• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.781-784
• /
• 2002

Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. For the purpose of microassembly, theoretical understanding is required for the Adhesion phenomenon. Authors have developed a force measurement system in an ultra-high vacuum chamber of Auger electron spectroscopy. The force between arbitrary combination of materials can be measured at a pressure less than 100 nPa after and before Ar ion sputtering and chemical analysis for several atomic layers of the surface. The results are successfully interpreted with a theory of contact mechanics. Since surface energy is quite important in the interpretation, electronic theory is used to evaluate the surface energy. In the manipulation of small objects, the adhesional force is always attractive. Repulsive force is essential for the manipulation. It can be generated by Coulomb interaction. The voltage required for detachment is theoretically analyzed and the effect of boundary conditions on the detachment is obtained. The possibility and limitations of micro-manipulation using both the adhesion phenomenon and Coulomb interaction are theoretically clarified. Its applicability to nano-technology is found to be expected.

• Proceedings of the KIPE Conference
• /
• 2004.07b
• /
• pp.891-894
• /
• 2004

This paper estimate coefficient of adhesion through speed sensor-less vector control and load torque disturbance observer used for maximum tractive force control. And also proposes anti-slip control algorithm, which controls torque force of motor in order to keep the estimated adhesion force in maximum adhesion by controlling PI torque with the differential value of estimated adhesion force coefficient.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2003.10a
• /
• pp.367-370
• /
• 2003

In this study, application of SAM (self-assembled monolayer) to nano replication process as an anti-adhesion layer was presented to reduce the surface energy between the nano mold and the replicated polymeric nano patterns. The electron beam lithography was used for master nano patterns and the electorforming process was used to fabricate the nickel nano stamper. Alkanethiol SAM as an anti-adhesion layer was deposited on metallic nano stamper using solution deposition method. To analyze wettability and adhesion force of SAM, contact angle and LFM (Lateral Force Microscopy) were measured at the actual processing temperature and pressure for the case of nano compression molding and at the actual UV dose for the case of nano UV molding. It was found that the surface energy due to SAM deposition on the nickel nano stamper markedly decreased and the quality of SAM on the nickel stamper maintained under the actual molding environments.

• Proceedings of the KIEE Conference
• /
• 2005.07d
• /
• pp.2649-2651
• /
• 2005

In trains driven by electric motor, when the adhesion force between rail and driving wheel decreases suddenly, the electric motor coach has slip phenomena. The characteristics of adhesion force coefficient are strongly affected by the conditions between rails and driving wheels, such as moisture, dust, and oil on the rails and so on. This paper proposes the vector control structure for the improved re-adhesion control with paralleled control of induction motors under the sudden variation of the adhesion force.

• Proceedings of the KIEE Conference
• /
• 2006.07d
• /
• pp.1879-1880
• /
• 2006

In electric motor coaches, when the adhesion force between rail and driving wheel decreases suddenly, the electric motor coach has slip phenomena. The characteristics of adhesion force coefficient is strongly affected by the conditions between rails and driving wheels, such as moisture, dust, and oil on the rails and so on. This paper proposes the simulation system for slip & slide test using virtual train. We can easily research the adhesion characteristics and adhesion control method with this equipment under the sudden variation of the adhesion force coefficient.

• Korean Journal of Materials Research
• /
• v.19 no.8
• /
• pp.437-442
• /
• 2009

