• Journal of the Korean Ceramic Society
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• v.39 no.8
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• pp.715-720
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• 2002

Silicon nitride samples with aligned whisker seeds were prepared with different amounts of yttria and alumina as the sintering additives. Their sintering behaviors and the microstructural developments between 2123K and 2323K were examined. The sample with larger amount of the sintering additives showed faster densification and grain growth. Even though addition of the aligned whisker seeds slightly retarded densification of silicon nitride, it improved the flexural strength and the fracture toughness. Both the flexural strength and the fracture toughness of silicon nitride with the aligned whisker seeds were increased as the amount of the sintering additives was increased.

• Journal of the Korean institute of surface engineering
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• v.43 no.1
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• pp.1-6
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• 2010

The effect of organic additives, 1-(3-sulfoproyl)-2-vinylpyridineium hydroxide (SVH) and thiourea (TU), on the precision copper electrodeposition was investigated with optical, electrochemical and x-ray diffraction techniques. It was found that SVH played a r ole as a n accelerator and TU as an i nhibitor during the electroreduction of cupric ions in acidic Cu electroplating solution. Through electrochemical measurements, TU showed more strong interaction with cupric ions than SVH and dominated overall Cu electroplating process when both additives were present in the solution. In the case of three dimensional Cu electrodeposition on the 20 ${\mu}m$-patterned Ni substrates, SVH controlled the upright growth of Cu electrodeposits and so determined its flatness, while TU prohibited the lateral spreading of Cu in the course of pulse-reverse pulse current adaptation. With microscopic observation, we obtained the optimum organic additives composition, that is, 100 ppm SVH and 200 ppm TU during the current pulsation.

• Journal of the Korean institute of surface engineering
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• v.43 no.6
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• pp.297-303
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• 2010

The effect of solution acidity and organic additives, polyethylene glycol (PEG), on the trivalent chromium electroplating was systematically investigated in the view point of electroreduction of trivalent chromium ions and solution stability. It was found that solution acidity controlled at pH 2.5 showed the widest current range for bright electrodeposits in the presence of PEG additives, which reduced the local current intensification at high current densities. Through complex interaction between PEG additives and hydrogen ion, that is, solution acidity, electrode potential was moved in the negative direction in the bulk solution, while it shifted in the positive when electric potential was scanned. In conjunction with electrochemical quartz crystal microbalance (EQCM), it was found that PEG additives had a role in promoting the electron transfer to trivalent chromium ion complexes in bulk solution and their adsorption at the electrode surface as well as interfering with hydrogen ion reduction process below pH 2.5. The PEG additives developed the nodular morphology during electroreduction of trivalent chromium ions with the increase of solution acidity and enhanced its current efficiency by maintaining the consumption of complexant, formic acid, at low speed.

• Korean Journal of Community Nutrition
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• v.15 no.2
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• pp.240-252
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• 2010

The purpose of this research was to develop risk communication (RC) strategy and educational web-site on food additives for elementary students and their parents to improve their perception on food additives and dietary life. First of all, a survey was conducted from 1,200 elementary children and their parents to diagnose the perception and information needs on food additives. The survey revealed that most children and their parents did not have enough knowledge on food additives and demanded the safety information on food additives. Second, previous researches on food communication were analyzed to develop a risk communication model, and it was directly applied in this study. Third, a web site (www.foodnara.go.kr/foodaddy) was developed to upload the education materials along with up-to-date information and classroom activities for teachers on food additives. Fourth, the developed homepage was evaluated by applying to about 100 children and parents each, and majority of them showed high levels of understanding (children 85.7%, parents 79%) and satisfaction (children 77.2%, parents 64%), and the effect of getting over the prejudice against food additives was observed. The RC model developed in this study could be applied to any food risk communication, and the content and materials in this web site including booklets, animations, and quiz could be used effectively to promote the communication on food additives. In the future, it will be necessary to advertise the web site to be utilized by various consumer levels and to update the contents continuously by developing consumer-friendly communication materials.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.544-547
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• 2004

Glass frits for dielectric layers are mostly used for screen printing process. Several additives have already been known to be well matched with lead-oxide glasses system. The use of lead oxide, however, creates environmental problems, so many recent studies on lead-free glasses compositions have been carried out. A study of the suitability between additives and lead-free glass system is needed. In this study, we have used a screen-printing method to make thick films of lead-oxide glass and lead-free glass using different additives, and analyzed and compared the transmittance of the thick films.

• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.302-304
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• 1997

Chemical structure and electrical properties such as water treeing and space charge accumulation of various raw materials(XLPE) used for power cable insulation were investigated. It was found that chemical structure was changed after crosslinking reaction and every materials have different amounts of DCP and antioxidant. Electrical properties were also changed after extraction using $CHCl_3$ and xylene. Water tree length was smaller with additives such as DCP and antioxidant and bigger with low molecular weight components of polyethylene than that of extracted samples. Heterocharge was changed into homocharge after extraction. This shows that additives and low molecular weight components of polyethylene cause the heterocharge.

• Transactions of the Korean hydrogen and new energy society
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• v.18 no.4
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• pp.365-373
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• 2007

We optimized the compositions of electrolyte and additives for anode in Ni-MH battery to improve the electrode characteristics at ambient and low temperatures using response surface method(RSM). Among various additives for anode, PTFE exhibited the greatest influence on the discharge capacity of the anode. Through response optimization process, we found the optimum composition of the additives to exhibit the greatest discharge capacity. When the amount of additives was too small, the anode was degraded with time due to the low binding strength among alloy powders and the resultant separation of powders from the current collector. In contrast, the addition of large amount of the additives increased in the resistance of the electrode. In addition, the discharge capacity of the anode at $-18^{\circ}C$ increased with decreasing the concentration of KOH, NaOH and LiOH in design range of electrolyte. The resistance and viscosity of electrolyte appear to affect the discharge capacity of the anode at low temperature.

• Journal of Ocean Engineering and Technology
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• v.23 no.5
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• pp.32-38
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• 2009

Silicon nitride samples with aligned whisker seeds were prepared with different amounts of yttria and alumina as the sintering additives. Their sintering behaviors and the microstructural developments between $1850^{\circ}C$ and $2050^{\circ}C$ were examined. The sample with larger amount of the sintering additives showed faster densification and grain growth. Even though addition of the aligned whisker seeds slightly retarded densification of silicon nitride, it improved the flexural strength and the fracture toughness. Both the flexural strength and the fracture toughness of silicon nitride with the aligned whisker seeds were increased as the amount of the sintering additives was increased.

• Korean Journal of Materials Research
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• v.16 no.12
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• pp.725-730
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• 2006

The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 $mA/cm^2$ under galvanostatic mode for 60 seconds has a minimum value of 0.136 ${\mu}$m when adding 2 ppm of arabic gum.

• Nuclear Engineering and Technology
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• v.55 no.3
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• pp.1191-1198
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• 2023

Bentonite buffer material is a critical component in an engineered barrier system (EBS) for disposing high-level radioactive waste (HLW). The bentonite buffer material protects the disposal canister from groundwater penetration and releases decay heat to the surrounding rock mass; thus, it should possess high thermal conductivity, low hydraulic conductivity, and moderate swelling pressure to safely dispose the HLWs. Bentonite clay is a suitable buffer material because it satisfies the safety criteria. Several additives have been suggested as mixtures with bentonite to increase the thermal-hydraulic-mechanical-chemical (THMC) properties of bentonite buffer materials. Therefore, this study investigated the geotechnical, mineralogical, and THMC properties of several candidate additives such as sand, graphite, granite, and SiC powders. Datasets obtained in this study can be used to select adequate additives to improve the THMC properties of the buffer material.