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Recent Advances in Scanning Acoustic Microscopy for Adhesion Evaluation of Thin Films  

Ju, Hyeong-Sick (Graduate Program in Acoustics, The Pennsylvania State University)
Tittmann, Bernhard R. (Department of Engineering Science and Mechanics, The Pennsylvania State University)
Publication Information
Journal of the Korean Society for Nondestructive Testing / v.29, no.6, 2009 , pp. 534-549 More about this Journal
Abstract
As the thin film technology has emerged in various fields, adhesion of the film interface becomes an important issue in terms of the longevity and durability of thin film devices. Diverse nondestructive methods utilizing acoustic techniques have been developed to assess the interfacial integrity. As an effective technique based on the ultrasonic wave focusing and the surface acoustic wave(SAW) generation, scanning acoustic microscopy(SAM) has been investigated for adhesion evaluation. Visualization of film microstructures and quantification of adhesion weakness levels by SAW dispersion are the recent achievements of SAM. To overcome the limitations in the theoretical dispersion model only suitable for perfectly elastic and isotropic materials, a new model has been more recently developed in consideration of film anisotropy and viscoelasticity and applied to the adhesion evaluation of polymeric films fabricated on semiconductive wafers.
Keywords
Scanning Acoustic Microscopy; Thin Film Adhesion; Surface Acoustic Wave; Dispersion;
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