This paper describes an improved strategy for controlling the adhesion force using both the antiadhesion and adhesion layers for a successful large-area transfer process. An MPTMS (3-mercaptopropyltrimethoxysilane) monolayer as an adhesion layer for Au/Pd thin films was deposited on Si substrates by vapor self assembly monolayer (VSAM) method. Contact angle, surface energy, film thickness, friction force, and roughness were considered for finding the optimized conditions. The sputtered Au/Pd ($\sim$17 nm) layer on the PDMS stamp without the anti-adhesion layer showed poor transfer results due to the high adhesion between sputtered Au/Pd and PDMS. In order to reduce the adhesion between Au/Pd and PDMS, an anti-adhesion monolayer was coated on the PDMS stamp using FOTS (perfluorooctyltrichlorosilane) after $O_2$ plasma treatment. The transfer process with the anti-adhesion layer gave good transfer results over a large area (20 mm $\times$ 20 mm) without pattern loss or distortion. To investigate the applied pressure effect, the PDMS stamp was sandwiched after 90$^{\circ}$ rotation on the MPTMS-coated patterned Si substrate with 1-${\mu}m$ depth. The sputtered Au/Pd was transferred onto the contact area, making square metal patterns on the top of the patterned Si structures. Applying low pressure helped to remove voids and to make conformal contact; however, high pressure yielded irregular transfer results due to PDMS stamp deformation. One of key parameters to success of this transfer process is the controllability of the adhesion force between the stamp and the target substrate. This technique offers high reliability during the transfer process, which suggests a potential building method for future functional structures.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.364-365
• /
• 2005

This paper report nanotribological behavior between Si tip and Cu wafer surfaces which was treated various concentration of $H_2O_2$. This experimental approach has proven atomic level insight into Cu CMP. It has been used to study interfacial friction and adhesion force between Si tip and Cu wafer surfaces in air by atomic force microscopy (AFM). Adhesion force of Cu surfaces which was pre-cleaned in diluted HF solution was lager than Cu oxide surfaces. Adhesion force of Cu oxide surface was saturated around 7 nN. Slope of normal force vs lateral signal was increased as increasing concentration of $H_2O_2$ and it was saturated around 24. Friction force of Cu oxide was lager than Cu.

• Journal of the Semiconductor & Display Technology
• /
• v.18 no.1
• /
• pp.25-31
• /
• 2019

In this study, a new adhesion evaluating equipment and data processing methods were developed to overcome some limitations of existing evaluating equipment. Nano-diamond coated tool is a specimen of experiment. When applying frictional force and shear force on the specimen by a rotating polishing pad, delamination occurs at a moment. During each experiment, the vibration, load, and torque is obtained by accelerometer, loadcell and torque s+ kpensor. Frictional force and coefficient of friction are obtained by calculating torque and load. Based on FFT transformation, acceleration is processed and analyzed. As a result, the moment of delamination and the load at that time can be detected by the new developed equipment and measurement system. Finally, we call this load as an Adhesion force.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
• /
• 2003.11a
• /
• pp.368-376
• /
• 2003

In this research, DLC thin films are produced as several hundred nm thickness by PE-CVD method. And then these thin films are estimated tribological characteristics to find out useful possibilities as a protecting film for high-quality function and life extension at MEMs by mechanical properties observation . These are measured thickness and residual stress of DLC coating. Compared after measuring friction coefficient, adhesion force, hardness, cohesive force of coating films. As results all test, we can decide several conclusions. First, friction coefficient decreased, as the load increased. otherwise, friction coefficient increased, as thickness of coating film increased under low load$(1\~50mN)$. Secod, adhesion force increased as thickness of coating films. Third, hardness of coating film is affected by substrate coating film when it is less than thickness of 300nm and it has general hardness of DLC coating film when it is more than thickness of 500nm. Fourth, cohesive force of coating film is complexly affected by hardness, adhesion force, residual stress, etc.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07b
• /
• pp.1292-1295
• /
• 2004

본 연구는 Cu CMP공정 중 알루미나 연마입자의 wafer 표면에서의 점착과 오염을 AFM (Atomic Force Microscopy)을 사용하여 슬러리내에서 점착력 측정과 실제 연마 후 wafer 표면의 오염을 실험적으로 비교 평가하였다. 연마입자의 adhesionn force 측정에 있어서도 역시 wafer들의 zetapotential 결과와 잘 일치하였으며, 모든 wafer 종류에 관계없이, 산성 영역에서 염기성영역의 슬러리가 적용됨에 따라 adhesion force가 작아짐을 확인할 수 있었다. 특히 FSG wafer의 zetapotential 결과는 비록 산성 분위기에서는 양성 전하값을 나타내었으나, 염기성 분위기의 pH에서는 급격하게 음성 전하값을 나타내었고, 이는 adhesionn force결과와 FESEM 결과와 잘 일치하였다.