• 접착 및 계면
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• 제24권3호
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• pp.86-94
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• 2023

OLED 소자를 용액공정으로 제작함에 있어 음극 전극의 용액공정화가 기술적인 난제이므로 별도의 기판에 음극 전극을 형성하고 PEI 층을 접합층으로 사용하여 이를 다른 기판의 소자와 물리적, 전기적으로 연결하는 연구를 진행하였다. PEI 용액의 농도, PEI 층의 두께 및 첨가제 혼합 등을 변수로 하였으며 접착력 측정기와 EOD 소자 제작을 통하여 특성을 확인한 결과는 다음과 같다. PEI 용액의 농도가 높을수록 접착강도가 증가하였으나 막 두께의 증가로 전류 밀도가 감소하였다. 0.1 wt% PEI 용액에 첨가제로서 조비톨과 PEG를 혼합한 결과 PEG를 0.5 wt%의 농도로 혼합한 조건에서 900 mA/cm² 의 최대 전류 밀도를 얻었으며 양호한 접착 상태와 소자의 점등도 확인되었다.

• 폴리머
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• 제24권4호
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• pp.513-519
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• 2000

핫 멜트 접착제의 점착제로 사용되고 있는 석유수지를 비 결정성 올레핀 수지에 블렌딩하였을 때 점착제가 비 결정성 올레핀 수지의 열적 특성 및 결정화거동에 미치는 영향과 이에 따른 접착특성 변화에 대하여 살펴보았다. 점착제로 사용된 석유수지는 비 결정성 올레핀 수지의 용융온도를 저하시키고 이러한 현상은 에틸렌 함량이 상대적으로 많은 비 결정성 올레핀 수지에서 두드러지며, aromatic 수지인 $C_{9}$ 석유수지보다는 aliphatic 수지인 $C_{5}$ 석유수지를 사용할 때 그 감소의 폭이 큼을 알 수 있었다. 아울러 석유수지의 블렌딩에 의하여, 특히 aromatic 수지인 $C_{9}$을 첨가하였을 경우, 비 결정성 수지의 에틸렌 함량이 적을수록 결정화도가 현저히 감소함을 확인할 수 있었다. 점착제의 조성비가 50% 정도에서 가장 우수한 접착력을 확인할 수 있었으며, 에틸렌 함량에 관계없이 $C_{5}$ 석유수지의 첨가시 접착력이 현저히 향상됨을 알 수 있었다. 에틸렌 함량이 적은 비결정성 올레핀/석유수지 핫 멜트에서는 점착제로 인하여 발현된 결정화도 감소에 의하여 접착특성이 증가됨을 알 수 있었다.

• 한국염색가공학회지
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• 제30권2호
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• pp.107-116
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• 2018

Simplification of the manufacturing process in shoe making is essential to improve productivity and reduce production costs. To improve the adhesion of EVA foam used as a midsole, EVA/itaconated EPDM(EPDM-g-IA)(80/20wt%) blend was prepared using Torque Rheometer-Plasti-Corder, and 1,6-hexamethylenediamine/crosslinking agent/foaming agent/additive were mixed, followed by amidation reaction and foaming to prepare EVA/EPDM-g-IA foam for shoe midsole. In this study, we investigate the effect of the content of 1,6-hexamethylenediamine(0, 0.5, 1.0, 2.0, 3.0) on the mechanical properties, water-contact angle and adhesion of EVA/itaconated EPDM foam. As the content of 1,6-hexamethylenediamine increased, mechanical properties such as tensile strength, tear strength, tensile elastic modulus, hardness, and water-contact angle were lowered, but elongation at break and compression set(%) were increased. Both normal type and non-UV type adhesive strength increased with increasing diamine content. In particular, it was found that the adhesion strength of the non-UV type adhesion increased sharply with increasing diamine content. As a result, an adherend rupture occurs in a foam sample having a content of 1,6-hexamethylenediamine of 3phr. From this, it can be seen that the EVA/itaconated EPDM foam for shoe midsoles, which can be used for non-UV adhesion without primer and UV treatments, have been developed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.232-235
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• 2002

Recently developed liquid silicone rubber (LSR) can be cured by platinum catalyzed additional hydrosilylation mechanism and has the advantage of no byproduct compared to traditional millable peroxide curing silicone rubber. We investigated the characteristics of dielectric breakdown of silicone rubber and adhesion properties between semi-conductive LSR and insulating LSR for high voltage application of pre-molded joint (PMJ). In order to understand the dielectric breakdown characteristics, we used the sheet samples and the paired type rogowski insert electrode system. The breakdown strength and adhesion strength of LSR (E-3) were superior to those of several silicone rubbers. Adhesion strength could be improved by curing at high temperature without post-curing process or enhanced by post-curing process. When LSR (E-3) was cured at $(150^{\circ}C{\times}10min$ semi-conductive )${\times}$ ($175^{\circ}C{\times}10min$ insulation), it showed the high breakdown strength with low standard deviation, and good adhesion strength. In this results, we could apply this process to the fabrication of PMJ without post-curing.

