• 접착 및 계면
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• 제6권4호
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• pp.12-17
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• 2005

Natural fiber/phenolic biocomposites with chopped henequen fibers treated at various levels of electron beam irradiation (EBI) were made by means of a matched-die compression molding method. The interfacial property was explored in terms of interfacial shear strength measured by a single fiber microbonding test. The thermal properties were studied in terms of storage modulus, tan ${\delta}$, thermal expansion and thermal stability measured by dynamic mechanical analysis, thermomechanical analysis and thermogravimetric analysis, respectively. The result showed that the interfacial and thermal properties depend on the treatment level of EBI done to the henequen fiber surfaces. The present result also demonstrates that 10 kGy EBI is most preferable to physically modify the henequen fiber surfaces and then to improve the interfacial property of the biocomposite, supporting earlier results studied with henequen/poly (butylene succinate) and henequen/unsaturated polyester biocomposites.

• 접착 및 계면
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• 제12권3호
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• pp.94-98
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• 2011

열경화성 및 열가소성 우레탄 수지 첨가에 따른 헤라크론/페놀수지 복합재료의 방탄성능 변화를 고찰하였다. 먼저 페놀 또는 우레탄 수지를 헤라크론 직조섬유에 스프레이 코팅하여 프리프레그를 제조하고, 이들의(페놀/우레탄) 비율을 변화시켜 16층의 복합재료를 $150^{\circ}C$에서 $150kg/cm^2$의 압력으로 25 min간 성형하여 제조하였다. 방탄성능은 1.1 g 모의파편탄(22 cal)으로 분석하였으며, 우레탄 수지의 종류 및 페놀/우레탄 프리프레그의 비율에 따른 V50 변화를 고찰하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.78-81
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• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. Surface structure and adhesion of semiconductive silicon rubber by surface asperity was obtained from SEM and T-peel test. In addition, ac breakdown test was carried out for elucidating the change of electrical property by roughness treatment. From the results, Adhesive strength of semiconductive-insulation interface was increased with surface asperity. Dielectric breakdown strength by surface asperity decreased than initial Specimen, but increased from Sand Paper #1200. According to the adhesional strength data unevenness and void formed on the silicone rubber interface expand the surface area and result in improvement of adhesion. Before treatment Sand Paper #1200, dielectric breakdown strength was decreased by unevenness and void which are causing to have electric field mitigation small. After the treatment, the effect of adhesion increased dielectric breakdown strength. It is found that ac dielectric breakdown strength was increased with improving the adhesion between the semiconductive and insulating interface.

• 접착 및 계면
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• 제4권4호
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• pp.7-14
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• 2003

택(tack)은 아주 가벼운 힘으로 단시간에 피착체와 점착하는 능력이다. 택의 측정기기 중 프로브택(probe tack)은 실험적인 영향인자를 설정할 수 있기에 택의 이론적 고찰이 유리하다. SIS계 핫멜트형 점착제(SIS-based hotmelt PSA)와 수분산성 아크릴 점착제(Water-borne acrylic PSA)를 사용하여 probe가 점착제 표면에 다가가는 속도가 택에 미치는 영향을 살펴보았다.

• 한국표면공학회지
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• 제42권1호
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• pp.21-25
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• 2009

Using an evaporation system, $SiO_2$ was deposited as a buffer layer between a PET substrate and a ITO layer and then ITO/$SiO_2$/PET layers were annealed for 1.5 hours at the temperature of $180^{\circ}C$. Adhesion and electro-optical properties of ITO films were studied with thickness variance of a $SiO_2$ buffer layer. As a result of introduction of the $SiO_2$ buffer layer, sheet resistance and resistivity increased and a ITO film with optimum sheet resistance ($529.3{\Omega}/square$) for an upper ITO film of resistive type touch panel could be obtained when $SiO_2$ of $50{\AA}$ was deposited. And it was found that ITO films with $SiO_2$ buffer layer have higher transmittance of $88{\sim}90%$ at 550 nm wavelength than ITO films with no buffer layers and the transmittance was enhanced as $SiO_2$ thickness increased from $50{\AA}$ to $100{\AA}$. Adhesion property of ITO films with $SiO_2$ buffer layers became better than ITO films with no buffer layers and this property was independent of $SiO_2$ thickness variance ($50{\sim}100{\AA}$). By depositing a $SiO_2$ buffer layer of $50{\AA}$ on the PET substrate and sputtering a ITO thin film on the layer, a ITO film with enhanced adhesion, electro-optical properties could be obtained.

• Composites Research
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• 제30권6호
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• pp.416-421
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• 2017

CFRP와 금속간의 접합공정이 개선된 구조용 접착제가 제조되었다. 구조용 접착제에 대한 경화시간, 기지재료의 표면상태 그리고 접착제의 양에 따른 최적의 접합공정 조건을 랩쉐어 실험을 통하여 파악하였다. 적합한 접합조건을 확인하기 위해 이종재료간의 접합 파단면 상태를 반사현미경을 이용하여 평가하였다. 이종재료간 접합력 향상을 위해 접착제의 개선뿐만 아니라 CFRP의 표면처리 또한 중요하였다. 구조용 접착제의 경우 180도 조건에 20분의 경화온도 조건이 최적이였으며, CFRP의 표면 처리에 따라 접합특성이 향상됨을 확인하였다. 이종재료 간 접합을 위해 구조용 접착제의 양은 $1.5{\times}10^{-3}g/mm^2$ 조건일 때 최적이었다. 접합공정의 개선 및 최적화를 통해 기존의 접착력 대비 10% 이상의 물성 강화를 나타냄을 확인하였다.

