull-off force.

• 한국의류학회지
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• 제27권7호
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• pp.843-850
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• 2003

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless plated Cu layer and polyester (PET) film, the effect of pretreatment conditions such as etching method, mixed catalyst composition were investigated. Chemical etching and plasma treatment increased surface roughness in decreasing order of Ar＞HCl＞O$_2$＞NH$_3$. However, adhesion of Cu layer on PET film increased in the following order: $O_2$＜Ar＜HCl＜NH$_3$. It indicated that appropriate surface roughness and introduction of affinitive functional group with Pd were key factors of improving adhesion of Cu layer. PET film was more finely etched by HCI tolution, resulting in an improvement in adhesion between Cu layer and PET film. Plasma treatment with NH$_3$produced nitrogen atoms on PET film, which enhances chemisorption of Pd$^{2+}$ on PET film, resulting in improved adhesion and shielding effectiveness of Cu layer deposited on the Pd catalyzed surface. Surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$; SnCl$_2$from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, adhesion and shielding effectiveness of Cu plated PET film were increased.d.