• 한국재료학회지
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• 제9권10호
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• pp.992-999
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• 1999

본래 약한 구리계 리드프레임/EMC(Epoxy Molding Compound) 계면의 접착력은 솔더 리플로우 (solder reflow) 공정 중에 종종 박형 플라스틱 패키지의 팝콘 균열 현상(popcorn-cracking phenomena)을 일으킨다. 본 연구에서는 리드프레임/EMC 계면의 접착력을 향상시키기 위하여 리드프레임을 알칼리 용액에 담궈 표면에 brown oxide를 형성시켰으며, EMC로 몰딩(molding)하여 SDCB(Sandwiched Double Cantilever Beam) 시편 및 SBN(Sandwiched Brazil-Nut) 시편을 준비하여 접착력을 측정하였다. 리드프레임의 brown oxide 처리는 미세한 바늘모양의 CuO 결정들을 리드프레임 표면에서 형성시켰으며, 리드프레임/EMC 계면의 접착력을 향상시켰다. 접착력의 향상은 산화층의 평균두께와 직접적인 관련이 있었다. 이는 미세한 바늘모양의 CuO 결정들이 EMC와 기계적인 고착(mechanical interlocking)을 하기 때문으로 생각된다.

• 접착 및 계면
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• 제2권4호
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• pp.32-38
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• 2001

본 실험에서는 공가류와 내오존성을 동시에 만족하는 고무 조성비의 영향에 대하여 검토하였다. 사용한 시편은 NR, SBR, BR, IIR 및 EPDM을 다양한 비율로 블렌딩 한 고무 조성물(시편 A), NR/BR/SBR로 구성된 불포화 고무 조성물(시편B)와 NR/IIR/EPDM로 구성된 포화 고무 조성물(시편C)이다. 시편A와 시편B, 시편A와 시편C를 각각 공가류시켜 PAD 접착 시편을 제작하여 박리강도를 측정하였다. 또한 시편A에 대해서 내오존성을 평가하였다. 시편 A의 불포화 고무 조성중(NR/BR Blend)에 BR보다 NR의 비율이 높을수록 시편B와 시편C와의 접착 강도가 높았고, 또다른 불포화 고무 조성(NR/SBR)에서는 NR보다 SBR 함량이 높을수록 접착 강도는 높았다. 또한 시편A의 조성중에서 NR/BR/IIR/EPDM 조성물 보다 NR/SBR/IIR/EPDM 조성물이 접착성이 우수하였다. 고무 조성중 불포화 고무가 많을수록 접착 강도는 우수하였으나, 내오존성은 다소 열세였다. 불포화 고무와 포화 고무의 비율이 60/40 정도 일 때 접착 강도와 내오존성이 모두 양호하였다.

• 한국재료학회지
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• 제15권7호
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• pp.458-464
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• 열처리공학회지
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• 제13권2호
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• pp.71-84
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• 2000

A study on adhesion and wear resistance of VC(vanadium carbide) coating on die steels, STD11 and STD61, has been carried out. The VC coating on the die steels was made by immersing them in molten borax bath, a kind of TRD(thermo-reactive deposition and diffusion). Adhesion strength and wear resistance were investigated using scratch test, indentation test and plate-disc test(Ogoshi type) respectively. The influence of sliding distance on the amount of wear has been determined and dominant wear mechanisms has been characterized using optical microscopy, scanning electron microscopy and EDS spectroscopy. The critical adhesion strength($L_c$) between VC coating layer and substrate(STD11) was increased to 60N($L_c$) in the scratch test. In the case of STD61, the strength increased to 24N. The wear resistance of VC coated die steels was excellent because the diffusion layer formed just below the coating layer. The dominant wear mechanism was identified as adhesive wear for VC coating die steels which were worn by combination of cracking and plucking of VC fragments and disc.

• 한국재료학회지
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• 제17권2호
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• pp.61-67
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• 2007

The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.

• 한국표면공학회지
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• 제29권5호
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.