• 접착 및 계면
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• 제23권3호
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• pp.59-69
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• 2022

섬유강화 복합재료에서 가장 중요한 부분은 섬유와 수지간의 계면 접착특성이다. 본 총설에서는, 섬유강화 복합재료의 계면특성을 평가하기 위해 사용되는 미세역학 시험법에 대해 역사적 초점을 두어 서술하고자 한다. 미세역학 시험법은 섬유 한 가닥과 기지재료 간의 계면 접착특성을 전단력평가로 관측하는 재료자체의 변수만이 고려되는 평가법으로써 계면에 대한 보다 정량적인 접착특성 및 감지능을 고찰할 수 있다. 미세역학시험법을 이용한 이전의 연구와 비교적 최근 연구동향을 본 총설에서 비교 논의하며, 미세역학 실험법에 대한 응용과 앞으로의 발전을 설명하고자 한다.

• Journal of the Korean Wood Science and Technology
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• 제32권5호
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• pp.59-65
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• 2004

물고기의 공기 주머니인 부레를 말려 두었다가 물에 넣어 끓여서 만든 어교는 전통적인 방법으로 사용되고 있다. 어교의 경화시간에 따른 접착력과 접착력을 향상시키기 위한 방법으로 최적의 개방퇴적시간을 조사하여 어교의 접착특성을 연구하였다. TGA, DSC, FT-IR을 이용하여 경화 전과 후의 휘발성 물질(수분)의 변화량에 따른 어교의 경화특성과 어교의 반응성을 측정하였으며 자작나무 시편을 이용한 lap shear strength를 측정하여 경화시간과 개방퇴적시간에 따른 접착특성을 평가 하였다. 본 실험 결과 어교는 경화온도 22±1℃, 상대습도 43±2%에서 경화시간에 따른 접착력은 48시간에서 최대 강도를 나타냈으며 개방퇴적시간과 경화시간에 따른 접착력은 개방퇴적시간을 15분을 유지하고 6시간의 경화시간을 유지할 때 가장 높은 접착력을 나타냈다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.251-251
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• 2016

For several decades, industrial processes consume a huge amount of raw water for various objects that consequently results in the generation of large amounts of wastewater. Wastewaters are consisting of complex mixture of different inorganic and organic compounds and some of them can be toxic, hazardous and hard to degrade. These effluents are mainly treated by conventional technologies such are aerobic and anaerobic treatment and chemical coagulation. But, these processes are not suitable for eliminating all hazardous chemical compounds form wastewater and generate a large amount of toxic sludge. Therefore, other processes have been studied and applied together with these techniques to enhance purification results. These include photocatalysis, absorption, advanced oxidation processes, and ozonation, but also have their own drawbacks. In recent years, electrochemical techniques have received attention as wastewater treatment process that could be show higher purification results. Among them, boron doped diamond (BDD) attract attention as electrochemical electrode due to good chemical and electrochemical stability, long lifetime and wide potential window that necessary properties for anode electrode. So, there are many researches about high quality BDD on Nb, Ta, W and Si substrates, but, their application in effluents treatment is not suitable due to high cost of metal and low conductivity of Si. To solve these problems, Ti has been candidate as substrate in consideration of cost and property. But there are adhesion issues that must be overcome to apply Ti as BDD substrate. Al, Cu, Ti and Nb thin films were deposited on Ti substrate to improve adhesion between substrate and BDD thin film. In this paper, BDD films were deposited by hot filament chemical vapor deposition (HF-CVD) method. Prior to deposition, cleaning processes were conducted in acetone, ethanol, and isopropyl alcohol (IPA) using sonification machine for 7 min, respectively. And metal layer with the thickness of 200 nm were deposited by DC magnetron sputtering (DCMS). To analyze microstructure X-ray diffraction (XRD, Bruker gads) and field emission scanning electron microscopy (FE-SEM, Hitachi) were used. It is confirmed that metal layer was effective to adhesion property and improved electrode property. Electrochemical measurements were carried out in a three electrode electrochemical cell containing a 0.5 % H2SO4 in deionized water. As a result, it is confirmed that metal inter layer heavily effect on BDD property by improving adhesion property due to suppressing formation of titanium carbide.

• 한국표면공학회지
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• 제28권5호
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• pp.267-275
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• 1995

Electron beam can provide convenient way to heat the substrate during Hollow Cathode Discharge (HCD) ion plating of Ti(C, N)films. Densification of columnar structrue is enhanced by longer duration of electron beam heating(EBH). While strong(111) texture is identified always to be formed, the amount of (200) oriented grains which coherently interfaced with carbide particles of the substrate increased with heating(EBH). In turns, these crystallogaphical change lead to the increase of micro hardness and adhesion of coating. Adhesion of Ti(C, N) films increased more dramatically in case of ASP30 substrate of which carbide particles dispersed more finely than M42. Therefore, it could be concluded that both the density of film and interfacial structure can affect the adhesion property. Overheating of substrate could be resulted in low adhesion resistance due to high residual stress developed in the film.