• 한국표면공학회지
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• 제32권6호
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• 한국진공학회지
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• 제6권S1호
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• pp.122-126
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• 1997

the Cu/polyimide system is known to be the best candidate for a multilevel interconnection system due to the low resistance of Cu and to the low dielectric constant of polyimide respectively. Ion beam mixing of Cu(40nm)/polyimide was carried out at room temperature with 80 keV Ar+ and N2+ form $1.5\times$1015 to 15$\times$1015 ions/cm2. The quantitative adhesion strength was measured by a standard scratch test. X-ray photoelectron spectroscopy and x-ray emission spectrocopy are employed to investigate the chemical bonds and the interlayer compound formation of the films Cu/Al/polyimide showed more adhesion strength than Cu/polyimide after ion beam mixing and N2+ ions are more effective in the adhesion enhancement than Ar+ with the same sample geometry. The XES results shows the formation of interlayer compound of CuAl2O4 which can reflect more adhesive Cu/Al/polyimide which has not been reported previously. The latter results is understood by the fact that N2+ ions produce more pyridinelike moiety, amide group and tertiary amine moiety whcih are known as adhesion promotors.

• 한국표면공학회지
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• 제32권4호
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• pp.531-537
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• 1999

A copper based leadframe was oxidized in brown-oxide forming solution, then the growth characteristics of brown oxide and the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) were studied by using sandwiched double cantilever beam (SDCB) specimens. The brown oxide is composed of fine acicular CuO, and its thickness increased up to ~150 nm within 2 minutes and saturated. Bare leadframe showed alomost no adhesion to EMC, while once the brown-oxide layer formed on the Surface of leadframe, the adhesion strength increased up to ~80 J/$\m^2$ within 2 minutes. Correlation between oxide thickness, $\delta$ and the adhesion strength in terms of interfacial fracture toughness, $G_{c}$ was linear. Considering the above results, we might conclude that the main adhesion mechanism of brown-oxide treated leadframe to EMC is mechanical interlocking, in which fine acicular CuO plays a major role.e.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2023년도 가을학술발표대회논문집
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• pp.211-212
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• 2023

Polishing tiles among porcelain tiles are more durable and aesthetic than ceramic tiles, so their demand has recently increased. In particular, since polishing tiles have a very low absorption rate, organic adhesives with chemical bonds are mainly used. However, organic adhesives have low economic efficiency and some volatile organic compounds (TVOCs). Therefore purpose of this study was to evaluate the performance of polishing tile adhesion by developing organic-inorganic adhesives, which have chemical bonds and mechanical bonds. As a result, since the amorphous chain and chemical bonds of the polymer in the tile adhesives, both tensile and shear adhesion strength were satisfied with the KS L 1592, KS L 1593, and the rate of length change itself in the thermal cycling was lower than organic adhesives. So it is thought that it is possible to replace some organic adhesives.

• 접착 및 계면
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• 제9권3호
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• pp.27-33
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• 2008

무기계 킬레이트의 일종인 aluminum acetylacetonate (AlACA)를 점착제의 -COOH 당량비에 따라 0, 0.25, 0.5, 0.75, 1의 비율로 변화 시키고, 점착제는 acrylic acid의 함량을 3 wt%, 7 wt%, 10 wt%으로 변화를 시켜 그에 따른 경화거동을 살펴 보았다. 킬레이트의 함량이 증가하면서 가교 구조가 형성되고, 이에 따라 probe tack의 fibrillation이 줄어들고, peel strength도 줄어드는 경향을 보였다. SAFT의 경우 점착제의 acrylic acid 함량이 증가함에 따라 확연히 증가하였다. 본 연구 결과, aluminum acetylacetonate는 점착물성을 크게 변화시키지 않는 범위에서 점착제를 가교 시킬 수 있음을 확인하였다.

• 접착 및 계면
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• 제19권4호
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• pp.145-153
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• 2018

본 연구에서는 상용성이 개선된 접착 증진제를 개발하기 위해 malenized polybutadiene과 2-hydroxyethyl acrylate(HEA)의 반응을 통해 다양한 함량의 아크릴레이트 반응기와 carboxylic acid가 도입된 접착 증진제(PBCA)를 합성하였다. 합성된 접착 증진제는 maleic anhydride의 개환 반응을 통해 도입된 아크릴레이트 반응기와 carboxylic acid의 함량, 그리고 접착 증진제의 첨가량을 달리하여 접착 필름을 제조하고 제조된 접착 필름의 표면 특성, 접착력 등의 기계적 특성과 흡습 특성 등의 변화를 확인하였다. 접착 증진제의 분자 내에 도입된 carboxylic acid의 함량이 증가할수록 접착 필름의 접착력은 증가하는 경향을 보였으며, 기존의 상용화된 접착 증진제와 비교하여 기계적 물성 또한 개선됨을 확인하였다. 특히, 분자 내에 소수성의 폴리부타디엔 주쇄와 친수성의 maleic anhydride 및 carboxylic acid가 동시에 존재함으로 인해 다양한 친수성 및 소수성 재료와의 상용성이 대폭 개선되었음을 확인하였다.

• 대한기계학회논문집A
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• 제33권6호
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• pp.560-567
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• 2009

This paper was designed to estimate the adhesion strength of galvannealed coatings on steel sheets. The adhesion strength were evaluated using single lap - shear tests where the lap joint was bonded by structural adhesive. Tests were performed for overlap length of 5mm, 10mm and 15 mm and three directions (0, 45, 90) of steel sheets used as the adherend of the overlap joint. After the tests, FE simulations of the single lap-shear test were also carried out to observe the stress distribution in the interface between the adhesive and the coated sheet. The results showed that the joint failure loads obtained from the tensile tests of bonded single lap-joints were the same, regardless of overlap lengths and directions of steel sheets. Also, the failure of galvannealed coatings greatly depended on shear stress distribution in the interface and the value was about 30MPa.

• 한국재료학회지
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• 제26권10호
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• pp.542-548
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• 2016

The influence of NiCrAlY bond coating on the adhesion properties of an Fe thermal coating sprayed on an Al substrate was investigated. By applying a bond coat, an adhesion strength of 21MPa was obtained, which was higher than the 15.5MPa strength of the coating without the bond coat. Formation of cracks at the interface of the bond coat and the Al substrate was suppressed by applying the bond coat. Microstructural analysis of the coating interface using EBSD and TEM indicated that the dominant bonding mechanism was mechanical interlocking. Mechanical interlocking without crack defects in the coating interface may improve the adhesion strength of the coating. In conclusion, the use of an NiCrAlY bond coat is an effective method of improving the adhesion properties of thermal sprayed Fe coatings on Al substrates.

• 한국재료학회지
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• 제13권2호
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• pp.133-136
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• 2003

Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.

• 열처리공학회지
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• 제13권2호
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• pp.98-102
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• 2000

The effect of vacuum heat treatment in the thermal sprayed ceramics coating on a capstan by either high velocity oxygen fuel(HVOF) or plasma thermal spray process was investigated. The coating materials applied on the capstan were tungsten and chrome carbides. In order to characterize the interface between coating layer and bare materials, hardness, adhesion strength, X-ray diffraction(XRD) and microstructural analysis are conducted. The adhesion strength of the carbide coated materials by HVOF process is over 500MPa compared to those of plasma coating process is 230MPa. In case of the carbide coated materials by HVOF process, the adhesion strength is increased to 15MPa and the porosity is reduced under 5% by vacuum heat treatment for 5 hrs at $1000^{\circ}C$. The XRD results reveal that the increasement is believed due to the phase stabilization of metastable $Cr_3C_2$ phase to stable $Cr_{23}C_6$ phase.